WO2017006739A1 - 粗化処理銅箔、銅張積層板及びプリント配線板 - Google Patents

粗化処理銅箔、銅張積層板及びプリント配線板 Download PDF

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Publication number
WO2017006739A1
WO2017006739A1 PCT/JP2016/067972 JP2016067972W WO2017006739A1 WO 2017006739 A1 WO2017006739 A1 WO 2017006739A1 JP 2016067972 W JP2016067972 W JP 2016067972W WO 2017006739 A1 WO2017006739 A1 WO 2017006739A1
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WIPO (PCT)
Prior art keywords
copper foil
roughened
copper
roughening
resin
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PCT/JP2016/067972
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English (en)
French (fr)
Japanese (ja)
Inventor
小畠　真一
歩 立岡
吉川　和広
Original Assignee
三井金属鉱業株式会社
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Application filed by 三井金属鉱業株式会社 filed Critical 三井金属鉱業株式会社
Priority to KR1020177034238A priority Critical patent/KR101895745B1/ko
Priority to JP2017526725A priority patent/JP6193534B2/ja
Priority to CN201680031199.1A priority patent/CN107614760B/zh
Publication of WO2017006739A1 publication Critical patent/WO2017006739A1/ja
Priority to PH12017502362A priority patent/PH12017502362A1/en

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating

Definitions

  • the present invention relates to a roughened copper foil, a copper clad laminate, and a printed wiring board.
  • the subtractive method has been widely adopted as a method for manufacturing a printed wiring board.
  • the subtractive method is a technique capable of forming a fine circuit using a copper foil.
  • the roughened surface of the copper foil 10 is bonded to the insulating resin substrate 12 having the lower layer circuit 12b on the base substrate 12a through the prepreg 14 (step (a)).
  • via holes 16 are formed by laser drilling or drilling (step (c))
  • Chemical copper plating 18 step (d)
  • electrolytic copper plating 20 step (e)
  • step (f) masking with a predetermined pattern by exposure and development using the dry film 22
  • step (g) unnecessary copper foil and the like immediately below the opening of the dry film 22 are dissolved and removed by etching
  • step (h) the dry film 22 is peeled off (step (h)) to obtain the wiring 24 formed in a predetermined pattern.
  • the wiring 24 has a substantially trapezoidal cross section, and the bottom is wider than the top. If the distance of the extended portion (bottom portion) of the bottom with respect to the top end (referred to as the distance between the top and bottom) is large, the linearity of the circuit pattern is inferior. In this case, since the interval between the adjacent wirings 24 is locally narrowed, problems such as short circuits are likely to occur. In addition, the characteristic impedance does not match the predetermined resistance, resulting in poor high frequency characteristics.
  • Patent Document 1 Japanese Patent Laid-Open No. 2008-285751
  • the adhesive surface bonded to the insulating resin base material has a surface roughness (Rzjis) of 2.5 ⁇ m or less and a two-dimensional surface area of 6550 ⁇ m 2 .
  • the surface area ratio (B) which is the value of the ratio [(A) / (6550)] of the three-dimensional surface area (A) ⁇ m 2 to the two-dimensional surface area when the region is measured by a laser method is 1.2 to 2.
  • the surface-treated copper foil characterized by being 5 is disclosed.
  • the roughening process and the antirust process are performed with respect to the deposition surface of an untreated electrolytic copper foil.
  • Patent Document 2 International Publication No. 2015/033917 discloses a surface-treated copper foil obtained by performing a roughening treatment on the electrode surface side of an electrolytic copper foil, and the surface roughness Rz is 2.5-4.
  • circuit linearity the linearity of the wiring pattern
  • the inventors of the present invention have recently calculated the product of the arithmetic average height Sa ( ⁇ m) measured in accordance with ISO25178 and the peak vertex density Spd (pieces / mm 2 ) on the roughened surface of the roughened copper foil. And a specific surface profile of Sa ⁇ Spd of 250,000 ⁇ m / mm 2 or more and an arithmetic mean waviness Wa measured in accordance with JIS B0601-2001 is 0.030 to 0.060 ⁇ m.
  • the inventors have obtained knowledge that both fine circuit formability (particularly circuit linearity) and adhesiveness with resin can be achieved.
  • an object of the present invention is to provide a roughened copper foil that can achieve both fine circuit formability (particularly circuit linearity) and adhesion to a resin in processing a copper-clad laminate or manufacturing a printed wiring board. Is to provide.
  • a roughened copper foil having a roughened surface on at least one side, wherein the roughened surface is an arithmetic average height Sa (measured in accordance with ISO25178). ⁇ m) and the peak density Spd (pieces / mm 2 ) of Sa ⁇ Spd is 250,000 ⁇ m / mm 2 or more, and the arithmetic average waviness Wa measured in accordance with JIS B0601-2001 is 0.00.
  • a roughened copper foil having a thickness of 030 to 0.060 ⁇ m is provided.
  • a copper-clad laminate including the roughened copper foil of the above aspect.
  • a printed wiring board provided with the roughened copper foil of the above aspect is provided.
  • Example 4 It is the SEM image which observed the wiring pattern obtained in Example 4 from the top.
  • 6 is a cross-sectional SEM image of a wiring pattern obtained in Example 5.
  • 10 is an SEM image obtained by observing the wiring pattern obtained in Example 5 from above. It is a figure for demonstrating the evaluation method of circuit linearity.
  • arithmetic average height Sa is a parameter that represents an average of absolute values of height differences between points with respect to the average surface of the surface, measured in accordance with ISO25178. That is, it corresponds to a parameter obtained by extending the arithmetic average height Ra of the roughness curve to the surface.
  • the arithmetic average height Sa can be calculated by measuring a surface profile of a predetermined measurement area (for example, a region of 22,500 ⁇ m 2 ) on the roughened surface with a commercially available laser microscope.
  • the “mountain peak density Spd” is a parameter representing the number of peak apexes per unit area, measured in accordance with ISO25178. A large value suggests that the number of contact points with other objects is large.
  • the peak vertex density Spd can be calculated by measuring a surface profile of a predetermined measurement area (for example, a region of 22,500 ⁇ m 2 ) on the roughened surface with a commercially available laser microscope.
  • arithmetic mean wave Wa is an arithmetic average height at the reference length of a wave curve as a contour curve, measured according to JIS B0601-2001.
  • the waviness curve is a contour curve obtained by sequentially applying a contour curve filter with cut-off values ⁇ f and ⁇ c to the cross-sectional curve, not the fine unevenness represented by the roughness curve. , Representing a larger scale irregularity (ie, undulation).
  • the “electrode surface” of the electrolytic copper foil refers to the surface on the side in contact with the cathode when the electrolytic copper foil was produced.
  • the “deposition surface” of the electrolytic copper foil refers to the surface on the side where the electrolytic copper is deposited during the production of the electrolytic copper foil, that is, the surface not in contact with the cathode.
  • the copper foil of the present invention is a roughened copper foil.
  • This roughened copper foil has a roughened surface on at least one side.
  • the roughened surface has a Sa ⁇ Spd that is a product of the arithmetic average height Sa ( ⁇ m) measured according to ISO25178 and the peak density Spd (pieces / mm 2 ) of 250,000 ⁇ m / mm 2 or more.
  • the arithmetic average waviness Wa measured in accordance with JIS B0601-2001 is 0.030 to 0.060 ⁇ m.
  • the arithmetic average height Sa contributes to the biting of the roughened particles into the resin on the roughened surface
  • the peak vertex density Spd contributes to securing the contact between the roughened particles and the resin on the roughened surface.
  • Patent Document 1 it is common that the roughening treatment is performed on the deposition surface side of the electrolytic copper foil, but the low arithmetic average waviness Wa and the high Sa as described above in the present invention. It is considered that the coexistence of xSpd is difficult to realize on the deposition surface side of the electrolytic copper foil. This is because unevenness is generated in accordance with copper deposition on the deposition surface side of the electrolytic copper foil, and hence waviness must be increased.
  • the surface of the rotating cathode is polished and smoothed in advance with a predetermined count buff, and an electrolytic copper foil is produced by electrolysis using the thus-rotated rotating cathode, ii)
  • a roughening treatment under desired low roughening conditions on the electrode surface side (not on the deposition surface side) of the obtained untreated electrolytic copper foil, it is possible to obtain a unique characteristic with the low Wa and high Sa ⁇ Spd.
  • the roughened surface can be desirably realized. Therefore, according to a preferred embodiment of the present invention, the roughened copper foil is an electrolytic copper foil, and the roughened surface is present on the electrode surface side of the electrolytic copper foil.
  • Sa ⁇ Spd on the roughened surface is 250,000 ⁇ m / mm 2 or more, preferably 280000 to 500,000 ⁇ m / mm 2 .
  • the adhesion to the resin can be further enhanced while ensuring the desired fine circuit formability (particularly circuit linearity).
  • the arithmetic average waviness Wa on the roughened surface is 0.030 to 0.060 ⁇ m, preferably 0.030 to 0.050 ⁇ m, and more preferably 0.030 to 0.045 ⁇ m.
  • Wa is within these ranges, fine circuit formability (particularly circuit linearity) can be further improved while ensuring high adhesion to the resin.
  • the thickness of the roughened copper foil of the present invention is not particularly limited, but is preferably 0.1 to 35 ⁇ m, more preferably 0.5 to 18 ⁇ m.
  • the roughening copper foil of this invention performed the roughening process or the fine roughening process of the copper foil surface not only what performed the roughening process on the surface of the normal copper foil but the copper foil with a carrier. It may be a thing.
  • This preferred manufacturing method includes a step of preparing a copper foil having a surface with an arithmetic average waviness Wa of 0.030 to 0.060 ⁇ m, and a first roughening step of performing electrolytic deposition on the surface under predetermined conditions. A second roughening step in which electrolytic deposition is performed on the surface under predetermined conditions, and a third roughening process in which electrolytic deposition is performed on the surface under predetermined conditions to form a roughened surface. The process.
  • the roughened copper foil according to the present invention is not limited to the method described below, and may be manufactured by any method.
  • the surface of the rotating cathode is previously polished and smoothed with a predetermined count buff, and electrolysis using the thus polished cathode is performed.
  • Electrolytic copper foil is preferable as the copper foil used for the production of the roughened copper foil. Further, the copper foil may be a non-roughened copper foil or a pre-roughened copper foil.
  • the thickness of the copper foil is not particularly limited, but is preferably 0.1 to 35 ⁇ m, more preferably 0.5 to 18 ⁇ m.
  • the copper foil is prepared by a wet film formation method such as an electroless copper plating method and an electrolytic copper plating method, a dry film formation method such as sputtering and chemical vapor deposition, or It may be formed by a combination thereof.
  • the surface of the copper foil to be roughened preferably has a surface with an arithmetic average waviness Wa measured in accordance with JIS B0601-2001 of 0.030 to 0.060 ⁇ m, more preferably 0. 0.030 to 0.045 ⁇ m.
  • the surface profile required for the roughened copper foil of the present invention in particular, the arithmetic average waviness of 0.030 to 0.060 ⁇ m can be easily imparted to the roughened surface.
  • the electrode surface of the electrolytic copper foil has the arithmetic mean waviness Wa.
  • the surface of the rotating cathode used for the production of the electrolytic copper foil is polished and smoothed beforehand with a buff, and the preferred count of such a buff is larger than # 1000, more preferably # 1200 to ##. 2500, more preferably # 1500 to # 2500.
  • a buff By using such a buff, it becomes possible to impart the low Wa as described above to the electrode surface of the electrolytic copper foil.
  • electrolytic deposition is performed at a temperature of 20 to 40 ° C. and 20 to 30 A / dm 2 in a copper sulfate solution containing a copper concentration of 8 to 12 g / L and a sulfuric acid concentration of 200 to 280 g / L.
  • the electrolytic deposition is performed for 2 to 5 seconds.
  • electrolytic deposition is performed at a temperature of 20 to 40 ° C. and 15 to 30 A / dm 2 in a copper sulfate solution containing a copper concentration of 8 to 12 g / L and a sulfuric acid concentration of 200 to 280 g / L.
  • the electrolytic deposition is performed for 2 to 5 seconds. That is, the first roughening step and the second roughening step can be under the same conditions.
  • electrolytic deposition is carried out at a temperature of 45 to 55 ° C.
  • a roughened surface is preferably formed, and this electrolytic deposition is preferably performed for 5 to 25 seconds.
  • a fine roughening treatment may be further performed on the roughening treatment surface formed in the third roughening step.
  • the fine roughening treatment is performed at 20 to 40 ° C. in a copper sulfate solution having a copper concentration of 10 to 20 g / L, a sulfuric acid concentration of 30 to 130 g / L, a 9-phenylacridine concentration of 100 to 200 mg / L, and a chlorine concentration of 20 to 100 mg / L. It is preferable to carry out the electrolytic deposition of fine copper particles at a current density of 10 to 40 A / dm 2 at this temperature, and this electrolytic deposition is preferably carried out for 0.3 to 1.0 seconds.
  • the copper foil after the roughening treatment may be subjected to a rust prevention treatment.
  • the rust prevention treatment preferably includes a plating treatment using zinc.
  • the plating treatment using zinc may be either a zinc plating treatment or a zinc alloy plating treatment, and the zinc alloy plating treatment is particularly preferably a zinc-nickel alloy treatment.
  • the zinc-nickel alloy treatment may be a plating treatment containing at least Ni and Zn, and may further contain other elements such as Sn, Cr, and Co.
  • the Ni / Zn adhesion ratio in the zinc-nickel alloy plating is preferably 1.2 to 10, more preferably 2 to 7, and still more preferably 2.7 to 4 in terms of mass ratio.
  • the rust prevention treatment preferably further includes a chromate treatment, and this chromate treatment is more preferably performed on the surface of the plating containing zinc after the plating treatment using zinc.
  • rust prevention property can further be improved.
  • a particularly preferable antirust treatment is a combination of a zinc-nickel alloy plating treatment and a subsequent chromate treatment.
  • the copper foil may be treated with a silane coupling agent to form a silane coupling agent layer.
  • a silane coupling agent layer can be formed by appropriately diluting and applying a silane coupling agent and drying.
  • silane coupling agents include epoxy-functional silane coupling agents such as 4-glycidylbutyltrimethoxysilane and 3-glycidoxypropyltrimethoxysilane, or 3-aminopropyltriethoxysilane, N-2 (amino Amino functions such as ethyl) 3-aminopropyltrimethoxysilane, N-3- (4- (3-aminopropoxy) butoxy) propyl-3-aminopropyltrimethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane Silane coupling agents, or mercapto-functional silane coupling agents such as 3-mercaptopropyltrimethoxysilane, or olefin-functional silane coupling agents such as vinyltrimethoxysilane and vinylphenyltrimethoxysilane, or 3-methacryloxypropyl Trime Acrylic-functional silane coupling agent such as Kishishiran, or imid
  • the roughened copper foil of the present invention is preferably used for the production of a copper-clad laminate for printed wiring boards. That is, according to the preferable aspect of this invention, the copper clad laminated board obtained using the said roughening process copper foil is provided.
  • This copper-clad laminate includes the roughened copper foil of the present invention and a resin layer provided in close contact with the roughened surface of the roughened copper foil.
  • the roughened copper foil may be provided on one side of the resin layer or on both sides.
  • the resin layer comprises a resin, preferably an insulating resin.
  • the resin layer is preferably a prepreg and / or a resin sheet.
  • the prepreg is a general term for composite materials in which a base material such as a synthetic resin plate, a glass plate, a glass woven fabric, a glass nonwoven fabric, and paper is impregnated with a synthetic resin.
  • a base material such as a synthetic resin plate, a glass plate, a glass woven fabric, a glass nonwoven fabric, and paper is impregnated with a synthetic resin.
  • the insulating resin include an epoxy resin, a cyanate resin, a bismaleimide triazine resin (BT resin), a polyphenylene ether resin, and a phenol resin.
  • the insulating resin that constitutes the resin sheet include insulating resins such as epoxy resins, polyimide resins, and polyester resins.
  • the thickness of the resin layer is not particularly limited, but is preferably 1 to 1000 ⁇ m, more preferably 2 to 400 ⁇ m, and still more preferably 3 to 200 ⁇ m.
  • the resin layer may be composed of a plurality of layers.
  • a resin layer such as a prepreg and / or a resin sheet may be provided on the roughened copper foil via a primer resin layer applied to the surface of the copper foil in advance.
  • the roughened copper foil of the present invention is preferably used for the production of a printed wiring board. That is, according to the preferable aspect of this invention, the printed wiring board obtained using the said roughening process copper foil is provided.
  • the printed wiring board according to this aspect includes a layer configuration in which a resin layer and a copper layer are laminated in this order.
  • the resin layer is as described above for the copper-clad laminate.
  • a known layer structure can be adopted for the printed wiring board.
  • a multilayer printed wiring board etc. are mentioned.
  • Other specific examples include a flexible printed wiring board, a COF, a TAB tape, and the like that form a circuit by forming the roughened copper foil of the present invention on a resin film.
  • a copper foil with resin (RCC) in which the above-described resin layer is applied to the roughened copper foil of the present invention is formed, and the resin layer is laminated on the above-described printed circuit board as an insulating adhesive layer.
  • the build-up wiring board in which the circuit is formed by using the modified semi-additive (MSAP) method, the subtractive method, etc., with the roughened copper foil as a whole or a part of the wiring layer, and the roughened copper foil are removed.
  • MSAP modified semi-additive
  • Examples thereof include a build-up wiring board in which a circuit is formed by a semi-additive (SAP) method, and a direct build-up on wafer in which the lamination of a copper foil with resin and circuit formation are alternately repeated on a semiconductor integrated circuit.
  • SAP semi-additive
  • Roughening treatment was performed on the electrode surface side of the electrode surface and the precipitation surface included in the above-described electrolytic copper foil by a three-stage process shown below. That is, the 1st roughening process shown below, the 2nd roughening process, and the 3rd roughening process were performed in this order.
  • the first roughening step is performed in Table 1A in a copper electrolytic solution for roughening treatment (copper concentration: 10.5 to 10.8 g / L, sulfuric acid concentration: 230 to 240 g / L) having the composition shown in Table 1A. It was carried out by electrolyzing under the indicated conditions and washing with water.
  • the 2nd roughening process was performed by electrolyzing on the conditions shown by Table 1A in the copper electrolytic solution for roughening process of the same composition as a 1st roughening process, and washing with water.
  • the 3rd roughening process was performed by electrolyzing on the conditions shown by Table 1B in the copper electrolytic solution for a roughening process (copper concentration: 70 g / L, sulfuric acid concentration: 240 g / L), and washing with water.
  • Rust prevention treatment comprising inorganic rust prevention treatment and chromate treatment was performed on both surfaces of the electrolytic copper foil after the roughening treatment.
  • an inorganic rust prevention treatment using a pyrophosphate bath, potassium pyrophosphate concentration 80 g / L, zinc concentration 0.2 g / L, nickel concentration 2 g / L, liquid temperature 40 ° C., current density 0.5 A / dm 2 Zinc-nickel alloy rust prevention treatment was performed.
  • a chromate treatment a chromate layer was further formed on the zinc-nickel alloy rust preventive treatment. This chromate treatment was performed at a chromic acid concentration of 1 g / L, pH 11, a solution temperature of 25 ° C., and a current density of 1 A / dm 2 .
  • Silane coupling agent treatment The copper foil that has been subjected to the above rust prevention treatment is washed with water and then immediately treated with a silane coupling agent to adsorb the silane coupling agent onto the rust prevention treatment layer of the roughened surface. It was.
  • this silane coupling agent treatment pure water is used as a solvent, a solution having a 3-aminopropyltrimethoxysilane concentration of 3 g / L is used, and this solution is sprayed onto the roughened surface by showering to perform an adsorption treatment. went. After adsorption of the silane coupling agent, water was finally evaporated by an electric heater to obtain a roughened copper foil having a thickness of 18 ⁇ m.
  • Example 4 (Comparison) As shown in Tables 1A and 1B, a roughened copper foil was prepared in the same manner as in Example 1 except that the buff count used for polishing the rotating cathode was # 600.
  • Example 5 (Comparison) i) Except that the electrolytic copper foil was subjected to a treatment such as a roughening treatment on the deposition surface side (that is, the side opposite to the electrode surface side), and ii) the roughening treatment was conducted according to the conditions shown in Tables 1A and 1B Prepared a roughened copper foil in the same manner as in Example 1.
  • the roughening treatment surface of the roughening copper foil was basically affected by the count of the buff used for polishing the rotating cathode. Therefore, the buff count is not shown in Tables 1A and 2.
  • Example 6 (Comparison) i) A roughening treatment or the like was performed on the deposition surface side (that is, the side opposite to the electrode surface side) of the electrolytic copper foil, and ii) the following 1 instead of the first, second and third roughening steps: A roughened copper foil was prepared in the same manner as in Example 1 except that the finer roughening process was performed.
  • the roughening treatment surface of the roughening copper foil was basically affected by the count of the buff used for polishing the rotating cathode. Therefore, the buff count is not shown in Tables 1A and 2.
  • the copper electrolytic solution for roughening treatment (copper concentration: 13 g / L, sulfuric acid concentration: 70 g / L, 9-phenylacridine concentration: In 140 mg / L, chlorine concentration: 35 mg / L), electrolysis was performed under the conditions shown in Table 1B, followed by washing with water to perform a fine roughening treatment.
  • Example 7 (Comparison) As shown in Tables 1A and 1B, a roughened copper foil was prepared in the same manner as in Example 1 except that the buff count used for polishing the rotating cathode was # 3000.
  • Example 8 (Comparison) i) The buff count used for polishing the rotating cathode was set to # 600, ii) the electrode surface side of the electrolytic copper foil was subjected to a treatment such as a roughening treatment, and iii) the first roughening step was performed using copper.
  • a roughened copper foil was prepared in the same manner as in Example 1 except that the copper concentration was 70 g / L and the sulfuric acid concentration was 230 g / L, in accordance with the conditions shown in Table 1B. It was.
  • ⁇ Arithmetic mean swell Wa> By means of surface roughness analysis using a laser microscope (manufactured by Keyence Corporation, VK-X100), the arithmetic average waviness Wa on the roughened surface of the roughened copper foil was measured in accordance with JIS B0601-2001. Specifically, the surface profile of a region (150 ⁇ m ⁇ 150 ⁇ m) having an area of 22,500 ⁇ m 2 on the roughened surface of the roughened copper foil was measured with the laser microscope at a magnification of 1000 times. Surface correction was performed on the surface profile of the obtained roughened surface, and then the surface was smoothed to a size of 5 ⁇ 5 by filtering, and waviness was measured by surface roughness analysis. The filter type was median.
  • undulation Wa of the precipitation surface or electrode surface of the electrolytic copper foil before the roughening process in each example mentioned above was also performed in the same procedure as described above.
  • ⁇ Sa ⁇ Spd> By surface property analysis using a laser microscope (manufactured by Keyence Corporation, VK-X100), the arithmetic average height Sa ( ⁇ m) and the peak density Spd (pieces / mm 2 ) on the roughened surface of the roughened copper foil ) In accordance with ISO25178. Specifically, the surface profile of a region (150 ⁇ m ⁇ 150 ⁇ m) having an area of 22500 ⁇ m 2 on the roughened surface of the roughened copper foil was measured at a magnification of 1000 times using the laser microscope. After surface inclination correction was performed on the surface profile of the obtained roughened surface, Sa and Spd were measured by surface property analysis. In this measurement, the cutoff wavelength by the S filter was 0.8 ⁇ m, and the cutoff wavelength by the L filter was 0.1 ⁇ m. Based on the values of Sa and Spd thus obtained, a value of Sa ⁇ Spd was calculated.
  • ⁇ Peel strength> Two prepregs (EM355 (D), manufactured by ELITE MATERIAL CO., LTD) having a thickness of 50 ⁇ m were stacked to obtain a resin base material having a thickness of 100 ⁇ m. Laminated copper foil is laminated on this resin base material so that the roughened surface is in contact with the resin base material, and hot press molding is performed at a pressure of 4.0 MPa and a temperature of 185 ° C. for 60 minutes to obtain a copper-clad laminate. A plate sample was prepared. The copper-clad laminate sample was peeled in a 90 ° direction with respect to the resin substrate surface in accordance with JIS C 6481-1996, and the normal peel strength (kgf / cm) was measured.
  • FIG. 4B, 5B, and 6B the SEM image which observed the wiring pattern obtained in Examples 1, 4, and 5 from the top is shown to FIG. 4B, 5B, and 6B.
  • FIG. 4A, 5A and 6A two substantially trapezoidal portions observed at the center are wiring patterns.
  • FIG. 4B, 5B, and 6B three linear portions observed in the horizontal direction are wiring patterns.
  • the cross section of the wiring pattern is substantially trapezoidal, and the width at the bottom is longer than the width at the top. It can be said that the smaller the variation in the distance (hereinafter referred to as the top-bottom distance) of the extended portion (bottom portion) of the bottom with respect to the top end of the wiring pattern, the higher the linearity of the circuit pattern.
  • the wiring pattern shown in FIGS. 4A to 4B corresponding to Example 1 as an example is more than the wiring pattern shown in FIGS. 5A to 5B and 6A to 6B corresponding to Examples 4 and 5 as comparative examples.
  • the linearity is high.
  • the following measurement was performed.
  • the difference between one side of the top portion 102 and the bottom portion 104 of the circuit 100, that is, the above-described top-bottom distance D is set to 100 at intervals of 4 ⁇ m.
  • the point was measured.
  • the smaller one from the 26th top-bottom distance D 26 that is, the maximum value obtained by removing the measured values of the top 25% as noise
  • Top 26 th counted from (75 th counted from the largest value) - bottom distance D 75 i.e. the minimum removal of 25% of the measured value lower as noise

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  • Chemical & Material Sciences (AREA)
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  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing & Machinery (AREA)
PCT/JP2016/067972 2015-07-03 2016-06-16 粗化処理銅箔、銅張積層板及びプリント配線板 WO2017006739A1 (ja)

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CN201680031199.1A CN107614760B (zh) 2015-07-03 2016-06-16 粗糙化处理铜箔、覆铜层叠板和印刷电路板
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Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017179416A1 (ja) * 2016-04-14 2017-10-19 三井金属鉱業株式会社 表面処理銅箔、キャリア付銅箔、並びにそれらを用いた銅張積層板及びプリント配線板の製造方法
WO2018211951A1 (ja) * 2017-05-19 2018-11-22 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
WO2019208525A1 (ja) * 2018-04-27 2019-10-31 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
JP2020050954A (ja) * 2018-09-26 2020-04-02 金居開發股▲分▼有限公司 微小粗面化電解銅箔及び銅箔基板
JP2020063492A (ja) * 2018-10-18 2020-04-23 Ｊｘ金属株式会社 導電性材料、成型品及び電子部品
JP2020076151A (ja) * 2018-11-05 2020-05-21 金居開發股▲分▼有限公司 マイクロラフ処理された電解銅箔及びこれを用いた銅張基板
WO2020105289A1 (ja) * 2018-11-19 2020-05-28 三井金属鉱業株式会社 表面処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
CN111433404A (zh) * 2017-12-13 2020-07-17 株式会社可乐丽 经印刷的起毛片及印刷用起毛片
JP2020128589A (ja) * 2019-02-01 2020-08-27 長春石油化學股▲分▼有限公司 表面処理銅箔
CN112118672A (zh) * 2019-06-19 2020-12-22 金居开发股份有限公司 具有长岛状微结构的进阶反转电解铜箔及应用其的铜箔基板
JP2021001398A (ja) * 2019-06-19 2021-01-07 金居開發股▲分▼有限公司 ミクロ粗面化した電着銅箔及び銅張積層板
JP2021021137A (ja) * 2019-06-19 2021-02-18 金居開發股▲分▼有限公司 長尺島状の微細構造を有するアドバンスト電解銅箔及びそれを適用した銅張積層板
JPWO2020031721A1 (ja) * 2018-08-10 2021-04-30 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
US11162151B2 (en) 2016-11-09 2021-11-02 Kubota Corporation Tube body that is to be used in high-temperature atmosphere and method for forming metal oxide layer on inner surface of tube body
WO2023281778A1 (ja) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
WO2023281774A1 (ja) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
WO2023281776A1 (ja) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
WO2023281777A1 (ja) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
WO2023281775A1 (ja) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
JPWO2023119513A1 (zh) * 2021-12-22 2023-06-29

Families Citing this family (12)

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JP6400875B1 (ja) * 2018-02-14 2018-10-03 住友化学株式会社 積層体
TWI668333B (zh) * 2018-09-17 2019-08-11 金居開發股份有限公司 微粗糙電解銅箔及銅箔基板
CN111194134B (zh) * 2018-11-15 2021-11-02 金居开发股份有限公司 经微细粗糙化处理的电解铜箔以及使用其的覆铜基板
KR102585011B1 (ko) * 2019-03-19 2023-10-04 타츠타 전선 주식회사 차폐 프린트 배선판, 차폐 프린트 배선판의 제조 방법, 및 접속 부재
JP7392996B2 (ja) 2019-06-19 2023-12-06 金居開發股▲分▼有限公司 アドバンスド電解銅箔及びそれを適用した銅張積層板
JP7421208B2 (ja) * 2019-12-24 2024-01-24 日本電解株式会社 表面処理銅箔及びその製造方法
WO2021157362A1 (ja) * 2020-02-04 2021-08-12 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
WO2021157363A1 (ja) * 2020-02-04 2021-08-12 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
US10991948B1 (en) * 2020-03-20 2021-04-27 Chang Chun Petrochemical Co., Ltd. Surface-treated copper foil for lithium-ion secondary batteries
WO2021193246A1 (ja) * 2020-03-23 2021-09-30 三井金属鉱業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
KR102454686B1 (ko) 2020-12-30 2022-10-13 에스케이씨 주식회사 표면 처리 동박 및 이를 포함하는 회로 기판
KR102506594B1 (ko) 2021-04-09 2023-03-03 에스케이씨 주식회사 표면 처리 동박 및 이를 포함하는 회로 기판

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004263296A (ja) * 2003-02-12 2004-09-24 Furukawa Techno Research Kk ファインパターンプリント配線用銅箔とその製造方法
JP2013019056A (ja) * 2006-03-10 2013-01-31 Mitsui Mining & Smelting Co Ltd 表面処理電解銅箔及びその表面処理銅箔を用いて得られる銅張積層板
US20130220679A1 (en) * 2010-10-06 2013-08-29 Furukawa Electric Co., Ltd. Copper foil and manufacturing method therefor, copper foil with carrier and manufacturing method therefor, printed circuit board, and multilayer printed circuit board
JP2014201777A (ja) * 2013-04-02 2014-10-27 Jx日鉱日石金属株式会社 キャリア付き銅箔

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200500199A (en) * 2003-02-12 2005-01-01 Furukawa Circuit Foil Copper foil for fine patterned printed circuits and method of production of same
CN100591809C (zh) * 2007-01-25 2010-02-24 湖北中科铜箔科技有限公司 电解铜箔表面低粗化处理方法
JP5129642B2 (ja) 2007-04-19 2013-01-30 三井金属鉱業株式会社 表面処理銅箔及びその表面処理銅箔を用いて得られる銅張積層板並びにその銅張積層板を用いて得られるプリント配線板
TWI434965B (zh) * 2008-05-28 2014-04-21 Mitsui Mining & Smelting Co A roughening method for copper foil, and a copper foil for a printed wiring board which is obtained by the roughening method
KR101593282B1 (ko) * 2010-11-22 2016-02-11 미쓰이금속광업주식회사 표면 처리 동박
WO2014081041A1 (ja) * 2012-11-26 2014-05-30 Jx日鉱日石金属株式会社 表面処理電解銅箔、積層板、及びプリント配線板
TWI515342B (zh) 2013-09-05 2016-01-01 三井金屬鑛業股份有限公司 表面處理銅箔、使用該表面處理銅箔所得之貼銅積層板以及印刷配線板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004263296A (ja) * 2003-02-12 2004-09-24 Furukawa Techno Research Kk ファインパターンプリント配線用銅箔とその製造方法
JP2013019056A (ja) * 2006-03-10 2013-01-31 Mitsui Mining & Smelting Co Ltd 表面処理電解銅箔及びその表面処理銅箔を用いて得られる銅張積層板
US20130220679A1 (en) * 2010-10-06 2013-08-29 Furukawa Electric Co., Ltd. Copper foil and manufacturing method therefor, copper foil with carrier and manufacturing method therefor, printed circuit board, and multilayer printed circuit board
JP2014201777A (ja) * 2013-04-02 2014-10-27 Jx日鉱日石金属株式会社 キャリア付き銅箔

Cited By (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2017179416A1 (ja) * 2016-04-14 2019-02-21 三井金属鉱業株式会社 表面処理銅箔、キャリア付銅箔、並びにそれらを用いた銅張積層板及びプリント配線板の製造方法
WO2017179416A1 (ja) * 2016-04-14 2017-10-19 三井金属鉱業株式会社 表面処理銅箔、キャリア付銅箔、並びにそれらを用いた銅張積層板及びプリント配線板の製造方法
US11162151B2 (en) 2016-11-09 2021-11-02 Kubota Corporation Tube body that is to be used in high-temperature atmosphere and method for forming metal oxide layer on inner surface of tube body
CN110382745A (zh) * 2017-05-19 2019-10-25 三井金属矿业株式会社 粗糙化处理铜箔、带载体铜箔、覆铜层叠板及印刷电路板
KR20190121327A (ko) * 2017-05-19 2019-10-25 미쓰이금속광업주식회사 조화 처리 구리박, 캐리어를 구비한 구리박, 동장 적층판 및 프린트 배선판
CN110382745B (zh) * 2017-05-19 2021-06-25 三井金属矿业株式会社 粗糙化处理铜箔、带载体铜箔、覆铜层叠板及印刷电路板
KR102297790B1 (ko) 2017-05-19 2021-09-06 미쓰이금속광업주식회사 조화 처리 구리박, 캐리어를 구비한 구리박, 동장 적층판 및 프린트 배선판
WO2018211951A1 (ja) * 2017-05-19 2018-11-22 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
JP6430092B1 (ja) * 2017-05-19 2018-11-28 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
CN111433404A (zh) * 2017-12-13 2020-07-17 株式会社可乐丽 经印刷的起毛片及印刷用起毛片
CN111433404B (zh) * 2017-12-13 2022-09-20 株式会社可乐丽 经印刷的起毛片及印刷用起毛片
US11382217B2 (en) 2018-04-27 2022-07-05 Jx Nippon Mining & Metals Corporation Surface treated copper foil, copper clad laminate, and printed circuit board
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US11047061B2 (en) 2018-09-26 2021-06-29 Co-Tech Development Corp. Micro-roughened electrodeposited copper foil and copper foil substrate
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JPWO2023120337A1 (zh) * 2021-12-22 2023-06-29
WO2023120337A1 (ja) * 2021-12-22 2023-06-29 三井金属鉱業株式会社 銅箔の表面パラメータの測定方法、及び銅箔の選別方法
JP7387085B2 (ja) 2021-12-22 2023-11-27 三井金属鉱業株式会社 銅箔の表面パラメータの測定方法、及び銅箔の選別方法
JP7387084B2 (ja) 2021-12-22 2023-11-27 三井金属鉱業株式会社 銅箔の表面パラメータの測定方法、銅箔の選別方法、及び表面処理銅箔の製造方法
WO2023119513A1 (ja) * 2021-12-22 2023-06-29 三井金属鉱業株式会社 銅箔の表面パラメータの測定方法、銅箔の選別方法、及び表面処理銅箔の製造方法
CN117881942A (zh) * 2021-12-22 2024-04-12 三井金属矿业株式会社 铜箔的表面参数的测定方法以及铜箔的筛选方法
KR102711820B1 (ko) 2021-12-22 2024-10-02 미쓰이금속광업주식회사 구리박의 표면 파라미터의 측정 방법 및 구리박의 선별 방법
JPWO2023119513A1 (zh) * 2021-12-22 2023-06-29

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CN107614760B (zh) 2018-07-13
TWI630289B (zh) 2018-07-21
KR20170137932A (ko) 2017-12-13
PH12017502362A1 (en) 2018-06-25
KR101895745B1 (ko) 2018-09-05
MY177676A (en) 2020-09-23
CN107614760A (zh) 2018-01-19

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