IN2014CN01630A - - Google Patents
Info
- Publication number
- IN2014CN01630A IN2014CN01630A IN1630CHN2014A IN2014CN01630A IN 2014CN01630 A IN2014CN01630 A IN 2014CN01630A IN 1630CHN2014 A IN1630CHN2014 A IN 1630CHN2014A IN 2014CN01630 A IN2014CN01630 A IN 2014CN01630A
- Authority
- IN
- India
- Prior art keywords
- component
- subassembly
- sheet
- conductor
- solder resist
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 abstract 5
- 239000004020 conductor Substances 0.000 abstract 4
- 238000010030 laminating Methods 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
- F21V21/002—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips making direct electrical contact, e.g. by piercing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Planar Illumination Modules (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP11180233 | 2011-09-06 | ||
US201261596758P | 2012-02-09 | 2012-02-09 | |
PCT/IB2012/054458 WO2013035021A1 (en) | 2011-09-06 | 2012-08-30 | Method for manufacturing a component interconnect board |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2014CN01630A true IN2014CN01630A (zh) | 2015-05-29 |
Family
ID=47831594
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN1637CHN2014 IN2014CN01637A (zh) | 2011-09-06 | 2012-08-29 | |
IN1630CHN2014 IN2014CN01630A (zh) | 2011-09-06 | 2012-08-30 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN1637CHN2014 IN2014CN01637A (zh) | 2011-09-06 | 2012-08-29 |
Country Status (7)
Country | Link |
---|---|
US (2) | US9232663B2 (zh) |
EP (2) | EP2742782B1 (zh) |
JP (2) | JP6032768B2 (zh) |
CN (2) | CN103766008B (zh) |
IN (2) | IN2014CN01637A (zh) |
RU (1) | RU2596800C2 (zh) |
WO (2) | WO2013035017A1 (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6133450B2 (ja) * | 2013-07-23 | 2017-05-24 | フィリップス ライティング ホールディング ビー ヴィ | 照明装置を製造するための方法 |
DE102014110068A1 (de) * | 2014-07-17 | 2016-01-21 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement |
KR101713818B1 (ko) | 2014-11-18 | 2017-03-10 | 피에스아이 주식회사 | 초소형 led 소자를 포함하는 전극어셈블리 및 그 제조방법 |
KR101672781B1 (ko) | 2014-11-18 | 2016-11-07 | 피에스아이 주식회사 | 수평배열 어셈블리용 초소형 led 소자, 이의 제조방법 및 이를 포함하는 수평배열 어셈블리 |
DE102015109764A1 (de) * | 2015-06-18 | 2016-12-22 | Infineon Technologies Ag | Eine Laminarstruktur, ein Halbleiterbauelementund Verfahren zum Bilden von Halbleiterbauelementen |
DE202015104272U1 (de) * | 2015-08-13 | 2016-11-15 | Zumtobel Lighting Gmbh | Leiterplatte mit mindestens zwei Bereichen zum Bestücken mit Bauteilen |
KR101730977B1 (ko) * | 2016-01-14 | 2017-04-28 | 피에스아이 주식회사 | 초소형 led 전극어셈블리 |
US10201093B2 (en) | 2016-03-30 | 2019-02-05 | GE Lighting Solutions, LLC | Variable width printed circuit board using surface mount technology jumpers |
FR3054640B1 (fr) | 2016-07-28 | 2020-06-12 | Linxens Holding | Dispositif emetteur de lumiere |
EP3664989B1 (en) | 2017-08-11 | 2021-05-05 | Signify Holding B.V. | Method for manufacturing a 3d item having an electrically conductive coil |
CN116970893B (zh) * | 2023-04-25 | 2024-04-30 | 先之科半导体科技(东莞)有限公司 | 一种改良型拉直组件 |
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JP2785646B2 (ja) * | 1993-05-20 | 1998-08-13 | トヨタ車体株式会社 | フレキシブル配線の製造方法 |
US5385848A (en) | 1993-09-20 | 1995-01-31 | Iowa Thin Film Technologies, Inc | Method for fabricating an interconnected array of semiconductor devices |
US5470644A (en) * | 1994-04-21 | 1995-11-28 | Durant; David | Apparatus and method for fabrication of printed circuit boards |
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JP2003142812A (ja) * | 2001-11-07 | 2003-05-16 | Alps Electric Co Ltd | チップ部品の実装方法 |
TW533750B (en) | 2001-11-11 | 2003-05-21 | Solidlite Corp | LED lamp |
TW558622B (en) * | 2002-01-24 | 2003-10-21 | Yuan Lin | Lamp on sheet and manufacturing method thereof |
JP4203374B2 (ja) * | 2003-08-06 | 2008-12-24 | 豊田合成株式会社 | 発光装置 |
JP2005063995A (ja) * | 2003-08-08 | 2005-03-10 | John Popovich | 発光ダイオードストリップランプ |
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-
2012
- 2012-08-29 JP JP2014527789A patent/JP6032768B2/ja not_active Expired - Fee Related
- 2012-08-29 RU RU2014113355/07A patent/RU2596800C2/ru active
- 2012-08-29 CN CN201280043324.2A patent/CN103766008B/zh not_active Expired - Fee Related
- 2012-08-29 US US14/241,187 patent/US9232663B2/en not_active Expired - Fee Related
- 2012-08-29 WO PCT/IB2012/054436 patent/WO2013035017A1/en active Application Filing
- 2012-08-29 IN IN1637CHN2014 patent/IN2014CN01637A/en unknown
- 2012-08-29 EP EP12778797.6A patent/EP2742782B1/en not_active Not-in-force
- 2012-08-30 US US14/239,549 patent/US9839141B2/en not_active Expired - Fee Related
- 2012-08-30 JP JP2014527793A patent/JP6125504B2/ja active Active
- 2012-08-30 IN IN1630CHN2014 patent/IN2014CN01630A/en unknown
- 2012-08-30 CN CN201280043238.1A patent/CN103782668B/zh not_active Expired - Fee Related
- 2012-08-30 EP EP12778423.9A patent/EP2742784B1/en not_active Not-in-force
- 2012-08-30 WO PCT/IB2012/054458 patent/WO2013035021A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
EP2742782A1 (en) | 2014-06-18 |
CN103766008B (zh) | 2017-08-01 |
JP2014528161A (ja) | 2014-10-23 |
CN103782668B (zh) | 2017-02-15 |
US20140215817A1 (en) | 2014-08-07 |
IN2014CN01637A (zh) | 2015-05-08 |
EP2742784A1 (en) | 2014-06-18 |
JP6125504B2 (ja) | 2017-05-10 |
JP2014532294A (ja) | 2014-12-04 |
CN103766008A (zh) | 2014-04-30 |
WO2013035021A1 (en) | 2013-03-14 |
JP6032768B2 (ja) | 2016-11-30 |
US9232663B2 (en) | 2016-01-05 |
RU2014113397A (ru) | 2015-10-20 |
US9839141B2 (en) | 2017-12-05 |
WO2013035017A1 (en) | 2013-03-14 |
EP2742784B1 (en) | 2014-12-03 |
RU2014113355A (ru) | 2015-10-20 |
CN103782668A (zh) | 2014-05-07 |
EP2742782B1 (en) | 2015-05-13 |
US20140209942A1 (en) | 2014-07-31 |
RU2596800C2 (ru) | 2016-09-10 |
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