JP5705381B2 - 黒色化表面処理銅箔、黒色化表面処理銅箔の製造方法、銅張積層板及びフレキシブルプリント配線板 - Google Patents

黒色化表面処理銅箔、黒色化表面処理銅箔の製造方法、銅張積層板及びフレキシブルプリント配線板 Download PDF

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Publication number
JP5705381B2
JP5705381B2 JP2014532134A JP2014532134A JP5705381B2 JP 5705381 B2 JP5705381 B2 JP 5705381B2 JP 2014532134 A JP2014532134 A JP 2014532134A JP 2014532134 A JP2014532134 A JP 2014532134A JP 5705381 B2 JP5705381 B2 JP 5705381B2
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JP
Japan
Prior art keywords
copper foil
wiring board
printed wiring
flexible printed
black
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Active
Application number
JP2014532134A
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English (en)
Japanese (ja)
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JPWO2014133164A1 (ja
Inventor
美智 溝口
美智 溝口
小畠　真一
真一 小畠
歩 立岡
歩 立岡
慎哉 平岡
慎哉 平岡
隆司 橋口
隆司 橋口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Mining and Smelting Co Ltd
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Mitsui Mining and Smelting Co Ltd
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Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Priority to JP2014532134A priority Critical patent/JP5705381B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/028—Electroplating of selected surface areas one side electroplating, e.g. substrate conveyed in a bath with inhibited background plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0692—Regulating the thickness of the coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Structure Of Printed Boards (AREA)
  • ing And Chemical Polishing (AREA)
JP2014532134A 2013-02-28 2014-02-28 黒色化表面処理銅箔、黒色化表面処理銅箔の製造方法、銅張積層板及びフレキシブルプリント配線板 Active JP5705381B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014532134A JP5705381B2 (ja) 2013-02-28 2014-02-28 黒色化表面処理銅箔、黒色化表面処理銅箔の製造方法、銅張積層板及びフレキシブルプリント配線板

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013039388 2013-02-28
JP2013039388 2013-02-28
JP2014532134A JP5705381B2 (ja) 2013-02-28 2014-02-28 黒色化表面処理銅箔、黒色化表面処理銅箔の製造方法、銅張積層板及びフレキシブルプリント配線板
PCT/JP2014/055173 WO2014133164A1 (ja) 2013-02-28 2014-02-28 黒色化表面処理銅箔、黒色化表面処理銅箔の製造方法、銅張積層板及びフレキシブルプリント配線板

Publications (2)

Publication Number Publication Date
JP5705381B2 true JP5705381B2 (ja) 2015-04-22
JPWO2014133164A1 JPWO2014133164A1 (ja) 2017-02-09

Family

ID=51428422

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014532134A Active JP5705381B2 (ja) 2013-02-28 2014-02-28 黒色化表面処理銅箔、黒色化表面処理銅箔の製造方法、銅張積層板及びフレキシブルプリント配線板

Country Status (6)

Country Link
JP (1) JP5705381B2 (ko)
KR (2) KR102116928B1 (ko)
CN (1) CN105008593B (ko)
MY (1) MY181562A (ko)
TW (1) TWI690625B (ko)
WO (1) WO2014133164A1 (ko)

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KR101895256B1 (ko) * 2014-09-02 2018-09-05 미쓰이금속광업주식회사 흑색화 표면 처리 동박 및 캐리어박 부착 동박
CN107003257B (zh) * 2014-12-08 2020-07-03 三井金属矿业株式会社 印刷板线路板的制造方法
KR102031065B1 (ko) * 2015-01-22 2019-10-11 미쓰이금속광업주식회사 캐리어 부착 극박 동박 및 그 제조 방법, 동장 적층판, 및 프린트 배선판의 제조 방법
JP6487704B2 (ja) 2015-02-12 2019-03-20 福田金属箔粉工業株式会社 処理銅箔及び該処理銅箔を用いた銅張積層板並びにプリント配線板
CN107429417B (zh) * 2015-03-31 2019-11-22 三井金属矿业株式会社 粗糙化处理铜箔、带载体铜箔、覆铜层叠板及印刷电路板
JP2017014608A (ja) * 2015-07-06 2017-01-19 古河電気工業株式会社 電解銅箔、リチウムイオン二次電池用負極電極及びリチウムイオン二次電池、プリント配線板並びに電磁波シールド材
US9397343B1 (en) 2015-10-15 2016-07-19 Chang Chun Petrochemical Co., Ltd. Copper foil exhibiting anti-swelling properties
MY186859A (en) * 2016-04-14 2021-08-26 Mitsui Mining & Smelting Co Ltd Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same
CN106229344B (zh) 2016-08-19 2019-10-15 京东方科技集团股份有限公司 薄膜晶体管、其制备方法及显示装置
KR102180926B1 (ko) 2017-06-28 2020-11-19 에스케이넥실리스 주식회사 우수한 작업성 및 충방전 특성을 갖는 동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법
TWI694176B (zh) * 2018-08-10 2020-05-21 南韓商Ｋｃｆ科技有限公司 具有較佳工作性及充放電特性之銅箔、包含其之電極、包含其之二次電池及其製造方法
CN111058063B (zh) * 2018-10-16 2021-02-02 长春石油化学股份有限公司 电解铜箔、包含其的电极、及包含其的锂离子电池
US11365486B2 (en) 2018-10-16 2022-06-21 Chang Chun Petrochemical Co., Ltd. Electrolytic copper foil, electrode comprising the same, and lithium ion battery comprising the same
JP7456578B2 (ja) * 2019-05-09 2024-03-27 ナミックス株式会社 銅表面の加工装置
JP7352939B2 (ja) * 2019-05-09 2023-09-29 ナミックス株式会社 複合銅部材
JP7409602B2 (ja) * 2019-05-09 2024-01-09 ナミックス株式会社 複合銅部材
JPWO2022202540A1 (ko) 2021-03-26 2022-09-29
CN116997683A (zh) 2021-03-26 2023-11-03 三井金属矿业株式会社 粗糙化处理铜箔、带载体铜箔、覆铜层叠板及印刷电路板
JPWO2022209989A1 (ko) 2021-03-29 2022-10-06
US12104265B2 (en) 2021-03-29 2024-10-01 Mitsui Mining & Smelting Co., Ltd. Roughened copper foil, copper-clad laminate and printed wiring board
CN115135043B (zh) * 2022-07-18 2023-03-07 东莞市国盈电子有限公司 一种传感器线路板及其制造工艺

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JP2004263300A (ja) * 2003-02-12 2004-09-24 Furukawa Techno Research Kk ファインパターンプリント配線用銅箔とその製造方法
WO2007105635A1 (ja) * 2006-03-10 2007-09-20 Mitsui Mining & Smelting Co., Ltd. 表面処理電解銅箔及びその製造方法
JP2009004423A (ja) * 2007-06-19 2009-01-08 Hitachi Cable Ltd キャリア箔付き銅箔
JP2009176768A (ja) * 2008-01-21 2009-08-06 Ube Ind Ltd セミアディティブ法による銅配線絶縁フィルムの製造法、及びこれらから製造された銅配線絶縁フィルム
JP2010013738A (ja) * 2004-02-06 2010-01-21 Furukawa Electric Co Ltd:The 表面処理銅箔及びその製造方法
WO2010046804A2 (en) * 2008-10-21 2010-04-29 Alembic Limited A process for preparation of losartan potassium form i

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JP3306404B2 (ja) * 2000-01-28 2002-07-24 三井金属鉱業株式会社 表面処理銅箔の製造方法及びその製造方法で得られた表面処理銅箔を用いた銅張積層板
JP2004256832A (ja) * 2003-02-24 2004-09-16 Mitsui Mining & Smelting Co Ltd 黒色化処理面を備える表面処理銅箔及びその表面処理銅箔を用いたプラズマディスプレイの前面パネル用の磁気遮蔽導電性メッシュ
US7341796B2 (en) * 2004-02-17 2008-03-11 Nippon Mining & Metals Co., Ltd Copper foil having blackened surface or layer
US6979627B2 (en) 2004-04-30 2005-12-27 Freescale Semiconductor, Inc. Isolation trench
JP2006210689A (ja) * 2005-01-28 2006-08-10 Fukuda Metal Foil & Powder Co Ltd 高周波プリント配線板用銅箔及びその製造方法
TWI406757B (zh) * 2005-04-04 2013-09-01 Ube Industries 包銅之疊層基板
JP4958045B2 (ja) 2006-10-27 2012-06-20 三井金属鉱業株式会社 フレキシブル銅張積層板製造用の表面処理銅箔及びその表面処理銅箔を用いて得られるフレキシブル銅張積層板
EP2615196A1 (en) * 2010-10-06 2013-07-17 Furukawa Electric Co., Ltd. Copper foil and manufacturing method therefor, copper foil with carrier and manufacturing method therefor, printed circuit board, and multilayer printed circuit board

Patent Citations (6)

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Publication number Priority date Publication date Assignee Title
JP2004263300A (ja) * 2003-02-12 2004-09-24 Furukawa Techno Research Kk ファインパターンプリント配線用銅箔とその製造方法
JP2010013738A (ja) * 2004-02-06 2010-01-21 Furukawa Electric Co Ltd:The 表面処理銅箔及びその製造方法
WO2007105635A1 (ja) * 2006-03-10 2007-09-20 Mitsui Mining & Smelting Co., Ltd. 表面処理電解銅箔及びその製造方法
JP2009004423A (ja) * 2007-06-19 2009-01-08 Hitachi Cable Ltd キャリア箔付き銅箔
JP2009176768A (ja) * 2008-01-21 2009-08-06 Ube Ind Ltd セミアディティブ法による銅配線絶縁フィルムの製造法、及びこれらから製造された銅配線絶縁フィルム
WO2010046804A2 (en) * 2008-10-21 2010-04-29 Alembic Limited A process for preparation of losartan potassium form i

Also Published As

Publication number Publication date
TW201447051A (zh) 2014-12-16
KR20160135369A (ko) 2016-11-25
MY181562A (en) 2020-12-29
CN105008593B (zh) 2018-08-24
TWI690625B (zh) 2020-04-11
WO2014133164A1 (ja) 2014-09-04
JPWO2014133164A1 (ja) 2017-02-09
KR102116928B1 (ko) 2020-05-29
CN105008593A (zh) 2015-10-28
KR20150090265A (ko) 2015-08-05

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