MY163132A - Cleaning formulations - Google Patents
Cleaning formulationsInfo
- Publication number
- MY163132A MY163132A MYPI2013701982A MYPI2013701982A MY163132A MY 163132 A MY163132 A MY 163132A MY PI2013701982 A MYPI2013701982 A MY PI2013701982A MY PI2013701982 A MYPI2013701982 A MY PI2013701982A MY 163132 A MY163132 A MY 163132A
- Authority
- MY
- Malaysia
- Prior art keywords
- post
- etch
- copper
- residue
- water
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 4
- 238000004140 cleaning Methods 0.000 title 1
- 238000009472 formulation Methods 0.000 title 1
- 238000004377 microelectronic Methods 0.000 abstract 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 abstract 1
- XLYOFNOQVPJJNP-PWCQTSIFSA-N Tritiated water Chemical compound [3H]O[3H] XLYOFNOQVPJJNP-PWCQTSIFSA-N 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 150000007524 organic acids Chemical class 0.000 abstract 1
- 239000003960 organic solvent Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/10—Salts
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/265—Carboxylic acids or salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3218—Alkanolamines or alkanolimines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3281—Heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5013—Organic solvents containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5022—Organic solvents containing oxygen
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/426—Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Inorganic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Detergent Compositions (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261717152P | 2012-10-23 | 2012-10-23 | |
| US201361817134P | 2013-04-29 | 2013-04-29 | |
| US14/010,748 US9536730B2 (en) | 2012-10-23 | 2013-08-27 | Cleaning formulations |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY163132A true MY163132A (en) | 2017-08-15 |
Family
ID=50484217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2013701982A MY163132A (en) | 2012-10-23 | 2013-10-21 | Cleaning formulations |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9536730B2 (enExample) |
| JP (3) | JP2014084464A (enExample) |
| KR (1) | KR101557979B1 (enExample) |
| CN (1) | CN103777475B (enExample) |
| MY (1) | MY163132A (enExample) |
| SG (1) | SG2013076922A (enExample) |
| TW (1) | TWI563077B (enExample) |
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| EP2828371A4 (en) * | 2012-03-18 | 2015-10-14 | Entegris Inc | AFTER CMP RECEPTURE WITH IMPROVED BARRIER LAYER COMPATIBILITY AND CLEANING PERFORMANCE |
| TWI572711B (zh) * | 2012-10-16 | 2017-03-01 | 盟智科技股份有限公司 | 半導體製程用的清洗組成物及清洗方法 |
| KR102153113B1 (ko) * | 2013-10-21 | 2020-09-08 | 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. | 표면 잔류물 제거용 세정 제형 |
| WO2015084921A1 (en) * | 2013-12-06 | 2015-06-11 | Fujifilm Electronic Materials U.S.A., Inc. | Cleaning formulation for removing residues on surfaces |
| US20150203753A1 (en) * | 2014-01-17 | 2015-07-23 | Nanya Technology Corporation | Liquid etchant composition, and etching process in capacitor process of dram using the same |
| US9957469B2 (en) * | 2014-07-14 | 2018-05-01 | Versum Materials Us, Llc | Copper corrosion inhibition system |
| JP6501492B2 (ja) | 2014-10-31 | 2019-04-17 | 関東化學株式会社 | フォトレジスト残渣および/またはポリマー残渣を除去するための組成物 |
| KR102347656B1 (ko) * | 2014-12-11 | 2022-01-07 | 동우 화인켐 주식회사 | 포토레지스트 애싱 후 잔류물 제거를 위한 세정제 조성물 |
| CN104570629B (zh) * | 2015-02-14 | 2016-04-13 | 江阴江化微电子材料股份有限公司 | —种液晶面板铜膜光阻水系剥离液 |
| TWI647337B (zh) * | 2015-03-31 | 2019-01-11 | 美商慧盛材料美國責任有限公司 | 清潔配方 |
| TWI818893B (zh) * | 2015-07-14 | 2023-10-21 | 美商富士軟片電子材料美國股份有限公司 | 清潔組成物及其使用方法 |
| US10233413B2 (en) * | 2015-09-23 | 2019-03-19 | Versum Materials Us, Llc | Cleaning formulations |
| US10400167B2 (en) * | 2015-11-25 | 2019-09-03 | Versum Materials Us, Llc | Etching compositions and methods for using same |
| US11035044B2 (en) * | 2017-01-23 | 2021-06-15 | Versum Materials Us, Llc | Etching solution for tungsten and GST films |
| KR102417180B1 (ko) * | 2017-09-29 | 2022-07-05 | 삼성전자주식회사 | Duv용 포토레지스트 조성물, 패턴 형성 방법 및 반도체 소자의 제조 방법 |
| EP3480288A1 (en) * | 2017-11-07 | 2019-05-08 | Henkel AG & Co. KGaA | Fluoride based cleaning composition |
| JP7330972B2 (ja) * | 2017-12-08 | 2023-08-22 | ビーエーエスエフ ソシエタス・ヨーロピア | 半導体基板からエッチング後または灰化後の残留物を除去するための洗浄剤組成物、およびそれに対応する製造方法 |
| CN109976108A (zh) * | 2017-12-27 | 2019-07-05 | 安集微电子(上海)有限公司 | 一种用于半导体的清洗液 |
| EP3743773B1 (en) * | 2018-01-25 | 2022-04-06 | Merck Patent GmbH | Photoresist remover compositions |
| US10752867B2 (en) | 2018-03-28 | 2020-08-25 | Fujifilm Electronic Materials U.S.A., Inc. | Cleaning compositions |
| US20220243150A1 (en) * | 2019-06-19 | 2022-08-04 | Versum Materials Us, Llc | Cleaning Composition For Semiconductor Substrates |
| WO2021011515A1 (en) * | 2019-07-15 | 2021-01-21 | Versum Materials Us, Llc | Compositions for removing etch residues, methods of using and use thereof |
| WO2021054010A1 (ja) * | 2019-09-18 | 2021-03-25 | 富士フイルムエレクトロニクスマテリアルズ株式会社 | 洗浄液、洗浄方法 |
| EP4034629A4 (en) * | 2019-09-27 | 2023-10-25 | Versum Materials US, LLC | COMPOSITIONS FOR REMOVAL OF ETCHING RESIDUE, METHOD FOR USE AND USE THEREOF |
| JP7419905B2 (ja) * | 2020-03-19 | 2024-01-23 | 日油株式会社 | 回路基板用樹脂膜剥離剤 |
| JP7759026B2 (ja) * | 2020-03-31 | 2025-10-23 | 日産化学株式会社 | 仮接着剤残留物洗浄剤組成物及び加工された半導体基板の製造方法 |
| KR20220012521A (ko) * | 2020-07-23 | 2022-02-04 | 주식회사 케이씨텍 | 세정액 조성물 및 이를 이용한 세정 방법 |
| WO2022024609A1 (ja) | 2020-07-30 | 2022-02-03 | 富士フイルム株式会社 | 処理液、基板の洗浄方法 |
| KR102782910B1 (ko) * | 2020-12-10 | 2025-03-14 | 동우 화인켐 주식회사 | 금속 함유 레지스트용 신너 조성물 |
| TWI800025B (zh) * | 2021-10-07 | 2023-04-21 | 德揚科技股份有限公司 | 清洗水溶液 |
| JPWO2023136081A1 (enExample) | 2022-01-17 | 2023-07-20 |
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| US8361237B2 (en) | 2008-12-17 | 2013-01-29 | Air Products And Chemicals, Inc. | Wet clean compositions for CoWP and porous dielectrics |
| WO2010104816A1 (en) * | 2009-03-11 | 2010-09-16 | Fujifilm Electronic Materials U.S.A., Inc. | Cleaning formulation for removing residues on surfaces |
| US8889609B2 (en) | 2011-03-16 | 2014-11-18 | Air Products And Chemicals, Inc. | Cleaning formulations and method of using the cleaning formulations |
-
2013
- 2013-08-27 US US14/010,748 patent/US9536730B2/en not_active Expired - Fee Related
- 2013-10-16 SG SG2013076922A patent/SG2013076922A/en unknown
- 2013-10-18 TW TW102137823A patent/TWI563077B/zh not_active IP Right Cessation
- 2013-10-21 MY MYPI2013701982A patent/MY163132A/en unknown
- 2013-10-22 JP JP2013219489A patent/JP2014084464A/ja active Pending
- 2013-10-22 KR KR1020130125968A patent/KR101557979B1/ko not_active Expired - Fee Related
- 2013-10-23 CN CN201310504991.2A patent/CN103777475B/zh not_active Expired - Fee Related
-
2015
- 2015-12-04 JP JP2015237884A patent/JP6546080B2/ja not_active Expired - Fee Related
-
2018
- 2018-05-23 JP JP2018098635A patent/JP2018164091A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR101557979B1 (ko) | 2015-10-06 |
| US20140109931A1 (en) | 2014-04-24 |
| TW201416436A (zh) | 2014-05-01 |
| JP6546080B2 (ja) | 2019-07-17 |
| KR20140051796A (ko) | 2014-05-02 |
| TWI563077B (en) | 2016-12-21 |
| US9536730B2 (en) | 2017-01-03 |
| JP2014084464A (ja) | 2014-05-12 |
| CN103777475B (zh) | 2018-09-21 |
| JP2018164091A (ja) | 2018-10-18 |
| CN103777475A (zh) | 2014-05-07 |
| JP2016040382A (ja) | 2016-03-24 |
| SG2013076922A (en) | 2014-05-29 |
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