WO2008146884A1 - 配線基板のめっき方法及び配線基板 - Google Patents

配線基板のめっき方法及び配線基板 Download PDF

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Publication number
WO2008146884A1
WO2008146884A1 PCT/JP2008/059927 JP2008059927W WO2008146884A1 WO 2008146884 A1 WO2008146884 A1 WO 2008146884A1 JP 2008059927 W JP2008059927 W JP 2008059927W WO 2008146884 A1 WO2008146884 A1 WO 2008146884A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
plating
plated
masking film
target area
Prior art date
Application number
PCT/JP2008/059927
Other languages
English (en)
French (fr)
Inventor
Kouji Nemoto
Ryouhei Hishinuma
Yosuke Oota
Kuniaki Fukuhara
Original Assignee
Nippon Mektron, Ltd.
Somar Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron, Ltd., Somar Corporation filed Critical Nippon Mektron, Ltd.
Priority to KR1020097027205A priority Critical patent/KR101419971B1/ko
Priority to CN200880018333XA priority patent/CN101690430B/zh
Priority to DE112008001439.6T priority patent/DE112008001439B4/de
Publication of WO2008146884A1 publication Critical patent/WO2008146884A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Adhesive Tapes (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)

Abstract

　絶縁基材上に凹凸が２５μｍ以上の回路パターンが形成された配線基板のめっき対象部位に選択的にめっきをかけるために、該めっき対象部位以外をマスキングするにあたり、ポリブチレンテレフタレートフィルムの片面に粘着剤層及び離型シートを順次積層させたマスキングフィルムを用い、該マスキングフィルムの該離型シートを剥離後、マスキングフィルムの粘着剤層面を常温環境下で配線基板の所定の場所に貼り付けた後、熱圧着することにより貼り付け、その後めっき対象部位にめっきをすることを特徴とする配線基板のめっき方法及びこの方法を用いた配線基板である。回路パターンの凹凸が大きい配線基板であっても、めっき液が非めっき部位に浸入することによりめっきされることがない。また、マスキングフィルムの打ち抜き加工性、特にバリや穴が開かないなどの発生を防止する。
PCT/JP2008/059927 2007-05-29 2008-05-29 配線基板のめっき方法及び配線基板 WO2008146884A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020097027205A KR101419971B1 (ko) 2007-05-29 2008-05-29 배선 기판의 도금 방법 및 배선 기판
CN200880018333XA CN101690430B (zh) 2007-05-29 2008-05-29 配线基板的镀敷方法及配线基板
DE112008001439.6T DE112008001439B4 (de) 2007-05-29 2008-05-29 Verfahren zum Beschichten einer Verdrahtungsplatte, sowie Verdrahtungsplatte

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-142425 2007-05-29
JP2007142425A JP4982251B2 (ja) 2007-05-29 2007-05-29 配線基板のめっき方法及び配線基板

Publications (1)

Publication Number Publication Date
WO2008146884A1 true WO2008146884A1 (ja) 2008-12-04

Family

ID=40075117

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059927 WO2008146884A1 (ja) 2007-05-29 2008-05-29 配線基板のめっき方法及び配線基板

Country Status (7)

Country Link
JP (1) JP4982251B2 (ja)
KR (1) KR101419971B1 (ja)
CN (1) CN101690430B (ja)
DE (1) DE112008001439B4 (ja)
MY (1) MY151463A (ja)
TW (1) TWI435672B (ja)
WO (1) WO2008146884A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103515712A (zh) * 2012-06-15 2014-01-15 深圳光启创新技术有限公司 一种超材料及其制备方法
JP2016065189A (ja) * 2014-09-26 2016-04-28 ソマール株式会社 めっき用マスキングフィルム

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102373492A (zh) * 2010-08-13 2012-03-14 北大方正集团有限公司 电路板表面进行选择性电镀的方法和电路板
JP5718609B2 (ja) * 2010-10-07 2015-05-13 大倉工業株式会社 マスキングフィルム支持体
JP5872213B2 (ja) * 2011-09-08 2016-03-01 公益財団法人神奈川科学技術アカデミー 拡面処理された箔の製造方法
JP6318091B2 (ja) * 2012-12-20 2018-04-25 ソマール株式会社 めっき用マスキングフィルム支持体及びこれを用いたマスキングフィルム
JP6176591B2 (ja) * 2013-12-25 2017-08-09 旭硝子株式会社 吸着層付き基板の梱包方法及び梱包体並びに吸着層付き基板の梱包装置
CN104328394B (zh) * 2014-11-03 2016-12-07 广州特种承压设备检测研究院 一种差异化复合式化学镀方法
KR101825198B1 (ko) * 2016-11-15 2018-02-05 (주)유에스티 동판에 실리콘 컴파운드를 접착하는 방법
TWI600072B (zh) * 2017-01-23 2017-09-21 Linco Technology Co Ltd Coated film burr removal method
JP2020156692A (ja) * 2019-03-26 2020-10-01 日東電工株式会社 電極接合構造及び生体センサ

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02258880A (ja) * 1989-03-30 1990-10-19 Nitto Denko Corp プリント基板用マスキングテープおよび該テープを用いるプリント基板の製造法
JPH05202347A (ja) * 1991-08-12 1993-08-10 Sekisui Chem Co Ltd アルカリ水溶性粘着剤及びマスキングテープ
JPH07145364A (ja) * 1993-11-25 1995-06-06 Sekisui Chem Co Ltd アルカリ水溶性粘着剤組成物
JP2003119441A (ja) * 2001-10-10 2003-04-23 Sekisui Chem Co Ltd メッキ用マスキングテープ

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62243791A (ja) 1986-04-15 1987-10-24 Matsushita Electric Ind Co Ltd 電解めつき層の選択的形成方法
JP2806728B2 (ja) 1993-03-10 1998-09-30 積水化学工業株式会社 マスキングテープ
JP3397913B2 (ja) 1994-12-14 2003-04-21 日立化成工業株式会社 めっきマスク粘着フィルム
JP3506194B2 (ja) 1995-07-11 2004-03-15 日立化成工業株式会社 メッキマスク用粘着フィルム
JP3114926B2 (ja) 1997-06-24 2000-12-04 日本特殊陶業株式会社 配線基板のメッキ用マスキング方法
JPH11302611A (ja) 1998-04-17 1999-11-02 Hitachi Chem Co Ltd メッキマスク用粘着フィルム
JP2003213485A (ja) 2002-01-15 2003-07-30 Nitto Denko Corp 金属メッキ用マスキングテープ
JP3936253B2 (ja) 2002-07-05 2007-06-27 日東電工株式会社 金属メッキ用マスキングテープ
JP4880877B2 (ja) * 2004-01-16 2012-02-22 リンテック株式会社 フレキシブルプリント配線基板の製造方法及び該製造方法に用いる再剥離性剥離材付き工程フィルム
DE102004021775A1 (de) 2004-04-30 2005-11-24 Tesa Ag Klebeband insbesondere zur Abdeckung von Fensterflanschen

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02258880A (ja) * 1989-03-30 1990-10-19 Nitto Denko Corp プリント基板用マスキングテープおよび該テープを用いるプリント基板の製造法
JPH05202347A (ja) * 1991-08-12 1993-08-10 Sekisui Chem Co Ltd アルカリ水溶性粘着剤及びマスキングテープ
JPH07145364A (ja) * 1993-11-25 1995-06-06 Sekisui Chem Co Ltd アルカリ水溶性粘着剤組成物
JP2003119441A (ja) * 2001-10-10 2003-04-23 Sekisui Chem Co Ltd メッキ用マスキングテープ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103515712A (zh) * 2012-06-15 2014-01-15 深圳光启创新技术有限公司 一种超材料及其制备方法
JP2016065189A (ja) * 2014-09-26 2016-04-28 ソマール株式会社 めっき用マスキングフィルム

Also Published As

Publication number Publication date
KR20100021635A (ko) 2010-02-25
DE112008001439T5 (de) 2010-06-10
JP2008300441A (ja) 2008-12-11
TWI435672B (zh) 2014-04-21
CN101690430A (zh) 2010-03-31
JP4982251B2 (ja) 2012-07-25
CN101690430B (zh) 2012-09-05
KR101419971B1 (ko) 2014-07-16
MY151463A (en) 2014-05-30
DE112008001439B4 (de) 2021-09-02
TW200920206A (en) 2009-05-01

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