WO2013071197A3 - Printed circuit boards with embedded electro-optical passive element for higher bandwidth transmission - Google Patents

Printed circuit boards with embedded electro-optical passive element for higher bandwidth transmission Download PDF

Info

Publication number
WO2013071197A3
WO2013071197A3 PCT/US2012/064562 US2012064562W WO2013071197A3 WO 2013071197 A3 WO2013071197 A3 WO 2013071197A3 US 2012064562 W US2012064562 W US 2012064562W WO 2013071197 A3 WO2013071197 A3 WO 2013071197A3
Authority
WO
WIPO (PCT)
Prior art keywords
conductive
printed circuit
passive element
conductive via
optical passive
Prior art date
Application number
PCT/US2012/064562
Other languages
French (fr)
Other versions
WO2013071197A2 (en
Inventor
Vladimir DUVANENKO
Original Assignee
Sanmina Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanmina Corporation filed Critical Sanmina Corporation
Priority to KR1020147015368A priority Critical patent/KR102000804B1/en
Priority to CN201280066454.8A priority patent/CN104041200B/en
Priority to EP12847074.7A priority patent/EP2777370A4/en
Priority to JP2014541357A priority patent/JP6133884B2/en
Publication of WO2013071197A2 publication Critical patent/WO2013071197A2/en
Publication of WO2013071197A3 publication Critical patent/WO2013071197A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Abstract

A printed circuit board (PCB) is provided comprising a plurality of non-conductive layers with conductive or signal layers in between. The PCB includes a first conductive via traversing the plurality of non-conductive and conductive or signal layers as well as a second conductive via traversing the plurality of non-conductive layers and conductive or signal layers, the second conductive via located substantially parallel to the first conductive via. An embedded electro-optical passive element is also provided that extends perpendicular to and between the first conductive via and the second conductive via. The electro-optical passive element embedded is located within a selected layer at a first depth in the printed circuit board, wherein such first depth is selected to reflect an incident electromagnetic wave back into the printed circuit board to enhance or diminish an electrical signal in the first conductive via by creating a positive or negative electromagnetic interference.
PCT/US2012/064562 2011-11-09 2012-11-09 Printed circuit boards with embedded electro-optical passive element for higher bandwidth transmission WO2013071197A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020147015368A KR102000804B1 (en) 2011-11-09 2012-11-09 Printed circuit with embedded electro-optical passive element for higher bandwidth transmission
CN201280066454.8A CN104041200B (en) 2011-11-09 2012-11-09 Printed circuit board (PCB) with the embedded electric light passive element transmitted for higher bandwidth
EP12847074.7A EP2777370A4 (en) 2011-11-09 2012-11-09 Printed circuit boards with embedded electro-optical passive element for higher bandwidth transmission
JP2014541357A JP6133884B2 (en) 2011-11-09 2012-11-09 Printed circuit board with embedded electrical passive element for high frequency transmission

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161557883P 2011-11-09 2011-11-09
US61/557,883 2011-11-09

Publications (2)

Publication Number Publication Date
WO2013071197A2 WO2013071197A2 (en) 2013-05-16
WO2013071197A3 true WO2013071197A3 (en) 2013-07-11

Family

ID=48222943

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2012/064562 WO2013071197A2 (en) 2011-11-09 2012-11-09 Printed circuit boards with embedded electro-optical passive element for higher bandwidth transmission

Country Status (6)

Country Link
US (1) US9433078B2 (en)
EP (1) EP2777370A4 (en)
JP (1) JP6133884B2 (en)
KR (1) KR102000804B1 (en)
CN (1) CN104041200B (en)
WO (1) WO2013071197A2 (en)

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US8889999B2 (en) * 2011-10-24 2014-11-18 Cisco Technology, Inc. Multiple layer printed circuit board with unplated vias
US9545003B2 (en) * 2012-12-28 2017-01-10 Fci Americas Technology Llc Connector footprints in printed circuit board (PCB)
US9955568B2 (en) * 2014-01-24 2018-04-24 Dell Products, Lp Structure to dampen barrel resonance of unused portion of printed circuit board via
WO2015183797A1 (en) * 2014-05-27 2015-12-03 R&D Circuits, Inc Structure for isolating high speed digital signals in a high density grid array
US9775231B2 (en) 2014-11-21 2017-09-26 Amphenol Corporation Mating backplane for high speed, high density electrical connector
US9571059B2 (en) * 2015-03-28 2017-02-14 Intel Corporation Parallel via to improve the impedance match for embedded common mode filter design
US10201074B2 (en) 2016-03-08 2019-02-05 Amphenol Corporation Backplane footprint for high speed, high density electrical connectors
WO2017155997A1 (en) 2016-03-08 2017-09-14 Amphenol Corporation Backplane footprint for high speed, high density electrical connectors
TWI619302B (en) * 2016-05-06 2018-03-21 明泰科技股份有限公司 Impedance matching structure of transmission line
CN106102308B (en) * 2016-06-28 2019-05-10 Oppo广东移动通信有限公司 The ground structure and mobile terminal of the shield bracket of mobile terminal
US10122057B2 (en) 2016-09-25 2018-11-06 International Business Machines Corporation Bandwidth increase method for differential passive elements
US10091873B1 (en) * 2017-06-22 2018-10-02 Innovium, Inc. Printed circuit board and integrated circuit package
US10917976B1 (en) * 2017-07-12 2021-02-09 Juniper Networks, Inc. Designing a printed circuit board (PCB) to detect slivers of conductive material included within vias of the PCB
US10524351B2 (en) * 2018-01-02 2019-12-31 Qualcomm Incorporated Printed circuit board (PCB) with stubs coupled to electromagnetic absorbing material
US10477672B2 (en) * 2018-01-29 2019-11-12 Hewlett Packard Enterprise Development Lp Single ended vias with shared voids
KR102063470B1 (en) * 2018-05-03 2020-01-09 삼성전자주식회사 Semiconductor package
WO2019241107A1 (en) 2018-06-11 2019-12-19 Amphenol Corporation Backplane footprint for high speed, high density electrical connectors
CN108633172B (en) 2018-08-23 2019-11-26 合肥鑫晟光电科技有限公司 Printed circuit board and display device
TW202109986A (en) 2019-05-20 2021-03-01 美商安芬諾股份有限公司 High density, high speed electrical connector
CN110416177B (en) * 2019-06-25 2021-08-10 苏州浪潮智能科技有限公司 Memory module
TW202147717A (en) 2020-01-27 2021-12-16 美商安芬諾股份有限公司 Electrical connector with high speed mounting interface
WO2021154823A1 (en) 2020-01-27 2021-08-05 Amphenol Corporation Electrical connector with high speed mounting interface
CN113597100A (en) * 2021-06-23 2021-11-02 浪潮电子信息产业股份有限公司 Method, circuit board, equipment and storage medium for optimizing differential via impedance

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US20060151205A1 (en) * 2005-01-12 2006-07-13 Lim Jeong-Pil Multilayer printed circuit board
US7375290B1 (en) * 2006-10-11 2008-05-20 Young Hoon Kwark Printed circuit board via with radio frequency absorber
US20080308313A1 (en) * 2007-06-14 2008-12-18 Dan Gorcea Split wave compensation for open stubs
US20100319980A1 (en) * 2009-06-23 2010-12-23 Hyung Ho Kim Printed circuit board
US20110094786A1 (en) * 2009-10-27 2011-04-28 Hon Hai Precision Industry Co., Ltd. Printed circuit board

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Publication number Priority date Publication date Assignee Title
US20060151205A1 (en) * 2005-01-12 2006-07-13 Lim Jeong-Pil Multilayer printed circuit board
US7375290B1 (en) * 2006-10-11 2008-05-20 Young Hoon Kwark Printed circuit board via with radio frequency absorber
US20080308313A1 (en) * 2007-06-14 2008-12-18 Dan Gorcea Split wave compensation for open stubs
US20100319980A1 (en) * 2009-06-23 2010-12-23 Hyung Ho Kim Printed circuit board
US20110094786A1 (en) * 2009-10-27 2011-04-28 Hon Hai Precision Industry Co., Ltd. Printed circuit board

Also Published As

Publication number Publication date
KR102000804B1 (en) 2019-07-16
JP6133884B2 (en) 2017-05-24
WO2013071197A2 (en) 2013-05-16
CN104041200A (en) 2014-09-10
US20130112465A1 (en) 2013-05-09
JP2014534642A (en) 2014-12-18
EP2777370A4 (en) 2015-07-22
EP2777370A2 (en) 2014-09-17
KR20140097313A (en) 2014-08-06
US9433078B2 (en) 2016-08-30
CN104041200B (en) 2017-07-28

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