MY177676A - Roughened copper foil, copper-clad laminate and printed wiring board - Google Patents

Roughened copper foil, copper-clad laminate and printed wiring board

Info

Publication number
MY177676A
MY177676A MYPI2017705033A MYPI2017705033A MY177676A MY 177676 A MY177676 A MY 177676A MY PI2017705033 A MYPI2017705033 A MY PI2017705033A MY PI2017705033 A MYPI2017705033 A MY PI2017705033A MY 177676 A MY177676 A MY 177676A
Authority
MY
Malaysia
Prior art keywords
copper foil
copper
roughened
wiring board
printed wiring
Prior art date
Application number
MYPI2017705033A
Other languages
English (en)
Inventor
Shinichi Obata
Ayumu Tateoka
Kazuhiro Yoshikawa
Original Assignee
Mitsui Mining & Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co Ltd filed Critical Mitsui Mining & Smelting Co Ltd
Publication of MY177676A publication Critical patent/MY177676A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing & Machinery (AREA)
MYPI2017705033A 2015-07-03 2016-06-16 Roughened copper foil, copper-clad laminate and printed wiring board MY177676A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015134707 2015-07-03

Publications (1)

Publication Number Publication Date
MY177676A true MY177676A (en) 2020-09-23

Family

ID=57686211

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017705033A MY177676A (en) 2015-07-03 2016-06-16 Roughened copper foil, copper-clad laminate and printed wiring board

Country Status (7)

Country Link
JP (1) JP6193534B2 (zh)
KR (1) KR101895745B1 (zh)
CN (1) CN107614760B (zh)
MY (1) MY177676A (zh)
PH (1) PH12017502362B1 (zh)
TW (1) TWI630289B (zh)
WO (1) WO2017006739A1 (zh)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017179416A1 (ja) * 2016-04-14 2017-10-19 三井金属鉱業株式会社 表面処理銅箔、キャリア付銅箔、並びにそれらを用いた銅張積層板及びプリント配線板の製造方法
JP6824004B2 (ja) 2016-11-09 2021-02-03 株式会社クボタ 表面にアルミナバリア層を有する鋳造品及びその製造方法
JP6430092B1 (ja) * 2017-05-19 2018-11-28 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
US20210115610A1 (en) * 2017-12-13 2021-04-22 Kuraray Co., Ltd. Printed napped sheet and napped sheet for printing
JP6400875B1 (ja) * 2018-02-14 2018-10-03 住友化学株式会社 積層体
KR102394732B1 (ko) 2018-04-27 2022-05-09 제이엑스금속주식회사 표면 처리 동박, 동장 적층판 및 프린트 배선판
CN112424399B (zh) * 2018-08-10 2023-07-25 三井金属矿业株式会社 粗糙化处理铜箔、带载体的铜箔、覆铜层叠板及印刷电路板
TWI668333B (zh) * 2018-09-17 2019-08-11 金居開發股份有限公司 微粗糙電解銅箔及銅箔基板
TWI669032B (zh) 2018-09-26 2019-08-11 金居開發股份有限公司 微粗糙電解銅箔及銅箔基板
JP7014695B2 (ja) * 2018-10-18 2022-02-01 Ｊｘ金属株式会社 導電性材料、成型品及び電子部品
TWI695898B (zh) * 2018-11-05 2020-06-11 金居開發股份有限公司 經微細粗糙化處理的電解銅箔以及使用其的覆銅基板
CN111194134B (zh) * 2018-11-15 2021-11-02 金居开发股份有限公司 经微细粗糙化处理的电解铜箔以及使用其的覆铜基板
KR20210090608A (ko) * 2018-11-19 2021-07-20 미쓰이금속광업주식회사 표면 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판
US10581081B1 (en) 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
JP7254904B2 (ja) 2019-03-19 2023-04-10 タツタ電線株式会社 シールドプリント配線板、シールドプリント配線板の製造方法、及び、接続部材
TWI776168B (zh) * 2019-06-19 2022-09-01 金居開發股份有限公司 進階反轉電解銅箔及應用其的銅箔基板
US11332839B2 (en) 2019-06-19 2022-05-17 Co-Tech Development Corp. Advanced electrodeposited copper foil and copper clad laminate using the same
US11408087B2 (en) 2019-06-19 2022-08-09 Co-Tech Development Corp. Advanced electrodeposited copper foil having island-shaped microstructures and copper clad laminate using the same
TWI764170B (zh) * 2019-06-19 2022-05-11 金居開發股份有限公司 微粗糙電解銅箔以及銅箔基板
JP7421208B2 (ja) * 2019-12-24 2024-01-24 日本電解株式会社 表面処理銅箔及びその製造方法
KR20220106200A (ko) * 2020-02-04 2022-07-28 미쓰이금속광업주식회사 조화 처리 동박, 캐리어를 구비하는 동박, 동장 적층판 및 프린트 배선판
CN115038818A (zh) * 2020-02-04 2022-09-09 三井金属矿业株式会社 粗糙化处理铜箔、带载体的铜箔、覆铜层叠板及印刷电路板
US10991948B1 (en) * 2020-03-20 2021-04-27 Chang Chun Petrochemical Co., Ltd. Surface-treated copper foil for lithium-ion secondary batteries
KR102454686B1 (ko) 2020-12-30 2022-10-13 에스케이씨 주식회사 표면 처리 동박 및 이를 포함하는 회로 기판
KR102506594B1 (ko) 2021-04-09 2023-03-03 에스케이씨 주식회사 표면 처리 동박 및 이를 포함하는 회로 기판
WO2023281774A1 (ja) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
KR20230121117A (ko) * 2021-07-09 2023-08-17 제이엑스금속주식회사 표면 처리 구리박, 동장 적층판 및 프린트 배선판
KR20230154812A (ko) * 2021-07-09 2023-11-09 제이엑스금속주식회사 표면 처리 구리박, 동장 적층판 및 프린트 배선판
WO2023281775A1 (ja) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
JPWO2023281776A1 (zh) * 2021-07-09 2023-01-12
CN117916553A (zh) * 2021-12-22 2024-04-19 三井金属矿业株式会社 铜箔的表面参数的测定方法、铜箔的筛选方法以及表面处理铜箔的制造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004263296A (ja) * 2003-02-12 2004-09-24 Furukawa Techno Research Kk ファインパターンプリント配線用銅箔とその製造方法
TW200500199A (en) * 2003-02-12 2005-01-01 Furukawa Circuit Foil Copper foil for fine patterned printed circuits and method of production of same
TW200738913A (en) * 2006-03-10 2007-10-16 Mitsui Mining & Smelting Co Surface treated elctrolytic copper foil and process for producing the same
CN100591809C (zh) * 2007-01-25 2010-02-24 湖北中科铜箔科技有限公司 电解铜箔表面低粗化处理方法
JP5129642B2 (ja) 2007-04-19 2013-01-30 三井金属鉱業株式会社 表面処理銅箔及びその表面処理銅箔を用いて得られる銅張積層板並びにその銅張積層板を用いて得られるプリント配線板
TWI434965B (zh) * 2008-05-28 2014-04-21 Mitsui Mining & Smelting Co A roughening method for copper foil, and a copper foil for a printed wiring board which is obtained by the roughening method
KR20130098359A (ko) * 2010-10-06 2013-09-04 후루카와 덴키 고교 가부시키가이샤 동박 및 그 제조 방법, 캐리어 부착 동박 및 그 제조 방법, 프린트 배선판, 다층 프린트 배선판
MY162358A (en) * 2010-11-22 2017-06-15 Mitsui Mining & Smelting Co Surface-treated copper foil
JP5710845B2 (ja) * 2012-11-26 2015-04-30 Jx日鉱日石金属株式会社 表面処理電解銅箔、積層板、プリント配線板、及び電子機器
JP6353193B2 (ja) * 2013-04-02 2018-07-04 Ｊｘ金属株式会社 キャリア付き銅箔、当該キャリア付き銅箔を用いて銅張積層板を製造する方法、当該キャリア付き銅箔を用いてプリント配線板を製造する方法、及びプリント配線板の製造方法
TWI515342B (zh) 2013-09-05 2016-01-01 三井金屬鑛業股份有限公司 表面處理銅箔、使用該表面處理銅箔所得之貼銅積層板以及印刷配線板

Also Published As

Publication number Publication date
KR101895745B1 (ko) 2018-09-05
CN107614760A (zh) 2018-01-19
TW201718948A (zh) 2017-06-01
PH12017502362A1 (en) 2018-06-25
CN107614760B (zh) 2018-07-13
JPWO2017006739A1 (ja) 2017-09-07
JP6193534B2 (ja) 2017-09-06
PH12017502362B1 (en) 2018-06-25
KR20170137932A (ko) 2017-12-13
TWI630289B (zh) 2018-07-21
WO2017006739A1 (ja) 2017-01-12

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