MY115305A - Adhesive sheet for wafer and process for preparing semiconductor apparatus using the same - Google Patents

Adhesive sheet for wafer and process for preparing semiconductor apparatus using the same

Info

Publication number
MY115305A
MY115305A MYPI94000915A MYPI9400915A MY115305A MY 115305 A MY115305 A MY 115305A MY PI94000915 A MYPI94000915 A MY PI94000915A MY PI9400915 A MYPI9400915 A MY PI9400915A MY 115305 A MY115305 A MY 115305A
Authority
MY
Malaysia
Prior art keywords
adhesive layer
chips
wafer
radiation
adhesive sheet
Prior art date
Application number
MYPI94000915A
Other languages
English (en)
Inventor
Masazumi Amagai
Hideo Senoo
Kazuyoshi Ebe
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26403656&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MY115305(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of MY115305A publication Critical patent/MY115305A/en

Links

Classifications

    • H10W70/415—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/064—Copolymers with monomers not covered by C09J133/06 containing anhydride, COOH or COOM groups, with M being metal or onium-cation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H10P72/74—
    • H10P72/7402—
    • H10W74/47—
    • H10P72/7414—
    • H10P72/7416—
    • H10W72/07352—
    • H10W72/321—
    • H10W72/865—
    • H10W72/884—
    • H10W74/00—
    • H10W74/10—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Die Bonding (AREA)
  • Adhesive Tapes (AREA)
  • Lead Frames For Integrated Circuits (AREA)
MYPI94000915A 1993-04-28 1994-04-16 Adhesive sheet for wafer and process for preparing semiconductor apparatus using the same MY115305A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10276193 1993-04-28
JP06261094A JP3410202B2 (ja) 1993-04-28 1994-03-31 ウェハ貼着用粘着シートおよびこれを用いた半導体装置の製造方法

Publications (1)

Publication Number Publication Date
MY115305A true MY115305A (en) 2003-05-31

Family

ID=26403656

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI94000915A MY115305A (en) 1993-04-28 1994-04-16 Adhesive sheet for wafer and process for preparing semiconductor apparatus using the same

Country Status (9)

Country Link
US (1) US6297076B1 (ref)
EP (1) EP0622833B1 (ref)
JP (1) JP3410202B2 (ref)
KR (1) KR100284989B1 (ref)
CN (1) CN1090220C (ref)
CA (1) CA2122278C (ref)
DE (1) DE69417463T2 (ref)
MY (1) MY115305A (ref)
TW (1) TW245825B (ref)

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US6342434B1 (en) 1995-12-04 2002-01-29 Hitachi, Ltd. Methods of processing semiconductor wafer, and producing IC card, and carrier
US6007920A (en) * 1996-01-22 1999-12-28 Texas Instruments Japan, Ltd. Wafer dicing/bonding sheet and process for producing semiconductor device
MY118036A (en) * 1996-01-22 2004-08-30 Lintec Corp Wafer dicing/bonding sheet and process for producing semiconductor device
KR100507584B1 (ko) * 1996-10-08 2005-08-10 히다치 가세고교 가부시끼가이샤 반도체 장치, 반도체칩 탑재용 기판, 이들의 제조법,접착제, 및 양면 접착 필름
GB2320615B (en) * 1996-12-19 2001-06-20 Lintec Corp Process for producing a chip and pressure sensitive adhesive sheet for said process
US6312800B1 (en) * 1997-02-10 2001-11-06 Lintec Corporation Pressure sensitive adhesive sheet for producing a chip
US6235387B1 (en) 1998-03-30 2001-05-22 3M Innovative Properties Company Semiconductor wafer processing tapes
JP3739570B2 (ja) 1998-06-02 2006-01-25 リンテック株式会社 粘着シートおよびその利用方法
US6331080B1 (en) 1998-07-15 2001-12-18 3M Innovative Properties Company Optical fiber connector using colored photocurable adhesive
JP3669196B2 (ja) 1998-07-27 2005-07-06 日東電工株式会社 紫外線硬化型粘着シート
JP3410371B2 (ja) 1998-08-18 2003-05-26 リンテック株式会社 ウエハ裏面研削時の表面保護シートおよびその利用方法
JP3661444B2 (ja) 1998-10-28 2005-06-15 株式会社ルネサステクノロジ 半導体装置、半導体ウエハ、半導体モジュールおよび半導体装置の製造方法
JP4544658B2 (ja) * 1999-02-02 2010-09-15 日東電工株式会社 半導体ウエハ保護用粘着シート及び半導体ウエハの研削方法
KR100672130B1 (ko) * 1999-07-08 2007-01-19 산스타 기켄 가부시키가이샤 반도체 패키지용 언더필링 재료
JP4230080B2 (ja) * 2000-02-18 2009-02-25 リンテック株式会社 ウエハ貼着用粘着シート
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US6759121B2 (en) * 2000-07-13 2004-07-06 3M Innovative Properties Company Clear adhesive sheet
US6472065B1 (en) * 2000-07-13 2002-10-29 3M Innovative Properties Company Clear adhesive sheet
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JP2003234359A (ja) * 2002-02-08 2003-08-22 Hitachi Ltd 半導体装置の製造方法
JP4115711B2 (ja) * 2002-02-14 2008-07-09 日東電工株式会社 フレキシブルプリント配線板固定用接着シート及びフレキシブルプリント配線板への電子部品の実装方法
JP4189156B2 (ja) * 2002-02-22 2008-12-03 株式会社トクヤマ チップ貼設シート
JP2004273895A (ja) * 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd 半導体ウエーハの分割方法
US7410831B2 (en) * 2003-05-12 2008-08-12 Tokyo Seimitsu Co., Ltd. Method and device for dividing plate-like member
FR2857502B1 (fr) * 2003-07-10 2006-02-24 Soitec Silicon On Insulator Substrats pour systemes contraints
JP2005051018A (ja) * 2003-07-28 2005-02-24 Sanyo Electric Co Ltd 半導体装置及びその製造方法
DE10340409B4 (de) * 2003-09-02 2007-05-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Trägerwafer und Verfahren zum Bearbeiten eines Halbleiterwafers unter Verwendung eines Trägerwafers
US20050249945A1 (en) * 2004-05-10 2005-11-10 Wen Kun Yang Manufacturing tool for wafer level package and method of placing dies
JP2006152141A (ja) * 2004-11-30 2006-06-15 Furukawa Electric Co Ltd:The 粘着テープ
DE102005055769A1 (de) * 2005-11-21 2007-05-24 Tesa Ag Verfahren zur temporären Fixierung eines polymeren Schichtmaterials auf rauen Oberflächen
JP5047556B2 (ja) * 2006-07-26 2012-10-10 リンテック株式会社 光学機能性フィルム貼合用粘着剤、粘着剤付き光学機能性フィルム及びその製造方法
JP5101111B2 (ja) * 2007-01-05 2012-12-19 日東電工株式会社 半導体基板加工用粘着シート
CN101681845A (zh) * 2007-06-22 2010-03-24 住友电木株式会社 粘接膜及使用该粘接膜的半导体装置
JP4553400B2 (ja) * 2008-02-18 2010-09-29 日東電工株式会社 ダイシング・ダイボンドフィルム
JP4318743B1 (ja) * 2008-10-07 2009-08-26 昭和高分子株式会社 紫外線硬化型再剥離性粘着剤組成物及びこれを用いた粘着シート
JP2011023396A (ja) * 2009-07-13 2011-02-03 Nitto Denko Corp 表面保護シート
EP2368955A1 (de) 2010-03-26 2011-09-28 Sika Technology AG Formgedächtnis-Material auf Basis eines Strukturklebstoffs
JP5528169B2 (ja) * 2010-03-26 2014-06-25 東洋ゴム工業株式会社 研磨パッドおよびその製造方法、ならびに半導体デバイスの製造方法
GB201012595D0 (en) 2010-07-27 2010-09-08 Zephyros Inc Oriented structural adhesives
JP5687897B2 (ja) * 2010-12-28 2015-03-25 日東電工株式会社 放射線硬化型粘着剤組成物及び粘着シート
JP2012227232A (ja) * 2011-04-15 2012-11-15 Denki Kagaku Kogyo Kk 加工用粘着シート及びそれを用いた板状材料の製造方法
US20160272849A1 (en) * 2013-03-29 2016-09-22 Sekisui Plastics Co., Ltd. Temporary fixing material
JP6063796B2 (ja) * 2013-03-29 2017-01-18 積水化成品工業株式会社 帯電防止シート
US10577523B2 (en) 2013-07-26 2020-03-03 Zephyros, Inc. Relating to thermosetting adhesive films
JP6334223B2 (ja) * 2014-03-26 2018-05-30 リンテック株式会社 粘着シート
CN104312456B (zh) * 2014-10-28 2016-03-30 成都纳硕科技有限公司 一种木质板材用紫外光固化胶及其制备方法
KR102335109B1 (ko) 2014-12-15 2021-12-03 삼성전자 주식회사 미세 패턴 형성 방법 및 이를 이용한 집적회로 소자의 제조 방법
JP6626254B2 (ja) * 2015-02-03 2019-12-25 株式会社テセック 半導体デバイス測定方法
KR102546307B1 (ko) 2015-12-02 2023-06-21 삼성전자주식회사 발광 소자 및 이를 포함하는 표시 장치
JP6917166B2 (ja) * 2017-03-15 2021-08-11 マクセルホールディングス株式会社 ダイシング用粘着テープ、ダイシング用粘着テープの製造方法、および半導体チップの製造方法
JP7035720B2 (ja) * 2018-03-29 2022-03-15 住友ベークライト株式会社 半導体基板加工用粘着テープ
WO2020168174A1 (en) 2019-02-15 2020-08-20 Uniqarta, Inc Dynamic release tapes for assembly of discrete components
WO2021126580A1 (en) * 2019-12-17 2021-06-24 Uniqarta, Inc. Adhesive tapes for receiving discrete components
DE102022100661A1 (de) 2022-01-12 2023-07-13 Forschungsverbund Berlin E.V. Verfahren und Vorrichtung zum Herstellen einer Halbleiterstruktur
CN115229671B (zh) * 2022-08-24 2024-08-06 关勒铭(湖州)晶体材料科技有限公司 一种基于固结磨料的新型红宝石高效研磨工艺
CN117630316B (zh) * 2023-12-14 2025-01-14 池州市千润宇信息技术有限公司 一种污水检测系统

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Also Published As

Publication number Publication date
JP3410202B2 (ja) 2003-05-26
US6297076B1 (en) 2001-10-02
CA2122278A1 (en) 1994-10-29
DE69417463D1 (de) 1999-05-06
JPH07135189A (ja) 1995-05-23
EP0622833B1 (en) 1999-03-31
KR100284989B1 (ko) 2001-03-15
CN1101367A (zh) 1995-04-12
CN1090220C (zh) 2002-09-04
CA2122278C (en) 2005-04-12
TW245825B (ref) 1995-04-21
DE69417463T2 (de) 1999-08-19
EP0622833A1 (en) 1994-11-02

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