MY151463A - Method for plating wiring board, and wiring board - Google Patents

Method for plating wiring board, and wiring board

Info

Publication number
MY151463A
MY151463A MYPI20095100A MY151463A MY 151463 A MY151463 A MY 151463A MY PI20095100 A MYPI20095100 A MY PI20095100A MY 151463 A MY151463 A MY 151463A
Authority
MY
Malaysia
Prior art keywords
wiring board
plating
masking film
target area
area
Prior art date
Application number
Other languages
English (en)
Inventor
Nemoto Kouji
Hishinuma Ryouhei
Oota Yosuke
Fukuhara Kuniaki
Original Assignee
Nippon Mektron Kk
Somar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron Kk, Somar Corp filed Critical Nippon Mektron Kk
Publication of MY151463A publication Critical patent/MY151463A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
MYPI20095100 2007-05-29 2008-05-29 Method for plating wiring board, and wiring board MY151463A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007142425A JP4982251B2 (ja) 2007-05-29 2007-05-29 配線基板のめっき方法及び配線基板

Publications (1)

Publication Number Publication Date
MY151463A true MY151463A (en) 2014-05-30

Family

ID=40075117

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20095100 MY151463A (en) 2007-05-29 2008-05-29 Method for plating wiring board, and wiring board

Country Status (7)

Country Link
JP (1) JP4982251B2 (zh)
KR (1) KR101419971B1 (zh)
CN (1) CN101690430B (zh)
DE (1) DE112008001439B4 (zh)
MY (1) MY151463A (zh)
TW (1) TWI435672B (zh)
WO (1) WO2008146884A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102373492A (zh) * 2010-08-13 2012-03-14 北大方正集团有限公司 电路板表面进行选择性电镀的方法和电路板
JP5718609B2 (ja) * 2010-10-07 2015-05-13 大倉工業株式会社 マスキングフィルム支持体
JP5872213B2 (ja) * 2011-09-08 2016-03-01 公益財団法人神奈川科学技術アカデミー 拡面処理された箔の製造方法
CN103515712B (zh) * 2012-06-15 2016-02-03 深圳光启创新技术有限公司 一种超材料及其制备方法
CN104968841B (zh) * 2012-12-20 2018-05-18 索马龙株式会社 电镀用屏蔽膜支持体及使用它的屏蔽膜
JP6176591B2 (ja) * 2013-12-25 2017-08-09 旭硝子株式会社 吸着層付き基板の梱包方法及び梱包体並びに吸着層付き基板の梱包装置
JP6418871B2 (ja) * 2014-09-26 2018-11-07 ソマール株式会社 めっき用マスキングフィルム
CN104328394B (zh) * 2014-11-03 2016-12-07 广州特种承压设备检测研究院 一种差异化复合式化学镀方法
KR101825198B1 (ko) * 2016-11-15 2018-02-05 (주)유에스티 동판에 실리콘 컴파운드를 접착하는 방법
TWI600072B (zh) * 2017-01-23 2017-09-21 Linco Technology Co Ltd Coated film burr removal method
JP2020156692A (ja) * 2019-03-26 2020-10-01 日東電工株式会社 電極接合構造及び生体センサ

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62243791A (ja) 1986-04-15 1987-10-24 Matsushita Electric Ind Co Ltd 電解めつき層の選択的形成方法
JPH02258880A (ja) * 1989-03-30 1990-10-19 Nitto Denko Corp プリント基板用マスキングテープおよび該テープを用いるプリント基板の製造法
JP2730826B2 (ja) * 1991-08-12 1998-03-25 積水化学工業株式会社 電子材料分野におけるめっきマスキングテープに用いるアルカリ水溶性粘着剤及び電子材料分野におけるめっきマスキングテープ
JP2806728B2 (ja) 1993-03-10 1998-09-30 積水化学工業株式会社 マスキングテープ
JPH07145364A (ja) * 1993-11-25 1995-06-06 Sekisui Chem Co Ltd アルカリ水溶性粘着剤組成物
JP3397913B2 (ja) 1994-12-14 2003-04-21 日立化成工業株式会社 めっきマスク粘着フィルム
JP3506194B2 (ja) 1995-07-11 2004-03-15 日立化成工業株式会社 メッキマスク用粘着フィルム
JP3114926B2 (ja) 1997-06-24 2000-12-04 日本特殊陶業株式会社 配線基板のメッキ用マスキング方法
JPH11302611A (ja) 1998-04-17 1999-11-02 Hitachi Chem Co Ltd メッキマスク用粘着フィルム
JP2003119441A (ja) * 2001-10-10 2003-04-23 Sekisui Chem Co Ltd メッキ用マスキングテープ
JP2003213485A (ja) 2002-01-15 2003-07-30 Nitto Denko Corp 金属メッキ用マスキングテープ
JP3936253B2 (ja) 2002-07-05 2007-06-27 日東電工株式会社 金属メッキ用マスキングテープ
JP4880877B2 (ja) * 2004-01-16 2012-02-22 リンテック株式会社 フレキシブルプリント配線基板の製造方法及び該製造方法に用いる再剥離性剥離材付き工程フィルム
DE102004021775A1 (de) 2004-04-30 2005-11-24 Tesa Ag Klebeband insbesondere zur Abdeckung von Fensterflanschen

Also Published As

Publication number Publication date
KR20100021635A (ko) 2010-02-25
TWI435672B (zh) 2014-04-21
TW200920206A (en) 2009-05-01
CN101690430B (zh) 2012-09-05
DE112008001439B4 (de) 2021-09-02
JP2008300441A (ja) 2008-12-11
KR101419971B1 (ko) 2014-07-16
DE112008001439T5 (de) 2010-06-10
WO2008146884A1 (ja) 2008-12-04
JP4982251B2 (ja) 2012-07-25
CN101690430A (zh) 2010-03-31

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