CN103782668A - 用于制造组件互连板的方法 - Google Patents
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Abstract
提供了一种用于制造组件互连板(150)的方法,该组件互连板(150)包括用于在安装在组件板上时为至少一个组件(114)提供电路的导体结构,该方法包括为导体薄片(110)提供第一预定图案(115),为阻焊薄片提供第二预定图案以便定义组件板的焊料区域(125),通过将阻焊薄片层压在导体薄片之上而形成子装配件,将焊料应用到该子装配件上,将至少一个组件置于该子装配件上,执行焊接,并且将该子装配件层压至衬底(130)。该阻焊薄片进一步被部署为用作该导体薄片的载体。
Description
技术领域
本发明总体上涉及发光二极管照明器材的领域,尤其涉及一种制造用于发光二极管照明器材的组件互连板的方法。
背景技术
在发光二极管(LED)照明器材的成本降低中,组件到电路的互连的解决方案(或者当组件是电路的一部分时,在下文中被称作二级(L2)互连)由于两个主要原因而变得越来越重要。首先,LED的成本在下降;其次在许多LED照明器材设计中,几乎没有为例如外壳部分的成本下降留有空间。这两个原因导致了L2互连对于总系统成本的重要性的相对增加。
图1示意性图示了典型的L2互连,其中这里为封装LED10的组件通过焊接而与为印刷电路板PCB的LED板50进行互连。LED板通常作为叠片(stack)提供。LED板50包括用于提供LED板50所要求的鲁棒性或柔性的承载衬底51。用于提供LED板50的基本绝缘的一个或多个电介质层55通常与环氧树脂共同层压到衬底5l上。在衬底51的顶部,还在整个表面积上层压以导体层。该导体层随后被化学蚀刻以提供最终的导体结构52和电路。该蚀刻处理本质上是非连续的分批处理。LED10利用焊接而被互连至导体结构52。在将焊料53应用于LED板之前,其通常被涂覆以焊料掩模,这是带图案的阻焊层54,其定义出要应用焊料的区域。通常为20-30微米厚的阻焊层54可以是在所分配和固化的聚合物材料的胶印过程中所应用的聚合物涂层。阻焊层54防止焊料桥接在导体52之间而形成短路,并且可以进一步提供针对环境的保护。
然而,PCB的整个叠片通常通过层压产生,导体电路52和阻焊层54的实际最终结果通过非连续的处理而形成。这些分批处理并未由于更大生产量而带来成本的明显下降。
另外,就材料利用而言,在采用必要和贵重导体层特性的方面几乎没有灵活性。当提供导体结构52时,首先将铜质层应用于整个L2处理的面板表面,随后进行铜的图案形成和去除,这非常耗时并且使得化学蚀刻溶剂饱和。为了更好的热量管理,形成较厚的层也耗费了额外的时间和能量。
除了以上所描述的L2互连类型的标准PCB之外,还有许多其它类型的L2互连,它们大多数由于高成本和复杂度的原因而是不相关的。一种相对低成本并且可用于较不复杂电路的解决方案是使用引线框架(1ead-frame)。通常,这意味着将组件放置在刚性、可能弯曲的导体框架上,最后的阶段对该导体框架进行处理以提供所需电路。该引线框架可以主要根据大小和复杂度而以不同方式产生,例如机械冲压或化学蚀刻。这种方法存在一些典型缺陷。首先,随着创建最终的电路,最初的引线框架将逐步分解而失去其机械完整性。人们能够设计具有通过诸如通常为更大机械引线框架中的电气组件的机械应力,或者在能够部署电气组件之前,能够在形成最终电路的同时引入例如塑料二次成型的一些特征来提供必要的刚性。此外,总之这些类型的解决方案并未提供必要的电子绝缘要求,而电介质并未得以应用或者仅在有限区域内应用。所规定的蠕变和间隙距离难以进行管理或者整合到L2互连设计之中,并且必须主要在照明器材/系统层面进行管理。最后,如果想要对热管理进行优化并且散热器和/或散热片由导电材料制成,则必须要在照明器材/系统层面上引入单独的电介质组件。
发明内容
鉴于上文,本发明的目标是至少缓解以上所讨论的问题。具体地,其目标是提供一种用于以更为材料有效、更快且更为经济的方式制造组件互连板的方法。
该目标通过如权利要求1所限定的根据本发明的一种用于制造组件互连板的方法而实现。本发明基于以下观点,通过从基于薄片的阻焊和导体材料开始,并且利用阻焊薄片作为导体薄片的载体,能够使用机械加工以便制作最终的电路。
因此,依据本发明的一个方面,提供了一种用于制造组件互连板的方法,该组件互连板包括用于在安装在组件板上时为至少一个组件提供电路的导体结构。该方法包括为导体薄片提供第一预定图案,为阻焊薄片提供第二预定图案以便定义组件板的焊料区域,通过将阻焊薄片层压在导体薄片的顶端而形成子装配件,将焊料应用到该子装配件上,将至少一个组件置于该子装配件上,执行焊接,并且将该子装配件层压至衬底。在该子装配件中,该阻焊薄片进一步被部署为用作带图案的导体薄片的载体,由此在制造步骤期间保持了该子装配件的完整性。该电路的制造和组装因此与衬底去耦合,其好处在于能够自由选择衬底以便例如提供适当的散热,提供从安装在该组件互连板上的LED的低光线泄露,或者提供可控的蠕变和间隙距离。去耦合进一步允许对载体衬底进行单独处理以便对衬底进行优化并且最大程度地利用其具体机械、光学或热特性。
另外,在从带图案的导体薄片提供导体结构时能够获得如铜和铝之类的高价值材料的高利用因数。如以下将进一步描述的,当在较大衬底上对单个电路子装配件进行延展或者分布多个电路子装配件时尤其如此。
由于使用了薄片材料,该方法可以以整卷(roll-to-roll)处理来实施,而这是有利的。与以上所提到的并未由于更大生产量而带来成本的明显下降的分批处理相反,如整卷处理的连续处理对于规模经济非常敏感并且因此对于大量生成是成本有效的。在整卷处理中,允许大尺寸的电路,例如可能为无限长度。在照明器材/系统上无需昂贵的L2互连至L2互连的连接器。
另外,该发明方法能够提供机械装置的大容量利用,原因在于子装配件和中间产品能够单独生产和库存。该制造方法的每个步骤可以对应于其自己灵活的机器。
通常,本发明与引线框架类型的解决方案相比在布局设计方面提供了高自由度。这是因为在引线框架类型的L2互连的设计中,在电路布局自由度和机械刚性/完整性之间存在着权衡。在本发明中,这两种不同功能由两个不同的层进行管理。此外,在当前PCB类型的L2互连解决方案中,人们能够通过相对昂贵的铣削加工步骤来选择应用轮廓的自由成形,或者被限制为产生典型矩形形状的直线切割。在本发明中,电路装配件与衬底去耦合,这意味着针对更大或更复杂的最终装配件的设计主要影响到衬底的设计和材料利用,而更贵重的电路装配件则可以保持不变。
根据该方法的实施例,其进一步包括对该子装配件进行切割以提供具有与导体结构相对应的最终预定图案的导体薄片,如果第一预定图案并不对应于所需导体结构,这是有利的。
根据该方法的实施例,其进一步包括利用分割、将子装配件剪裁成预定轮廓以及延展中的一种而提供子装配件的机械形变。例如,为了形成大尺寸的组件互连板,创建电路并且首先进行组件的挑选和放置并且随后在将其最终变换为衬底之前将子装配件延展至所需大小会是有利的。优选地,该导体结构被提供以可提取的导体部分。随后利用尽可能高的密度来执行组件挑选和放置,这是有利的。优选地,在放置于载体衬底上之前,包括具有可提取导体部分的导体结构的该子装配件随后被延展至优化的总体表面面积和厚度。该衬底可以是最终产品或载体,例如照明器材的外壳部分、内部或外部反射体、玻璃窗口面板、吸音泡沫等。
将电路制造从衬底分离开来进一步允许在向衬底应用子装配件之前在衬底中整合各种另外的功能,如机械固定、光学反射体和电连接器。
根据该方法的实施例,其进一步包括提供该子装配件的三维形变以便提供以下之一:如光谱或散射反射体的光学特性、例如通过弯曲或凸起进行的组件互连板的机械固定、如附近的模光学器件或局部散热片的附加组件的机械固定、热属性和连接器功能。
根据本发明的实施例,该衬底可以是柔性的和/或三维的。
另外,在该方法的一个实施例中,该衬底是可机械形变的。这可以利用将衬底分割和剪裁为预定轮廓中的一种而完成。
根据该方法的实施例,其进一步包括提供该衬底的三维形变以便提供以下之一:如光谱或散射反射体的光学特性、例如通过弯曲或凸起进行的组件互连板的机械固定、如附近的模光学器件或局部散热片的附加组件的机械固定、热属性和连接器功能。可选地,该衬底可以结合用于提供附加功能的特征,诸如安装或定位,诸如提供卡扣配合特征、用于主要光学器件的开槽或开孔、例如通过仿形而增加刚度。
根据该方法的实施例,该导体结构进一步被部署为用作连接器。
根据该方法的实施例,第一预定图案和第二预定图案中的至少一个利用切割、冲压或割缝来完成。
所描述的发明可在LED产品中广泛应用。其对于具有相对高的热负载对体积比的LED模块、LED灯具而言是非常有利的,因为该解决方案能够在低成本的同时针对热管理进行优化。其对于LED板平台和大面积照明器材而言一般是有利的,因为该解决方案提供了一种在低成本的同时在大表面面积上分布LED的新颖方式并且甚至可能整合有照明器材外壳的功能。
其它的目标、特征和优势将由于以下详细描述、所附从属权利要求以及附图而是显而易见的。
附图说明
本发明的以上以及其它的目标、特征和优势将通过以下参考附图对本发明优选实施例所进行的说明性且非限制性的详细描述而被更好地理解,其中相同的附图标记将被用于相似的要素,其中:
图1是示意性图示现有技术的L2互连的截面侧视图;
图2是示意性图示根据本发明的方法的实施例的流程图;
图3是示意性图示根据本发明的方法的实施例的流程图;
图4是根据本发明的方法的实施例在以整卷生产线中实施时的示意性图示。
具体实施方式
现在将参考图2、3和4对根据本发明的用于制造组件互连板的方法的示例实施例进行描述。该方法的步骤被示为数字序列,然而一些步骤可以以其它顺序来执行。
现在参考图2,并且以步骤1100开始,首先提供导体薄片100。该导体薄片100优选地在包括铜和银的金属薄片材料的群组中进行选择。导体薄片100在步骤1101中被预切割以应用对应于具体电子布局的第一预定图案115,同时仍然保持必要的完整性。
在并行步骤1102,阻焊薄片112被预切割以提供第二预定图案,其在这里定义了用于定义焊料区域的开口125,同时仍然保持必要的完整性。
带图案导体薄片111和带图案阻焊薄片112被保持的完整性至少在整卷处理中实施该方法的步骤时是特别重要的,这将在以下参考图4描述。
继续参考图2,带图案导体薄片111和带图案阻焊薄片112在步骤1103中被层压以形成子装配件120。
在步骤1104,焊料113被应用于由阻焊薄片112中的开口125所定义的清除区域。
随后在步骤1105,执行例如LED的组件114的挑选和放置,随后在步骤1106中进行焊接,这可以是回流焊接处理。可选地,如果有必要,子装配件120在步骤1107中进行切割以提供对应于导体结构的最终预定图案116,上述导体结构即组件114的电路。在步骤1108中,现在包含最终电路和组件114的子装配件120被分割(切割)为多个部分,它们在这里形成了两个子装配件120a和120b。在最后的步骤1109,在考虑蠕变和间隙的情况下将子装配件120的部分120a(未示出)和120b层压至适当衬底130,产生组件互连板150。在该方法的实施例中,衬底或组件互连板可以进一步机械形变以增加功能,例如针对主要光学器件的安装特征或定位特征。
步骤1108中子装配件的机械形变是可选的,并且在该方法的实施例中可以包括将子装配件(和/或在如以上步骤1108中所描述的那样执行子装配件的分割时该子装配件的各部分)剪裁为预定轮廓。
图3是示意性图示根据本发明的方法的实施例的流程图。在步骤1200开始,首先提供导体薄片200。导体薄片200在步骤1201中被预切割以应用对应于具体电子布局的第一预定图案215,同时仍然保持必要的完整性。该第一预定图案215包括以n行和m列排列的m×n个组件区域的矩阵Cn×m,这里n=3且m=3,例如参见组件要被焊接到那里的连接区域212a和212b,在带图案导体薄片211的示意性特写图中,该连接区域212a和212b共同构成组件区域C3,1。而且,基本上U形的导体部分216被设置为互连相邻的导体区域Cn,m。如图3所示,从导体薄片200切除导体部分216,其中通过保留桥接部分217a而保持完整性。
在并行步骤1202中,阻焊薄片212被预切割以提供第二预定图案,其在这里包括覆盖区域226,它对应于其中排列有用于定义焊料区域的开口225的带图案导体薄片211的每个组件区域Cn,m。另外,每个覆盖区域226利用部署在对应于带图案导体薄片211的桥接部分217a的位置的桥217进行互连。
带图案导体薄片211和带图案阻焊薄片212被保持的完整性至少在该方法的步骤以以下参考图4所描述的整卷处理来实施时是特别重要的。
继续参考图3,在步骤1203,带图案导体薄片211被层压至带图案阻焊薄片212以形成子装配件220。在步骤1204,焊料213被应用于开口225所定义的清除区域。随后,在步骤1205中执行例如LED的组件214的挑选和放置,随后在步骤1206中进行焊接,这可以是回流焊接处理。
在步骤1207,子装配件220被切割以提供对应于导体结构即对组件214的电子电路的最终预定图案。这里,例如通过冲压而对桥217a和217的部分同时进行剪裁以使得导体部分216不再被桥接。
在步骤1208中,现在包含最终电路和组件214的子装配件220被机械变形。组件区域的矩阵Cn,m被延展,由此对导体部分216进行拉直而使得组件214之间的距离和L2互连表面面积(子装配件220的面积)增加。这里,该延展在两个维度中进行。
在最终的步骤1209,在考虑蠕变和间隙的情况下将经延展的子装配件220层压至适当衬底230,产生组件互连板250。在该方法的实施例中,衬底或组件互连板可以进一步机械形变以增加功能,例如针对主要光学器件的安装特征或定位特征。
依据根据本发明的方法的实施例,其以整卷处理进行实施而生产大量的照明设备(即,对应于根据本发明的组件互连板的最终产品设备)。在整卷处理中,配备有生产设施利用滚轮馈送的薄片材料而不是个体薄片来执行生产的主要部分。现在参考图4,其示意性图示了整卷生产线,包括用于本发明的图案形成、割缝和层压步骤的机器。该生产线在这里至少部分地以参考图2所描述的方法的附图标记和方法步骤进行描述。然而,在整卷处理中,参考薄膜而不是个体薄片对步骤进行描述,例如导体薄片100在这里被称作导体薄膜100。继续参考图4,导体薄膜100从馈送滚轮400提供[步骤1100]至图案形成机器401中,其中冲压或切割[步骤1101]出连续的一系列第一预定图案115。在并行处理中,从电阻薄膜402的馈送滚轮提供带图案的电阻薄膜112被送至图案形成机器403中,其中冲压或切割[步骤1102]出连续的一系列第二预定图案125。带图案导体薄膜111和带图案电阻薄膜112随后被送至层压站点404(例如,通过应用粘合剂或机械压力和高温)而形成子装配件薄膜120。子装配件薄膜120随后被送入机器以便应用焊料[步骤1104]、组件挑选和放置[步骤1105]、组件焊接[步骤1106]以及子装配件薄膜的机械形变[步骤1107,11081,以便例如提供最终电路并且形成对应于相应照明设备的单独子装配件120’。这里,在完成电路制作之后,提供了所需的衬底130。该衬底在包括所需形变等[步骤1110,图2中未示出]的制造步骤之后可以是提供在馈送线上的单独衬底。该衬底还可以直接从馈送滚轮提供。
将子装配件的制造与衬底去耦合是有利的,原因在于其允许具体处理以其自然速度运行,并且进一步提高了在相同处理线中对不同设计的组件互连板进行处理的灵活性。
另外,将子装配件的处理和衬底去耦合促进了增加或者从处理线去除可选处理步骤,例如可以在对具体组件设计而言并非必要的情况下去除子装配件的3D成形。而且,当从一种工厂设计变为另一种工厂设计时,如果处理被去耦合,则在使得机器可再次操作之前不必再交换所有处理步骤的工具。
继续参考图4,子装配件120’和衬底130最终被进行层压以形成最终产品150[步骤1109]。可选地,可以在最终产品上执行例如切割为单独产品、应用额外环境封装等的最终处理步骤[步骤1111]。
利用滚轮工具的机器对于它们非常高速的运行而言是有利的,并且能够被一个或多个图4中步骤1101、1102、1107、1108和1111中的虚线滚轮所指示的一个或多个不同方法步骤所使用。
在如以上所描述的整卷处理的步骤中,各个步骤的速度可能存在差异。特别地,挑选和放置组件的步骤[步骤1105]是对于不同电路设计而言具有不同处理速度的步骤。该相对高价值的处理步骤与昂贵机器关联,并且因此可能成为整个生产线的瓶颈。根据该方法的实施例(未示出),因此将组件的挑选和放置从如参考图4所描述的整卷处理中移出。以这种方式,对每个新的设计整卷生产线能够以优化速度进行操作而提供最高的机器利用因数。该速度可能进一步在具体设计中可变。因此,能够使用具有灵活工具的相同生产线而形成相应照明设备的不同设计。最终,这意味着直至并且包括步骤1103所制造的子装配件120是中间结果,其可以利用多种设计120a、120b等来形成。这些可以置于库存而形成作为挑选和放置步骤1105的可变速度的结果的必要缓冲。
以上已经主要参考一些实施例对本发明进行了描述。然而,如本领域技术人员将会轻易意识到的,以上所公开的以外的其它实施例同样可能处于如所附权利要求所定义的本发明的范围之内。
Claims (10)
1.一种用于制造组件互连板(150)的方法,所述组件互连板(150)包括用于在安装在所述组件板上时为至少一个组件(114)提供电路的导体结构,所述方法包括:
为导体薄片(110)提供第一预定图案(115);
为阻焊薄片(112)提供第二预定图案以便定义所述组件板的焊料区域(125);
通过将所述阻焊薄片层压在所述导体薄片之上而形成子装配件(120);
将焊料应用到所述子装配件上;
将所述至少一个组件置于所述子装配件上;
执行焊接;并且
将所述子装配件层压至衬底(130),
其中在所述子装配件中,所述阻焊薄片进一步被部署为用作用于所述导体薄片的载体。
2.根据权利要求1的方法,进一步包括对所述子装配件进行切割以为所述导体薄片提供与所述导体结构相对应的最终预定图案。
3.根据权利要求1或2的方法,进一步包括利用分割、将所述子装配件剪裁为预定轮廓和延展中的一种而提供所述子装配件的机械形变。
4.根据之前任一项权利要求的方法,进一步包括提供所述子装配件的三维形变以便提供以下之一:光学特性、所述组件互连板的机械固定、附加组件的机械固定、热属性和连接器功能。
5.根据之前任一项权利要求的方法,其中所述衬底是柔性的。根据之前任一项权利要求的方法,其中所述衬底是三维的。
6.根据之前任一项权利要求的方法,进一步利用分割以及将所述衬底剪裁为预定轮廓中的一种而提供所述衬底的机械形变。
7.根据之前任一项权利要求的方法,其中所述导体结构进一步被部署为用作连接器。
8.根据之前任一项权利要求的方法,其中所述第一预定图案(115)和所述第二预定图案中的至少一个利用切割、冲压或割缝来完成。
9.根据之前任一项权利要求的方法,以整卷处理来执行。
10.根据之前任一项权利要求的方法,其中所述预定第一图案适于提供可提取的导体部分。
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CN106257663A (zh) * | 2015-06-18 | 2016-12-28 | 英飞凌科技股份有限公司 | 叠层结构、半导体器件和用于形成半导体器件的方法 |
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EP2742784A1 (en) | 2014-06-18 |
JP6125504B2 (ja) | 2017-05-10 |
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US20140215817A1 (en) | 2014-08-07 |
JP6032768B2 (ja) | 2016-11-30 |
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CN103782668B (zh) | 2017-02-15 |
WO2013035017A1 (en) | 2013-03-14 |
JP2014528161A (ja) | 2014-10-23 |
IN2014CN01637A (zh) | 2015-05-08 |
RU2014113355A (ru) | 2015-10-20 |
CN103766008B (zh) | 2017-08-01 |
IN2014CN01630A (zh) | 2015-05-29 |
US9839141B2 (en) | 2017-12-05 |
EP2742782A1 (en) | 2014-06-18 |
RU2596800C2 (ru) | 2016-09-10 |
RU2014113397A (ru) | 2015-10-20 |
JP2014532294A (ja) | 2014-12-04 |
WO2013035021A1 (en) | 2013-03-14 |
EP2742784B1 (en) | 2014-12-03 |
CN103766008A (zh) | 2014-04-30 |
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