MY181562A - Black color surface-treated copper foil, method of manufacturing black color surface-treated copper foil, copper-clad laminate and flexible printed wiring board - Google Patents

Black color surface-treated copper foil, method of manufacturing black color surface-treated copper foil, copper-clad laminate and flexible printed wiring board

Info

Publication number
MY181562A
MY181562A MYPI2015702425A MYPI2015702425A MY181562A MY 181562 A MY181562 A MY 181562A MY PI2015702425 A MYPI2015702425 A MY PI2015702425A MY PI2015702425 A MYPI2015702425 A MY PI2015702425A MY 181562 A MY181562 A MY 181562A
Authority
MY
Malaysia
Prior art keywords
copper foil
black color
wiring board
printed wiring
color surface
Prior art date
Application number
MYPI2015702425A
Other languages
English (en)
Inventor
Misato Mizoguchi
Shinichi Obata
Ayumu Tateoka
Shinya Hiraoka
Takashi Hashiguchi
Original Assignee
Mitsui Mining & Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=51428422&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MY181562(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Mitsui Mining & Smelting Co Ltd filed Critical Mitsui Mining & Smelting Co Ltd
Publication of MY181562A publication Critical patent/MY181562A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/028—Electroplating of selected surface areas one side electroplating, e.g. substrate conveyed in a bath with inhibited background plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0692—Regulating the thickness of the coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • ing And Chemical Polishing (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
MYPI2015702425A 2013-02-28 2014-02-28 Black color surface-treated copper foil, method of manufacturing black color surface-treated copper foil, copper-clad laminate and flexible printed wiring board MY181562A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013039388 2013-02-28
PCT/JP2014/055173 WO2014133164A1 (ja) 2013-02-28 2014-02-28 黒色化表面処理銅箔、黒色化表面処理銅箔の製造方法、銅張積層板及びフレキシブルプリント配線板

Publications (1)

Publication Number Publication Date
MY181562A true MY181562A (en) 2020-12-29

Family

ID=51428422

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015702425A MY181562A (en) 2013-02-28 2014-02-28 Black color surface-treated copper foil, method of manufacturing black color surface-treated copper foil, copper-clad laminate and flexible printed wiring board

Country Status (6)

Country Link
JP (1) JP5705381B2 (ko)
KR (2) KR20150090265A (ko)
CN (1) CN105008593B (ko)
MY (1) MY181562A (ko)
TW (1) TWI690625B (ko)
WO (1) WO2014133164A1 (ko)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101895256B1 (ko) * 2014-09-02 2018-09-05 미쓰이금속광업주식회사 흑색화 표면 처리 동박 및 캐리어박 부착 동박
WO2016093109A1 (ja) * 2014-12-08 2016-06-16 三井金属鉱業株式会社 プリント配線板の製造方法
CN107002265B (zh) * 2015-01-22 2019-04-26 三井金属矿业株式会社 带载体的极薄铜箔及其制造方法
JP6487704B2 (ja) 2015-02-12 2019-03-20 福田金属箔粉工業株式会社 処理銅箔及び該処理銅箔を用いた銅張積層板並びにプリント配線板
CN107429417B (zh) * 2015-03-31 2019-11-22 三井金属矿业株式会社 粗糙化处理铜箔、带载体铜箔、覆铜层叠板及印刷电路板
JP2017014608A (ja) * 2015-07-06 2017-01-19 古河電気工業株式会社 電解銅箔、リチウムイオン二次電池用負極電極及びリチウムイオン二次電池、プリント配線板並びに電磁波シールド材
US9397343B1 (en) 2015-10-15 2016-07-19 Chang Chun Petrochemical Co., Ltd. Copper foil exhibiting anti-swelling properties
JP6945523B2 (ja) * 2016-04-14 2021-10-06 三井金属鉱業株式会社 表面処理銅箔、キャリア付銅箔、並びにそれらを用いた銅張積層板及びプリント配線板の製造方法
CN106229344B (zh) 2016-08-19 2019-10-15 京东方科技集团股份有限公司 薄膜晶体管、其制备方法及显示装置
KR102180926B1 (ko) 2017-06-28 2020-11-19 에스케이넥실리스 주식회사 우수한 작업성 및 충방전 특성을 갖는 동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법
TWI694176B (zh) * 2018-08-10 2020-05-21 南韓商Ｋｃｆ科技有限公司 具有較佳工作性及充放電特性之銅箔、包含其之電極、包含其之二次電池及其製造方法
CN111058063B (zh) * 2018-10-16 2021-02-02 长春石油化学股份有限公司 电解铜箔、包含其的电极、及包含其的锂离子电池
US11365486B2 (en) 2018-10-16 2022-06-21 Chang Chun Petrochemical Co., Ltd. Electrolytic copper foil, electrode comprising the same, and lithium ion battery comprising the same
JP7352939B2 (ja) * 2019-05-09 2023-09-29 ナミックス株式会社 複合銅部材
JP7409602B2 (ja) * 2019-05-09 2024-01-09 ナミックス株式会社 複合銅部材
JP7456578B2 (ja) * 2019-05-09 2024-03-27 ナミックス株式会社 銅表面の加工装置
WO2022202541A1 (ja) 2021-03-26 2022-09-29 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
WO2022202540A1 (ja) 2021-03-26 2022-09-29 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
KR20230161954A (ko) 2021-03-29 2023-11-28 미쓰이금속광업주식회사 조화 처리 구리박, 동장 적층판 및 프린트 배선판
KR20230141859A (ko) 2021-03-29 2023-10-10 미쓰이금속광업주식회사 조화 처리 구리박, 동장 적층판 및 프린트 배선판
CN115135043B (zh) * 2022-07-18 2023-03-07 东莞市国盈电子有限公司 一种传感器线路板及其制造工艺

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JP3306404B2 (ja) * 2000-01-28 2002-07-24 三井金属鉱業株式会社 表面処理銅箔の製造方法及びその製造方法で得られた表面処理銅箔を用いた銅張積層板
JP2004263300A (ja) * 2003-02-12 2004-09-24 Furukawa Techno Research Kk ファインパターンプリント配線用銅箔とその製造方法
JP2004256832A (ja) * 2003-02-24 2004-09-16 Mitsui Mining & Smelting Co Ltd 黒色化処理面を備える表面処理銅箔及びその表面処理銅箔を用いたプラズマディスプレイの前面パネル用の磁気遮蔽導電性メッシュ
TW200535259A (en) * 2004-02-06 2005-11-01 Furukawa Circuit Foil Treated copper foil and circuit board
JP4354955B2 (ja) * 2004-02-17 2009-10-28 日鉱金属株式会社 黒化処理面又は層を有する銅箔
US6979627B2 (en) 2004-04-30 2005-12-27 Freescale Semiconductor, Inc. Isolation trench
JP2006210689A (ja) * 2005-01-28 2006-08-10 Fukuda Metal Foil & Powder Co Ltd 高周波プリント配線板用銅箔及びその製造方法
KR100965441B1 (ko) * 2005-04-04 2010-06-24 우베 고산 가부시키가이샤 구리박 적층 기판
TW200738913A (en) * 2006-03-10 2007-10-16 Mitsui Mining & Smelting Co Surface treated elctrolytic copper foil and process for producing the same
JP4958045B2 (ja) 2006-10-27 2012-06-20 三井金属鉱業株式会社 フレキシブル銅張積層板製造用の表面処理銅箔及びその表面処理銅箔を用いて得られるフレキシブル銅張積層板
JP2009004423A (ja) * 2007-06-19 2009-01-08 Hitachi Cable Ltd キャリア箔付き銅箔
JP5256747B2 (ja) * 2008-01-21 2013-08-07 宇部興産株式会社 セミアディティブ法による銅配線絶縁フィルムの製造法、及びこれらから製造された銅配線絶縁フィルム
WO2010046804A2 (en) * 2008-10-21 2010-04-29 Alembic Limited A process for preparation of losartan potassium form i
TWI525221B (zh) * 2010-10-06 2016-03-11 Furukawa Electric Co Ltd Copper foil and its manufacturing method, carrier copper foil and its manufacturing method, printed circuit board and multilayer printed circuit board

Also Published As

Publication number Publication date
CN105008593A (zh) 2015-10-28
TW201447051A (zh) 2014-12-16
KR20150090265A (ko) 2015-08-05
TWI690625B (zh) 2020-04-11
KR20160135369A (ko) 2016-11-25
WO2014133164A1 (ja) 2014-09-04
KR102116928B1 (ko) 2020-05-29
CN105008593B (zh) 2018-08-24
JP5705381B2 (ja) 2015-04-22
JPWO2014133164A1 (ja) 2017-02-09

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