WO2009011025A1 - 配線基板及びその製造方法 - Google Patents

配線基板及びその製造方法 Download PDF

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Publication number
WO2009011025A1
WO2009011025A1 PCT/JP2007/064025 JP2007064025W WO2009011025A1 WO 2009011025 A1 WO2009011025 A1 WO 2009011025A1 JP 2007064025 W JP2007064025 W JP 2007064025W WO 2009011025 A1 WO2009011025 A1 WO 2009011025A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
wiring board
manufacturing
thickness
smaller
Prior art date
Application number
PCT/JP2007/064025
Other languages
English (en)
French (fr)
Inventor
Michimasa Takahashi
Masakazu Aoyama
Original Assignee
Ibiden Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co., Ltd. filed Critical Ibiden Co., Ltd.
Priority to JP2009523465A priority Critical patent/JP5010681B2/ja
Priority to PCT/JP2007/064025 priority patent/WO2009011025A1/ja
Priority to CN2007801006003A priority patent/CN101803481B/zh
Priority to EP07790805A priority patent/EP2173147A4/en
Publication of WO2009011025A1 publication Critical patent/WO2009011025A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1536—Temporarily stacked PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

　配線基板１９は、第１基板１と、第１基板１より実装面積が小さい第２基板２と、第１基板１と第２基板２との間に設けられているベース基板３と、を積層して構成され、外周の少なくとも一部の厚みが、中央部よりも薄く形成される。ヴィア４４が、第１基板１と第２基板２の少なくともいずれか一つに設けられている。ベース基板３は、第１基板１にのみ接合する部分の厚さが、第１基板１と第２基板２とに挟持された部分の厚さよりも小さい。
PCT/JP2007/064025 2007-07-13 2007-07-13 配線基板及びその製造方法 WO2009011025A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009523465A JP5010681B2 (ja) 2007-07-13 2007-07-13 配線基板及びその製造方法
PCT/JP2007/064025 WO2009011025A1 (ja) 2007-07-13 2007-07-13 配線基板及びその製造方法
CN2007801006003A CN101803481B (zh) 2007-07-13 2007-07-13 布线基板及其制造方法
EP07790805A EP2173147A4 (en) 2007-07-13 2007-07-13 PCB AND MANUFACTURING METHOD THEREFOR

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/064025 WO2009011025A1 (ja) 2007-07-13 2007-07-13 配線基板及びその製造方法

Publications (1)

Publication Number Publication Date
WO2009011025A1 true WO2009011025A1 (ja) 2009-01-22

Family

ID=40259374

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/064025 WO2009011025A1 (ja) 2007-07-13 2007-07-13 配線基板及びその製造方法

Country Status (4)

Country Link
EP (1) EP2173147A4 (ja)
JP (1) JP5010681B2 (ja)
CN (1) CN101803481B (ja)
WO (1) WO2009011025A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101125356B1 (ko) 2011-03-25 2012-04-02 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법
WO2012053728A1 (en) * 2010-10-20 2012-04-26 Lg Innotek Co., Ltd. Printed circuit board and method for manufacturing the same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107105576B (zh) * 2017-06-20 2019-05-17 广州兴森快捷电路科技有限公司 阶梯凸台印制板的制作方法
CN110572927A (zh) * 2019-08-23 2019-12-13 鹤山市中富兴业电路有限公司 一种多层fpc四阶hdi软硬结合板制作方法及hdi板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05152693A (ja) 1991-11-30 1993-06-18 Nitto Denko Corp 補強部付フレキシブルプリント基板およびその製法
JP2002064271A (ja) * 2000-06-09 2002-02-28 Matsushita Electric Ind Co Ltd 複合配線基板及びその製造方法
JP2004266236A (ja) * 2003-01-09 2004-09-24 Sony Chem Corp 基板素片とその基板素片を用いた複合配線板
WO2005029934A1 (ja) 2003-09-19 2005-03-31 Fujitsu Limited プリント基板およびその製造方法
JP2005322871A (ja) * 2004-04-09 2005-11-17 Dainippon Printing Co Ltd リジッド−フレキシブル基板及びその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4003344C1 (ja) * 1990-02-05 1991-06-13 Fa. Carl Freudenberg, 6940 Weinheim, De
EP1209959A3 (en) * 2000-11-27 2004-03-10 Matsushita Electric Works, Ltd. Multilayer circuit board and method of manufacturing the same
JP2004349277A (ja) * 2003-04-28 2004-12-09 Nippon Carbide Ind Co Inc 多層配線基板及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05152693A (ja) 1991-11-30 1993-06-18 Nitto Denko Corp 補強部付フレキシブルプリント基板およびその製法
JP2002064271A (ja) * 2000-06-09 2002-02-28 Matsushita Electric Ind Co Ltd 複合配線基板及びその製造方法
JP2004266236A (ja) * 2003-01-09 2004-09-24 Sony Chem Corp 基板素片とその基板素片を用いた複合配線板
WO2005029934A1 (ja) 2003-09-19 2005-03-31 Fujitsu Limited プリント基板およびその製造方法
JP2005322871A (ja) * 2004-04-09 2005-11-17 Dainippon Printing Co Ltd リジッド−フレキシブル基板及びその製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2173147A4 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012053728A1 (en) * 2010-10-20 2012-04-26 Lg Innotek Co., Ltd. Printed circuit board and method for manufacturing the same
US9282626B2 (en) 2010-10-20 2016-03-08 Lg Innotek Co., Ltd. Printed circuit board and method for manufacturing the same
KR101125356B1 (ko) 2011-03-25 2012-04-02 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법

Also Published As

Publication number Publication date
JPWO2009011025A1 (ja) 2010-09-09
EP2173147A1 (en) 2010-04-07
EP2173147A4 (en) 2012-10-31
CN101803481A (zh) 2010-08-11
CN101803481B (zh) 2011-11-30
JP5010681B2 (ja) 2012-08-29

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