BR112013011924A2 - método para diminuir a corrosão por fluência - Google Patents

método para diminuir a corrosão por fluência

Info

Publication number
BR112013011924A2
BR112013011924A2 BR112013011924A BR112013011924A BR112013011924A2 BR 112013011924 A2 BR112013011924 A2 BR 112013011924A2 BR 112013011924 A BR112013011924 A BR 112013011924A BR 112013011924 A BR112013011924 A BR 112013011924A BR 112013011924 A2 BR112013011924 A2 BR 112013011924A2
Authority
BR
Brazil
Prior art keywords
creep corrosion
decreasing creep
decreasing
corrosion
creep
Prior art date
Application number
BR112013011924A
Other languages
English (en)
Inventor
Von Werne Timothy
Original Assignee
Semblant Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semblant Ltd filed Critical Semblant Ltd
Publication of BR112013011924A2 publication Critical patent/BR112013011924A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872—Insulating conformal coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
BR112013011924A 2010-11-15 2011-11-09 método para diminuir a corrosão por fluência BR112013011924A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB1019302.7A GB2485419B (en) 2010-11-15 2010-11-15 Method for reducing creep corrosion
PCT/GB2011/001579 WO2012066273A1 (en) 2010-11-15 2011-11-09 Method for reducing creep corrosion

Publications (1)

Publication Number Publication Date
BR112013011924A2 true BR112013011924A2 (pt) 2017-11-07

Family

ID=43431471

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112013011924A BR112013011924A2 (pt) 2010-11-15 2011-11-09 método para diminuir a corrosão por fluência

Country Status (15)

Country Link
US (1) US20130240256A1 (pt)
EP (1) EP2641456A1 (pt)
JP (1) JP6238747B2 (pt)
KR (1) KR20130114180A (pt)
CN (1) CN103210704B (pt)
AU (1) AU2011330946B2 (pt)
BR (1) BR112013011924A2 (pt)
CA (1) CA2816840A1 (pt)
GB (1) GB2485419B (pt)
MX (1) MX350116B (pt)
MY (1) MY163049A (pt)
RU (1) RU2573583C2 (pt)
SG (1) SG190163A1 (pt)
TW (1) TWI557272B (pt)
WO (1) WO2012066273A1 (pt)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0703172D0 (en) 2007-02-19 2007-03-28 Pa Knowledge Ltd Printed circuit boards
EP2327283A2 (en) 2008-08-18 2011-06-01 Semblant Global Limited Halo-hydrocarbon polymer coating
US8995146B2 (en) 2010-02-23 2015-03-31 Semblant Limited Electrical assembly and method
US9277642B2 (en) * 2013-03-05 2016-03-01 Eastman Kodak Company Imprinted bi-layer micro-structure method
US10212825B2 (en) 2016-03-03 2019-02-19 Motorola Mobility Llc Polysiloxane films and methods of making polysiloxane films
RU184905U1 (ru) * 2016-06-06 2018-11-14 Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" (Госкорпорация "Росатом") Покрытие печатных плат
US20170358445A1 (en) 2016-06-13 2017-12-14 Gvd Corporation Methods for plasma depositing polymers comprising cyclic siloxanes and related compositions and articles
US11679412B2 (en) 2016-06-13 2023-06-20 Gvd Corporation Methods for plasma depositing polymers comprising cyclic siloxanes and related compositions and articles
CN106324040B (zh) * 2016-09-29 2023-07-28 浙江中控技术股份有限公司 一种检测预警装置及方法
GB201621177D0 (en) 2016-12-13 2017-01-25 Semblant Ltd Protective coating
TW201836447A (zh) * 2017-03-24 2018-10-01 致伸科技股份有限公司 具擴充功能之薄膜線路結構
WO2019010122A1 (en) 2017-07-03 2019-01-10 Avx Corporation SOLID ELECTROLYTIC CAPACITOR CONTAINING A NANOREVÊTEMENT
US10770238B2 (en) 2017-07-03 2020-09-08 Avx Corporation Solid electrolytic capacitor assembly with hydrophobic coatings
US20220235468A1 (en) * 2019-07-31 2022-07-28 Showa Denko K.K. Laminate and method for producing same
CN110402019A (zh) * 2019-08-22 2019-11-01 江苏上达电子有限公司 一种耐弯折柔性线路板及其制作方法
JPWO2021070561A1 (pt) * 2019-10-10 2021-04-15
CN117554185B (zh) * 2024-01-11 2024-03-15 江苏满星测评信息技术有限公司 一种薄膜材料力学性能监测方法及系统

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3931454A (en) * 1972-10-17 1976-01-06 Westinghouse Electric Corporation Printed circuit board and method of preparing it
JPS61213221A (ja) * 1985-03-19 1986-09-22 Japan Synthetic Rubber Co Ltd プラズマ重合膜の製法
EP0753989B1 (en) * 1995-07-11 2005-09-21 Delphi Technologies, Inc. Coatings and methods, especially for circuit boards
CN1095623C (zh) * 1996-04-18 2002-12-04 国际商业机器公司 用于含铜金属的复合涂料组合物
AU1778000A (en) * 1998-11-27 2000-06-19 Metallveredlung Gmbh & Co. Kg Coat consisting of a plastic coating and method and device for producing the same
DE10114897A1 (de) * 2001-03-26 2002-10-24 Infineon Technologies Ag Elektronisches Bauteil
JP4310086B2 (ja) * 2002-08-01 2009-08-05 株式会社日立製作所 エンジン用電子機器
RU2233301C1 (ru) * 2003-09-16 2004-07-27 Федеральное государственное унитарное предприятие "Московское машиностроительное производственное предприятие "Салют" Способ нанесения покрытия на изделия
US7673970B2 (en) * 2004-06-30 2010-03-09 Lexmark International, Inc. Flexible circuit corrosion protection
JP4843214B2 (ja) * 2004-11-16 2011-12-21 株式会社東芝 モジュール基板およびディスク装置
JP4730129B2 (ja) * 2006-02-27 2011-07-20 株式会社ケンウッド 車載用ナビゲーション装置
JP4224082B2 (ja) * 2006-06-13 2009-02-12 三井金属鉱業株式会社 フレキシブルプリント配線基板および半導体装置
US20080083115A1 (en) * 2006-10-05 2008-04-10 Shih-Ping Hsu Method for repairing metal finish layer on surface of electrical connection pad of circuit board
US20080093109A1 (en) * 2006-10-19 2008-04-24 Phoenix Precision Technology Corporation Substrate with surface finished structure and method for making the same
TWI331388B (en) * 2007-01-25 2010-10-01 Advanced Semiconductor Eng Package substrate, method of fabricating the same and chip package
GB0703172D0 (en) * 2007-02-19 2007-03-28 Pa Knowledge Ltd Printed circuit boards
TWI377656B (en) * 2007-09-19 2012-11-21 Method for manufacturing packaging substrate
US20090123656A1 (en) * 2007-11-13 2009-05-14 Ernest Long Composition and method for controlling galvanic corrosion in printed circuit boards
JP2009155668A (ja) * 2007-12-25 2009-07-16 Hitachi Chem Co Ltd 無電解パラジウムめっき反応開始促進前処理液、この前処理液を用いた無電解めっき方法、無電解めっき方法で形成された接続端子並びにこの接続端子を用いた半導体パッケージ及びその製造方法
TWI340615B (en) * 2008-01-30 2011-04-11 Advanced Semiconductor Eng Surface treatment process for circuit board
US8314348B2 (en) * 2008-03-03 2012-11-20 Ibiden Co., Ltd. Multilayer printed wiring board and method of manufacturing multilayer printed wiring board
EP2327283A2 (en) * 2008-08-18 2011-06-01 Semblant Global Limited Halo-hydrocarbon polymer coating
US7631798B1 (en) * 2008-10-02 2009-12-15 Ernest Long Method for enhancing the solderability of a surface
US8263177B2 (en) * 2009-03-27 2012-09-11 Kesheng Feng Organic polymer coating for protection against creep corrosion
TW201041105A (en) * 2009-05-13 2010-11-16 Advanced Semiconductor Eng Substrate having single patterned metal layer, and package applied with the same, and methods of manufacturing the substrate and package
US20110049703A1 (en) * 2009-08-25 2011-03-03 Jun-Chung Hsu Flip-Chip Package Structure

Also Published As

Publication number Publication date
SG190163A1 (en) 2013-07-31
US20130240256A1 (en) 2013-09-19
RU2013126037A (ru) 2014-12-27
TW201229309A (en) 2012-07-16
JP6238747B2 (ja) 2017-11-29
EP2641456A1 (en) 2013-09-25
GB2485419A (en) 2012-05-16
JP2014501039A (ja) 2014-01-16
AU2011330946A1 (en) 2013-05-23
CN103210704A (zh) 2013-07-17
CN103210704B (zh) 2016-08-24
TWI557272B (zh) 2016-11-11
MX350116B (es) 2017-08-28
GB2485419B (en) 2015-02-25
AU2011330946B2 (en) 2015-10-01
MX2013005144A (es) 2013-12-02
RU2573583C2 (ru) 2016-01-20
WO2012066273A1 (en) 2012-05-24
KR20130114180A (ko) 2013-10-16
MY163049A (en) 2017-08-15
GB201019302D0 (en) 2010-12-29
CA2816840A1 (en) 2012-05-24

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]

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