WO2011087319A3 - 발광 장치 - Google Patents

발광 장치 Download PDF

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Publication number
WO2011087319A3
WO2011087319A3 PCT/KR2011/000296 KR2011000296W WO2011087319A3 WO 2011087319 A3 WO2011087319 A3 WO 2011087319A3 KR 2011000296 W KR2011000296 W KR 2011000296W WO 2011087319 A3 WO2011087319 A3 WO 2011087319A3
Authority
WO
WIPO (PCT)
Prior art keywords
light
emitting device
mounting units
present
thin film
Prior art date
Application number
PCT/KR2011/000296
Other languages
English (en)
French (fr)
Other versions
WO2011087319A2 (ko
Inventor
정영식
곽노준
신창호
Original Assignee
삼성엘이디 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성엘이디 주식회사 filed Critical 삼성엘이디 주식회사
Priority to CN2011800096812A priority Critical patent/CN102804937A/zh
Priority to US13/522,473 priority patent/US20120300457A1/en
Priority to KR1020127016302A priority patent/KR20120116945A/ko
Priority to DE112011100248T priority patent/DE112011100248T5/de
Publication of WO2011087319A2 publication Critical patent/WO2011087319A2/ko
Publication of WO2011087319A3 publication Critical patent/WO2011087319A3/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

본 발명은 발광 장치에 관한 것으로서, 본 발명의 일 실시 형태는 기판 본체와, 상기 기판 본체 상면을 일부 덮는 도전성 박막 형태로 형성되며, 서로 이격되어 배치된 복수의 실장부 및 상기 복수의 실장부들을 전기적으로 연결하도록 상기 실장부보다 좁은 폭으로 형성된 연결 라인을 포함하는 배선 패턴부 및 상기 복수의 실장부 중 적어도 하나의 실장부에 적어도 하나씩 배치된 광원을 포함하는 발광 장치를 제공한다. 본 발명의 일 실시 예에 의할 경우, 광원이 실장되는 회로 기판에서 도전성 박막이 차지하는 면적을 감소시킴으로써 리플로우 등의 공정 시 발생할 수 있는 기판의 휨 현상이 최소화될 수 있는 발광 장치를 얻을 수 있다.
PCT/KR2011/000296 2010-01-15 2011-01-14 발광 장치 WO2011087319A2 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2011800096812A CN102804937A (zh) 2010-01-15 2011-01-14 发光器件
US13/522,473 US20120300457A1 (en) 2010-01-15 2011-01-14 Light-emitting device
KR1020127016302A KR20120116945A (ko) 2010-01-15 2011-01-14 발광 장치
DE112011100248T DE112011100248T5 (de) 2010-01-15 2011-01-14 Lichtemittierende Vorrichtung

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/KR2010/000251 WO2011087168A1 (ko) 2010-01-15 2010-01-15 인쇄회로기판
KRPCT/KR2010/000251 2010-01-15

Publications (2)

Publication Number Publication Date
WO2011087319A2 WO2011087319A2 (ko) 2011-07-21
WO2011087319A3 true WO2011087319A3 (ko) 2011-11-10

Family

ID=44304426

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/KR2010/000251 WO2011087168A1 (ko) 2010-01-15 2010-01-15 인쇄회로기판
PCT/KR2011/000296 WO2011087319A2 (ko) 2010-01-15 2011-01-14 발광 장치

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/000251 WO2011087168A1 (ko) 2010-01-15 2010-01-15 인쇄회로기판

Country Status (5)

Country Link
US (1) US20120300457A1 (ko)
KR (1) KR20120116945A (ko)
CN (1) CN102804937A (ko)
DE (1) DE112011100248T5 (ko)
WO (2) WO2011087168A1 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102773578A (zh) * 2012-07-25 2012-11-14 台龙电子（昆山）有限公司 一种将led灯条焊接在柔性板件上的焊盘
CN103972264A (zh) * 2013-01-25 2014-08-06 财团法人工业技术研究院 可挠性电子装置
CN103742821A (zh) * 2014-01-25 2014-04-23 深圳市灿明科技有限公司 一种led柔性灯条
KR20230116461A (ko) * 2022-01-28 2023-08-04 삼성전자주식회사 디스플레이 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070000833A (ko) * 2005-06-28 2007-01-03 엘지.필립스 엘시디 주식회사 Ｌｅｄ가 실장된 인쇄회로기판
KR20080006641A (ko) * 2005-06-07 2008-01-16 가부시키가이샤후지쿠라 발광소자 실장용 기판, 발광소자 모듈, 조명장치, 표시장치및 교통 신호기
JP2008205453A (ja) * 2007-01-26 2008-09-04 Teijin Ltd 放熱性実装基板およびその製造方法
JP2009071199A (ja) * 2007-09-17 2009-04-02 Element Denshi:Kk 実装基板およびそれを用いた薄型発光装置の製造方法

Family Cites Families (11)

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Publication number Priority date Publication date Assignee Title
KR20000010876A (ko) * 1996-05-17 2000-02-25 칼 하인쯔 호르닝어 반도체칩용 기판 부재
US7033920B1 (en) * 2000-01-10 2006-04-25 Micron Technology, Inc. Method for fabricating a silicon carbide interconnect for semiconductor components
JP3942457B2 (ja) * 2002-02-27 2007-07-11 Ｎｅｃエレクトロニクス株式会社 電子部品の製造方法
JP3993475B2 (ja) * 2002-06-20 2007-10-17 ローム株式会社 Ｌｅｄチップの実装構造、およびこれを備えた画像読み取り装置
JP4317697B2 (ja) * 2003-01-30 2009-08-19 パナソニック株式会社 光半導体ベアチップ、プリント配線板、照明ユニットおよび照明装置
EP1642346A1 (en) * 2003-06-30 2006-04-05 Koninklijke Philips Electronics N.V. Light-emitting diode thermal management system
US8076680B2 (en) * 2005-03-11 2011-12-13 Seoul Semiconductor Co., Ltd. LED package having an array of light emitting cells coupled in series
JP4699225B2 (ja) * 2006-01-31 2011-06-08 株式会社トクヤマ メタライズドセラミックス基板の製造方法、該方法により製造したメタライズドセラミックス基板、およびパッケージ
KR20080001975A (ko) * 2006-06-30 2008-01-04 삼성전자주식회사 표시 기판 및 이를 구비한 표시 장치
TW200942569A (en) * 2007-11-29 2009-10-16 Mitsubishi Plastics Inc Metal laminate, led-mounted board, and white film
KR101104034B1 (ko) * 2007-12-06 2012-01-09 엘지이노텍 주식회사 발광다이오드, 발광장치 및 그 제조방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080006641A (ko) * 2005-06-07 2008-01-16 가부시키가이샤후지쿠라 발광소자 실장용 기판, 발광소자 모듈, 조명장치, 표시장치및 교통 신호기
KR20070000833A (ko) * 2005-06-28 2007-01-03 엘지.필립스 엘시디 주식회사 Ｌｅｄ가 실장된 인쇄회로기판
JP2008205453A (ja) * 2007-01-26 2008-09-04 Teijin Ltd 放熱性実装基板およびその製造方法
JP2009071199A (ja) * 2007-09-17 2009-04-02 Element Denshi:Kk 実装基板およびそれを用いた薄型発光装置の製造方法

Also Published As

Publication number Publication date
US20120300457A1 (en) 2012-11-29
WO2011087168A1 (ko) 2011-07-21
DE112011100248T5 (de) 2012-11-08
WO2011087319A2 (ko) 2011-07-21
KR20120116945A (ko) 2012-10-23
CN102804937A (zh) 2012-11-28

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