NL1020634C2 - Werkwijze voor het passiveren van een halfgeleider substraat. - Google Patents

Werkwijze voor het passiveren van een halfgeleider substraat. Download PDF

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Publication number
NL1020634C2
NL1020634C2 NL1020634A NL1020634A NL1020634C2 NL 1020634 C2 NL1020634 C2 NL 1020634C2 NL 1020634 A NL1020634 A NL 1020634A NL 1020634 A NL1020634 A NL 1020634A NL 1020634 C2 NL1020634 C2 NL 1020634C2
Authority
NL
Netherlands
Prior art keywords
substrate
plasma
range
treatment chamber
source
Prior art date
Application number
NL1020634A
Other languages
English (en)
Dutch (nl)
Inventor
Martin Dinant Bijker
Franciscus Cornelius Dings
Wilhelmus Mathijs Mari Kessels
Michael Adrianus Theodo Hompus
Mauritius Cornelius Mar Sanden
Original Assignee
Otb Group Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Otb Group Bv filed Critical Otb Group Bv
Priority to NL1020634A priority Critical patent/NL1020634C2/nl
Priority to TW092113743A priority patent/TWI252523B/zh
Priority to EP03076530A priority patent/EP1365042A1/en
Priority to JP2003143908A priority patent/JP4441607B2/ja
Priority to KR1020030032409A priority patent/KR101056300B1/ko
Priority to US10/452,929 priority patent/US6946404B2/en
Application granted granted Critical
Publication of NL1020634C2 publication Critical patent/NL1020634C2/nl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/34—Nitrides
    • C23C16/345—Silicon nitride
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/513—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using plasma jets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/30—Coatings
    • H10F77/306—Coatings for devices having potential barriers
    • H10F77/311—Coatings for devices having potential barriers for photovoltaic cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/30—Coatings
    • H10F77/306—Coatings for devices having potential barriers
    • H10F77/311—Coatings for devices having potential barriers for photovoltaic cells
    • H10F77/315—Coatings for devices having potential barriers for photovoltaic cells the coatings being antireflective or having enhancing optical properties
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/958—Passivation layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Photovoltaic Devices (AREA)
  • Formation Of Insulating Films (AREA)
NL1020634A 2002-05-21 2002-05-21 Werkwijze voor het passiveren van een halfgeleider substraat. NL1020634C2 (nl)

Priority Applications (6)

Application Number Priority Date Filing Date Title
NL1020634A NL1020634C2 (nl) 2002-05-21 2002-05-21 Werkwijze voor het passiveren van een halfgeleider substraat.
TW092113743A TWI252523B (en) 2002-05-21 2003-05-21 Method for passivating a semiconductor substrate
EP03076530A EP1365042A1 (en) 2002-05-21 2003-05-21 Method for passivating a semiconductor substrate
JP2003143908A JP4441607B2 (ja) 2002-05-21 2003-05-21 半導体基板を不動態化する方法
KR1020030032409A KR101056300B1 (ko) 2002-05-21 2003-05-21 반도체 기질을 부동태화하는 방법
US10/452,929 US6946404B2 (en) 2002-05-21 2003-06-03 Method for passivating a semiconductor substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1020634A NL1020634C2 (nl) 2002-05-21 2002-05-21 Werkwijze voor het passiveren van een halfgeleider substraat.
NL1020634 2002-05-21

Publications (1)

Publication Number Publication Date
NL1020634C2 true NL1020634C2 (nl) 2003-11-24

Family

ID=29398575

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1020634A NL1020634C2 (nl) 2002-05-21 2002-05-21 Werkwijze voor het passiveren van een halfgeleider substraat.

Country Status (6)

Country Link
US (1) US6946404B2 (enExample)
EP (1) EP1365042A1 (enExample)
JP (1) JP4441607B2 (enExample)
KR (1) KR101056300B1 (enExample)
NL (1) NL1020634C2 (enExample)
TW (1) TWI252523B (enExample)

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US7198832B2 (en) 1999-10-25 2007-04-03 Vitex Systems, Inc. Method for edge sealing barrier films
US6623861B2 (en) 2001-04-16 2003-09-23 Battelle Memorial Institute Multilayer plastic substrates
US20090191342A1 (en) * 1999-10-25 2009-07-30 Vitex Systems, Inc. Method for edge sealing barrier films
US20100330748A1 (en) 1999-10-25 2010-12-30 Xi Chu Method of encapsulating an environmentally sensitive device
US6866901B2 (en) * 1999-10-25 2005-03-15 Vitex Systems, Inc. Method for edge sealing barrier films
US6413645B1 (en) 2000-04-20 2002-07-02 Battelle Memorial Institute Ultrabarrier substrates
US20070196682A1 (en) * 1999-10-25 2007-08-23 Visser Robert J Three dimensional multilayer barrier and method of making
US20090208754A1 (en) * 2001-09-28 2009-08-20 Vitex Systems, Inc. Method for edge sealing barrier films
US8808457B2 (en) 2002-04-15 2014-08-19 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US8900366B2 (en) * 2002-04-15 2014-12-02 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
NL1020923C2 (nl) * 2002-06-21 2003-12-23 Otb Group Bv Werkwijze alsmede inrichting voor het vervaardigen van een katalysator.
US7648925B2 (en) * 2003-04-11 2010-01-19 Vitex Systems, Inc. Multilayer barrier stacks and methods of making multilayer barrier stacks
US7510913B2 (en) * 2003-04-11 2009-03-31 Vitex Systems, Inc. Method of making an encapsulated plasma sensitive device
NL1025096C2 (nl) * 2003-12-21 2005-06-23 Otb Group Bv Werkwijze alsmede inrichting voor het vervaardigen van een functionele laag bestaande uit ten minste twee componenten.
NL1029647C2 (nl) * 2005-07-29 2007-01-30 Otb Group Bv Werkwijze voor het passiveren van ten minste een deel van een substraatoppervlak.
US7767498B2 (en) 2005-08-25 2010-08-03 Vitex Systems, Inc. Encapsulated devices and method of making
DE102006043943A1 (de) * 2006-09-14 2008-03-27 Leybold Optics Gmbh Verfahren zum Aufbringen von Schichten auf Substraten mit gekrümmten Oberflächen
USH2207H1 (en) * 2007-01-05 2007-12-04 Bijker Martin D Additional post-glass-removal processes for enhanced cell efficiency in the production of solar cells
JP5095524B2 (ja) * 2008-06-26 2012-12-12 株式会社ユーテック プラズマｃｖｄ装置及び磁気記録媒体の製造方法
US7915154B2 (en) 2008-09-03 2011-03-29 Piwczyk Bernhard P Laser diffusion fabrication of solar cells
EP2365534A4 (en) * 2008-12-02 2014-04-02 Mitsubishi Electric Corp METHOD FOR PRODUCING A SOLAR BATTERY CELL
US9184410B2 (en) * 2008-12-22 2015-11-10 Samsung Display Co., Ltd. Encapsulated white OLEDs having enhanced optical output
US9337446B2 (en) * 2008-12-22 2016-05-10 Samsung Display Co., Ltd. Encapsulated RGB OLEDs having enhanced optical output
US20100167002A1 (en) * 2008-12-30 2010-07-01 Vitex Systems, Inc. Method for encapsulating environmentally sensitive devices
DE102009036982A1 (de) 2009-08-12 2011-02-17 Q-Cells Se Verfahren und Vorrichtung zur plasmaunterstützten Gasphasenabscheidung für photovoltaisches Element
US8590338B2 (en) * 2009-12-31 2013-11-26 Samsung Mobile Display Co., Ltd. Evaporator with internal restriction
US20120235274A1 (en) * 2011-03-14 2012-09-20 Doyle Brian S Semiconductor structure having an integrated double-wall capacitor for embedded dynamic random access memory (edram) and method to form the same

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Also Published As

Publication number Publication date
TW200400552A (en) 2004-01-01
JP4441607B2 (ja) 2010-03-31
US20040029334A1 (en) 2004-02-12
US6946404B2 (en) 2005-09-20
JP2005005280A (ja) 2005-01-06
TWI252523B (en) 2006-04-01
KR20030091733A (ko) 2003-12-03
KR101056300B1 (ko) 2011-08-11
EP1365042A1 (en) 2003-11-26

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Legal Events

Date Code Title Description
PD2B A search report has been drawn up
SD Assignments of patents

Owner name: OTB SOLAR B.V.

Effective date: 20091022

MM Lapsed because of non-payment of the annual fee

Effective date: 20180601