MX350116B - Metodo para reducir la corrosion por fluencia. - Google Patents
Metodo para reducir la corrosion por fluencia.Info
- Publication number
- MX350116B MX350116B MX2013005144A MX2013005144A MX350116B MX 350116 B MX350116 B MX 350116B MX 2013005144 A MX2013005144 A MX 2013005144A MX 2013005144 A MX2013005144 A MX 2013005144A MX 350116 B MX350116 B MX 350116B
- Authority
- MX
- Mexico
- Prior art keywords
- electrically conductive
- conductive tracks
- creep corrosion
- reducing creep
- substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09872—Insulating conformal coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Un método para reducir la corrosión por fluencia sobre un tablero de circuito impreso, el tablero de circuito impreso comprende un substrato, una pluralidad de pistas eléctricamente conductoras ubicadas sobre por lo menos una superficie del substrato, una máscara de soldadura que cubre por lo menos una primera área de la pluralidad de pistas eléctricamente conductoras y un acabado superficial de conformidad que cubre por lo menos una segunda área de la pluralidad de pistas eléctricamente conductoras, el método comprende depositar mediante polimerización por plasma un fluorohidrocarburo sobre por lo menos parte de la máscara de soldadura y por lo menos parte del acabado superficial.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1019302.7A GB2485419B (en) | 2010-11-15 | 2010-11-15 | Method for reducing creep corrosion |
PCT/GB2011/001579 WO2012066273A1 (en) | 2010-11-15 | 2011-11-09 | Method for reducing creep corrosion |
Publications (2)
Publication Number | Publication Date |
---|---|
MX2013005144A MX2013005144A (es) | 2013-12-02 |
MX350116B true MX350116B (es) | 2017-08-28 |
Family
ID=43431471
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2013005144A MX350116B (es) | 2010-11-15 | 2011-11-09 | Metodo para reducir la corrosion por fluencia. |
Country Status (15)
Country | Link |
---|---|
US (1) | US20130240256A1 (es) |
EP (1) | EP2641456A1 (es) |
JP (1) | JP6238747B2 (es) |
KR (1) | KR20130114180A (es) |
CN (1) | CN103210704B (es) |
AU (1) | AU2011330946B2 (es) |
BR (1) | BR112013011924A2 (es) |
CA (1) | CA2816840A1 (es) |
GB (1) | GB2485419B (es) |
MX (1) | MX350116B (es) |
MY (1) | MY163049A (es) |
RU (1) | RU2573583C2 (es) |
SG (1) | SG190163A1 (es) |
TW (1) | TWI557272B (es) |
WO (1) | WO2012066273A1 (es) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0703172D0 (en) | 2007-02-19 | 2007-03-28 | Pa Knowledge Ltd | Printed circuit boards |
EP2327283A2 (en) | 2008-08-18 | 2011-06-01 | Semblant Global Limited | Halo-hydrocarbon polymer coating |
US8995146B2 (en) | 2010-02-23 | 2015-03-31 | Semblant Limited | Electrical assembly and method |
US9277642B2 (en) * | 2013-03-05 | 2016-03-01 | Eastman Kodak Company | Imprinted bi-layer micro-structure method |
US10212825B2 (en) | 2016-03-03 | 2019-02-19 | Motorola Mobility Llc | Polysiloxane films and methods of making polysiloxane films |
RU184905U1 (ru) * | 2016-06-06 | 2018-11-14 | Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" (Госкорпорация "Росатом") | Покрытие печатных плат |
US20170358445A1 (en) | 2016-06-13 | 2017-12-14 | Gvd Corporation | Methods for plasma depositing polymers comprising cyclic siloxanes and related compositions and articles |
US11679412B2 (en) | 2016-06-13 | 2023-06-20 | Gvd Corporation | Methods for plasma depositing polymers comprising cyclic siloxanes and related compositions and articles |
CN106324040B (zh) * | 2016-09-29 | 2023-07-28 | 浙江中控技术股份有限公司 | 一种检测预警装置及方法 |
GB201621177D0 (en) | 2016-12-13 | 2017-01-25 | Semblant Ltd | Protective coating |
TW201836447A (zh) * | 2017-03-24 | 2018-10-01 | 致伸科技股份有限公司 | 具擴充功能之薄膜線路結構 |
WO2019010122A1 (en) | 2017-07-03 | 2019-01-10 | Avx Corporation | SOLID ELECTROLYTIC CAPACITOR CONTAINING A NANOREVÊTEMENT |
US10770238B2 (en) | 2017-07-03 | 2020-09-08 | Avx Corporation | Solid electrolytic capacitor assembly with hydrophobic coatings |
US20220235468A1 (en) * | 2019-07-31 | 2022-07-28 | Showa Denko K.K. | Laminate and method for producing same |
CN110402019A (zh) * | 2019-08-22 | 2019-11-01 | 江苏上达电子有限公司 | 一种耐弯折柔性线路板及其制作方法 |
JPWO2021070561A1 (es) * | 2019-10-10 | 2021-04-15 | ||
CN117554185B (zh) * | 2024-01-11 | 2024-03-15 | 江苏满星测评信息技术有限公司 | 一种薄膜材料力学性能监测方法及系统 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
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US3931454A (en) * | 1972-10-17 | 1976-01-06 | Westinghouse Electric Corporation | Printed circuit board and method of preparing it |
JPS61213221A (ja) * | 1985-03-19 | 1986-09-22 | Japan Synthetic Rubber Co Ltd | プラズマ重合膜の製法 |
EP0753989B1 (en) * | 1995-07-11 | 2005-09-21 | Delphi Technologies, Inc. | Coatings and methods, especially for circuit boards |
CN1095623C (zh) * | 1996-04-18 | 2002-12-04 | 国际商业机器公司 | 用于含铜金属的复合涂料组合物 |
AU1778000A (en) * | 1998-11-27 | 2000-06-19 | Metallveredlung Gmbh & Co. Kg | Coat consisting of a plastic coating and method and device for producing the same |
DE10114897A1 (de) * | 2001-03-26 | 2002-10-24 | Infineon Technologies Ag | Elektronisches Bauteil |
JP4310086B2 (ja) * | 2002-08-01 | 2009-08-05 | 株式会社日立製作所 | エンジン用電子機器 |
RU2233301C1 (ru) * | 2003-09-16 | 2004-07-27 | Федеральное государственное унитарное предприятие "Московское машиностроительное производственное предприятие "Салют" | Способ нанесения покрытия на изделия |
US7673970B2 (en) * | 2004-06-30 | 2010-03-09 | Lexmark International, Inc. | Flexible circuit corrosion protection |
JP4843214B2 (ja) * | 2004-11-16 | 2011-12-21 | 株式会社東芝 | モジュール基板およびディスク装置 |
JP4730129B2 (ja) * | 2006-02-27 | 2011-07-20 | 株式会社ケンウッド | 車載用ナビゲーション装置 |
JP4224082B2 (ja) * | 2006-06-13 | 2009-02-12 | 三井金属鉱業株式会社 | フレキシブルプリント配線基板および半導体装置 |
US20080083115A1 (en) * | 2006-10-05 | 2008-04-10 | Shih-Ping Hsu | Method for repairing metal finish layer on surface of electrical connection pad of circuit board |
US20080093109A1 (en) * | 2006-10-19 | 2008-04-24 | Phoenix Precision Technology Corporation | Substrate with surface finished structure and method for making the same |
TWI331388B (en) * | 2007-01-25 | 2010-10-01 | Advanced Semiconductor Eng | Package substrate, method of fabricating the same and chip package |
GB0703172D0 (en) * | 2007-02-19 | 2007-03-28 | Pa Knowledge Ltd | Printed circuit boards |
TWI377656B (en) * | 2007-09-19 | 2012-11-21 | Method for manufacturing packaging substrate | |
US20090123656A1 (en) * | 2007-11-13 | 2009-05-14 | Ernest Long | Composition and method for controlling galvanic corrosion in printed circuit boards |
JP2009155668A (ja) * | 2007-12-25 | 2009-07-16 | Hitachi Chem Co Ltd | 無電解パラジウムめっき反応開始促進前処理液、この前処理液を用いた無電解めっき方法、無電解めっき方法で形成された接続端子並びにこの接続端子を用いた半導体パッケージ及びその製造方法 |
TWI340615B (en) * | 2008-01-30 | 2011-04-11 | Advanced Semiconductor Eng | Surface treatment process for circuit board |
US8314348B2 (en) * | 2008-03-03 | 2012-11-20 | Ibiden Co., Ltd. | Multilayer printed wiring board and method of manufacturing multilayer printed wiring board |
EP2327283A2 (en) * | 2008-08-18 | 2011-06-01 | Semblant Global Limited | Halo-hydrocarbon polymer coating |
US7631798B1 (en) * | 2008-10-02 | 2009-12-15 | Ernest Long | Method for enhancing the solderability of a surface |
US8263177B2 (en) * | 2009-03-27 | 2012-09-11 | Kesheng Feng | Organic polymer coating for protection against creep corrosion |
TW201041105A (en) * | 2009-05-13 | 2010-11-16 | Advanced Semiconductor Eng | Substrate having single patterned metal layer, and package applied with the same, and methods of manufacturing the substrate and package |
US20110049703A1 (en) * | 2009-08-25 | 2011-03-03 | Jun-Chung Hsu | Flip-Chip Package Structure |
-
2010
- 2010-11-15 GB GB1019302.7A patent/GB2485419B/en active Active
-
2011
- 2011-11-08 TW TW100140755A patent/TWI557272B/zh not_active IP Right Cessation
- 2011-11-09 JP JP2013538259A patent/JP6238747B2/ja not_active Expired - Fee Related
- 2011-11-09 US US13/885,119 patent/US20130240256A1/en not_active Abandoned
- 2011-11-09 SG SG2013034624A patent/SG190163A1/en unknown
- 2011-11-09 RU RU2013126037/07A patent/RU2573583C2/ru not_active IP Right Cessation
- 2011-11-09 MX MX2013005144A patent/MX350116B/es active IP Right Grant
- 2011-11-09 BR BR112013011924A patent/BR112013011924A2/pt not_active Application Discontinuation
- 2011-11-09 MY MYPI2013001719A patent/MY163049A/en unknown
- 2011-11-09 AU AU2011330946A patent/AU2011330946B2/en not_active Ceased
- 2011-11-09 CN CN201180054707.5A patent/CN103210704B/zh active Active
- 2011-11-09 EP EP11785760.7A patent/EP2641456A1/en not_active Withdrawn
- 2011-11-09 CA CA2816840A patent/CA2816840A1/en not_active Abandoned
- 2011-11-09 KR KR1020137015258A patent/KR20130114180A/ko active Search and Examination
- 2011-11-09 WO PCT/GB2011/001579 patent/WO2012066273A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
SG190163A1 (en) | 2013-07-31 |
US20130240256A1 (en) | 2013-09-19 |
RU2013126037A (ru) | 2014-12-27 |
TW201229309A (en) | 2012-07-16 |
JP6238747B2 (ja) | 2017-11-29 |
EP2641456A1 (en) | 2013-09-25 |
GB2485419A (en) | 2012-05-16 |
JP2014501039A (ja) | 2014-01-16 |
AU2011330946A1 (en) | 2013-05-23 |
CN103210704A (zh) | 2013-07-17 |
CN103210704B (zh) | 2016-08-24 |
TWI557272B (zh) | 2016-11-11 |
GB2485419B (en) | 2015-02-25 |
AU2011330946B2 (en) | 2015-10-01 |
MX2013005144A (es) | 2013-12-02 |
RU2573583C2 (ru) | 2016-01-20 |
WO2012066273A1 (en) | 2012-05-24 |
KR20130114180A (ko) | 2013-10-16 |
MY163049A (en) | 2017-08-15 |
GB201019302D0 (en) | 2010-12-29 |
BR112013011924A2 (pt) | 2017-11-07 |
CA2816840A1 (en) | 2012-05-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG | Grant or registration |