MXPA06001555A - Solucion acida y acuosa y metodo para depositar electroliticamente revestimientos de cobre asi como uso de la solucion. - Google Patents
Solucion acida y acuosa y metodo para depositar electroliticamente revestimientos de cobre asi como uso de la solucion.Info
- Publication number
- MXPA06001555A MXPA06001555A MXPA06001555A MXPA06001555A MXPA06001555A MX PA06001555 A MXPA06001555 A MX PA06001555A MX PA06001555 A MXPA06001555 A MX PA06001555A MX PA06001555 A MXPA06001555 A MX PA06001555A MX PA06001555 A MXPA06001555 A MX PA06001555A
- Authority
- MX
- Mexico
- Prior art keywords
- solution
- poly
- acid
- phenazinium
- solution according
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 51
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 51
- 239000010949 copper Substances 0.000 title claims abstract description 51
- 238000000576 coating method Methods 0.000 title claims abstract description 32
- 238000000151 deposition Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 title claims description 17
- 239000000243 solution Substances 0.000 title abstract description 57
- 239000003929 acidic solution Substances 0.000 title abstract description 4
- -1 aromatic halogen Chemical class 0.000 claims abstract description 56
- 229910052736 halogen Inorganic materials 0.000 claims abstract description 34
- 239000000654 additive Substances 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 14
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 12
- 150000002367 halogens Chemical class 0.000 claims abstract description 12
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 12
- 239000001301 oxygen Substances 0.000 claims abstract description 12
- 229920003023 plastic Polymers 0.000 claims abstract description 11
- 239000004033 plastic Substances 0.000 claims abstract description 11
- 150000003464 sulfur compounds Chemical class 0.000 claims abstract description 9
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 7
- 230000000996 additive effect Effects 0.000 claims abstract description 6
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 5
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 claims abstract description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 5
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims abstract description 5
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 claims abstract description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 3
- 239000001257 hydrogen Substances 0.000 claims abstract description 3
- 239000002253 acid Substances 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 13
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 12
- SQHWUYVHKRVCMD-UHFFFAOYSA-N 2-n,2-n-dimethyl-10-phenylphenazin-10-ium-2,8-diamine;chloride Chemical compound [Cl-].C12=CC(N(C)C)=CC=C2N=C2C=CC(N)=CC2=[N+]1C1=CC=CC=C1 SQHWUYVHKRVCMD-UHFFFAOYSA-N 0.000 claims description 11
- 150000001875 compounds Chemical class 0.000 claims description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 10
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 10
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 10
- 229920001223 polyethylene glycol Polymers 0.000 claims description 9
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 8
- 229910017464 nitrogen compound Inorganic materials 0.000 claims description 8
- 150000002830 nitrogen compounds Chemical class 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 8
- 150000003839 salts Chemical class 0.000 claims description 8
- 125000000446 sulfanediyl group Chemical group *S* 0.000 claims description 8
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 claims description 6
- 239000002202 Polyethylene glycol Substances 0.000 claims description 6
- 150000002148 esters Chemical class 0.000 claims description 6
- 229920002873 Polyethylenimine Polymers 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- DNIAPMSPPWPWGF-UHFFFAOYSA-N propylene glycol Substances CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 5
- 239000011780 sodium chloride Substances 0.000 claims description 5
- 159000000000 sodium salts Chemical class 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 229920000151 polyglycol Polymers 0.000 claims description 4
- 239000010695 polyglycol Substances 0.000 claims description 4
- QXNVGIXVLWOKEQ-UHFFFAOYSA-N Disodium Chemical class [Na][Na] QXNVGIXVLWOKEQ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 3
- RYYWUUFWQRZTIU-UHFFFAOYSA-N Thiophosphoric acid Chemical compound OP(O)(S)=O RYYWUUFWQRZTIU-UHFFFAOYSA-N 0.000 claims description 3
- 150000001408 amides Chemical class 0.000 claims description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 3
- 150000002466 imines Chemical class 0.000 claims description 3
- 229940098779 methanesulfonic acid Drugs 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 229920001522 polyglycol ester Polymers 0.000 claims description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 3
- MBYQPPXEXWRMQC-UHFFFAOYSA-N (2-chlorophenyl)methanol Chemical compound OCC1=CC=CC=C1Cl MBYQPPXEXWRMQC-UHFFFAOYSA-N 0.000 claims description 2
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 claims description 2
- RILZRCJGXSFXNE-UHFFFAOYSA-N 2-[4-(trifluoromethoxy)phenyl]ethanol Chemical compound OCCC1=CC=C(OC(F)(F)F)C=C1 RILZRCJGXSFXNE-UHFFFAOYSA-N 0.000 claims description 2
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 claims description 2
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 claims description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 2
- 229920002134 Carboxymethyl cellulose Polymers 0.000 claims description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 2
- 239000005642 Oleic acid Substances 0.000 claims description 2
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 claims description 2
- 229920000464 Poly(propylene glycol)-block-poly(ethylene glycol)-block-poly(propylene glycol) Polymers 0.000 claims description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 2
- 229920002125 Sokalan® Polymers 0.000 claims description 2
- 235000021355 Stearic acid Nutrition 0.000 claims description 2
- 229910001413 alkali metal ion Inorganic materials 0.000 claims description 2
- 150000001340 alkali metals Chemical class 0.000 claims description 2
- 229910001420 alkaline earth metal ion Inorganic materials 0.000 claims description 2
- HTKFORQRBXIQHD-UHFFFAOYSA-N allylthiourea Chemical compound NC(=S)NCC=C HTKFORQRBXIQHD-UHFFFAOYSA-N 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims description 2
- 239000011575 calcium Substances 0.000 claims description 2
- 229910052791 calcium Inorganic materials 0.000 claims description 2
- 239000001768 carboxy methyl cellulose Substances 0.000 claims description 2
- 235000010948 carboxy methyl cellulose Nutrition 0.000 claims description 2
- 239000008112 carboxymethyl-cellulose Substances 0.000 claims description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 2
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 claims description 2
- 150000003949 imides Chemical class 0.000 claims description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 claims description 2
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 claims description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 2
- 239000011777 magnesium Substances 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- SPBDDPQYRLAFII-UHFFFAOYSA-M n,n,10-trimethylphenazin-10-ium-2-amine;acetate Chemical compound CC([O-])=O.C1=CC=CC2=[N+](C)C3=CC(N(C)C)=CC=C3N=C21 SPBDDPQYRLAFII-UHFFFAOYSA-M 0.000 claims description 2
- ZZJOPEPPFYWXML-UHFFFAOYSA-N n,n,7-trimethylphenazin-10-ium-2-amine;sulfate Chemical compound [O-]S([O-])(=O)=O.C1=C(C)C=CC2=[NH+]C3=CC(N(C)C)=CC=C3N=C21.C1=C(C)C=CC2=[NH+]C3=CC(N(C)C)=CC=C3N=C21 ZZJOPEPPFYWXML-UHFFFAOYSA-N 0.000 claims description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- PEQRIOFEIXZOQL-UHFFFAOYSA-N n-carbamothioylacetamide;thiourea Chemical compound NC(N)=S.CC(=O)NC(N)=S PEQRIOFEIXZOQL-UHFFFAOYSA-N 0.000 claims description 2
- AQIPJGFHPAYIPJ-UHFFFAOYSA-N n-ethyl-7,10-diphenylphenazin-10-ium-2-amine;chloride Chemical compound [Cl-].C12=CC(NCC)=CC=C2N=C2C=C(C=3C=CC=CC=3)C=CC2=[N+]1C1=CC=CC=C1 AQIPJGFHPAYIPJ-UHFFFAOYSA-N 0.000 claims description 2
- URPCIIYTOGQWMA-UHFFFAOYSA-N n-methyl-10-phenylphenazin-10-ium-2-amine;acetate Chemical compound CC([O-])=O.C12=CC(NC)=CC=C2N=C2C=CC=CC2=[N+]1C1=CC=CC=C1 URPCIIYTOGQWMA-UHFFFAOYSA-N 0.000 claims description 2
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 2
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 claims description 2
- 229920000333 poly(propyleneimine) Polymers 0.000 claims description 2
- 239000004584 polyacrylic acid Substances 0.000 claims description 2
- 229920001521 polyalkylene glycol ether Polymers 0.000 claims description 2
- 229920001748 polybutylene Polymers 0.000 claims description 2
- 229920001451 polypropylene glycol Polymers 0.000 claims description 2
- 239000011591 potassium Substances 0.000 claims description 2
- 229910052700 potassium Inorganic materials 0.000 claims description 2
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 claims description 2
- 239000011734 sodium Substances 0.000 claims description 2
- 229910052708 sodium Inorganic materials 0.000 claims description 2
- 239000008117 stearic acid Substances 0.000 claims description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 claims description 2
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 claims 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims 2
- AOSZTAHDEDLTLQ-AZKQZHLXSA-N (1S,2S,4R,8S,9S,11S,12R,13S,19S)-6-[(3-chlorophenyl)methyl]-12,19-difluoro-11-hydroxy-8-(2-hydroxyacetyl)-9,13-dimethyl-6-azapentacyclo[10.8.0.02,9.04,8.013,18]icosa-14,17-dien-16-one Chemical compound C([C@@H]1C[C@H]2[C@H]3[C@]([C@]4(C=CC(=O)C=C4[C@@H](F)C3)C)(F)[C@@H](O)C[C@@]2([C@@]1(C1)C(=O)CO)C)N1CC1=CC=CC(Cl)=C1 AOSZTAHDEDLTLQ-AZKQZHLXSA-N 0.000 claims 1
- HBXWUCXDUUJDRB-UHFFFAOYSA-N 1-octadecoxyoctadecane Chemical compound CCCCCCCCCCCCCCCCCCOCCCCCCCCCCCCCCCCCC HBXWUCXDUUJDRB-UHFFFAOYSA-N 0.000 claims 1
- IBMUHJIDXFMZPI-UHFFFAOYSA-N 2-chlorobenzaldehyde Chemical compound ClC1=CC=CC=C1C=O.ClC1=CC=CC=C1C=O IBMUHJIDXFMZPI-UHFFFAOYSA-N 0.000 claims 1
- HYYIFRBLARMOSX-UHFFFAOYSA-N 3,7-dimethyl-10-phenylphenazin-10-ium-2-amine;sulfate Chemical compound [O-]S([O-])(=O)=O.C=12C=C(N)C(C)=CC2=NC2=CC(C)=CC=C2[N+]=1C1=CC=CC=C1.C=12C=C(N)C(C)=CC2=NC2=CC(C)=CC=C2[N+]=1C1=CC=CC=C1 HYYIFRBLARMOSX-UHFFFAOYSA-N 0.000 claims 1
- JDHGULPYLQURMV-UHFFFAOYSA-N 3-chlorophenol;4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1.OC1=CC=CC(Cl)=C1 JDHGULPYLQURMV-UHFFFAOYSA-N 0.000 claims 1
- HQEZNLWSSLDARQ-UHFFFAOYSA-N 4-bromo-2,6-dimethylphenol 4-bromophenol Chemical compound CC1=C(C(=CC(=C1)Br)C)O.BrC1=CC=C(C=C1)O HQEZNLWSSLDARQ-UHFFFAOYSA-N 0.000 claims 1
- 229940126657 Compound 17 Drugs 0.000 claims 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims 1
- 239000005977 Ethylene Substances 0.000 claims 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- LLCOQRWCWBSFTR-UHFFFAOYSA-N N-carbamothioyl-2-cyanoacetamide N-carbamothioyl-2,2,2-trifluoroacetamide ethylthiourea Chemical compound C(#N)CC(=O)NC(=S)N.C(C)NC(=S)N.FC(C(=O)NC(=S)N)(F)F LLCOQRWCWBSFTR-UHFFFAOYSA-N 0.000 claims 1
- FDCGIFOXCKSNRS-UHFFFAOYSA-L [Na+].[Na+].[O-]S(=O)(=O)CCCS.[O-]S(=O)(=O)CCCS Chemical compound [Na+].[Na+].[O-]S(=O)(=O)CCCS.[O-]S(=O)(=O)CCCS FDCGIFOXCKSNRS-UHFFFAOYSA-L 0.000 claims 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims 1
- 125000001477 organic nitrogen group Chemical group 0.000 claims 1
- HRXKRNGNAMMEHJ-UHFFFAOYSA-K trisodium citrate Chemical compound [Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O HRXKRNGNAMMEHJ-UHFFFAOYSA-K 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 6
- 125000004435 hydrogen atom Chemical class [H]* 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 8
- 150000001299 aldehydes Chemical class 0.000 description 7
- 229910000365 copper sulfate Inorganic materials 0.000 description 6
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 6
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000008151 electrolyte solution Substances 0.000 description 5
- 229940021013 electrolyte solution Drugs 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000003792 electrolyte Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000000080 wetting agent Substances 0.000 description 4
- OSDLLIBGSJNGJE-UHFFFAOYSA-N 4-chloro-3,5-dimethylphenol Chemical compound CC1=CC(O)=CC(C)=C1Cl OSDLLIBGSJNGJE-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
- 239000011260 aqueous acid Substances 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 3
- 230000000875 corresponding effect Effects 0.000 description 3
- 239000000975 dye Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920001515 polyalkylene glycol Polymers 0.000 description 3
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- SPEUIVXLLWOEMJ-UHFFFAOYSA-N 1,1-dimethoxyethane Chemical group COC(C)OC SPEUIVXLLWOEMJ-UHFFFAOYSA-N 0.000 description 1
- OSZBRXNBKKWJOM-UHFFFAOYSA-N 1-phenylphenazine Chemical compound C1=CC=CC=C1C1=CC=CC2=NC3=CC=CC=C3N=C12 OSZBRXNBKKWJOM-UHFFFAOYSA-N 0.000 description 1
- DBHODFSFBXJZNY-UHFFFAOYSA-N 2,4-dichlorobenzyl alcohol Chemical compound OCC1=CC=C(Cl)C=C1Cl DBHODFSFBXJZNY-UHFFFAOYSA-N 0.000 description 1
- SCVJRXQHFJXZFZ-KVQBGUIXSA-N 2-amino-9-[(2r,4s,5r)-4-hydroxy-5-(hydroxymethyl)oxolan-2-yl]-3h-purine-6-thione Chemical class C1=2NC(N)=NC(=S)C=2N=CN1[C@H]1C[C@H](O)[C@@H](CO)O1 SCVJRXQHFJXZFZ-KVQBGUIXSA-N 0.000 description 1
- ZMOMCILMBYEGLD-UHFFFAOYSA-N 2-chloro-4-hydroxybenzaldehyde Chemical compound OC1=CC=C(C=O)C(Cl)=C1 ZMOMCILMBYEGLD-UHFFFAOYSA-N 0.000 description 1
- FPYUJUBAXZAQNL-UHFFFAOYSA-N 2-chlorobenzaldehyde Chemical compound ClC1=CC=CC=C1C=O FPYUJUBAXZAQNL-UHFFFAOYSA-N 0.000 description 1
- ANELVAQVEOPNEV-UHFFFAOYSA-N 3,5-dibromobenzaldehyde 2,5-dibromobenzoic acid 2,6-dibromo-4-methylphenol 2,5-dichlorophenol 2,3,6-trichlorobenzaldehyde 2,4,6-trichlorophenol Chemical compound ClC1=C(C=O)C(=CC=C1Cl)Cl.ClC1=C(C(=CC(=C1)Cl)Cl)O.BrC1=C(C(=O)O)C=C(C=C1)Br.BrC=1C=C(C=O)C=C(C1)Br.ClC1=C(C=C(C=C1)Cl)O.BrC1=C(C(=CC(=C1)C)Br)O ANELVAQVEOPNEV-UHFFFAOYSA-N 0.000 description 1
- UGEJOEBBMPOJMT-UHFFFAOYSA-N 3-(trifluoromethyl)phenol Chemical compound OC1=CC=CC(C(F)(F)F)=C1 UGEJOEBBMPOJMT-UHFFFAOYSA-N 0.000 description 1
- HORNXRXVQWOLPJ-UHFFFAOYSA-N 3-chlorophenol Chemical compound OC1=CC=CC(Cl)=C1 HORNXRXVQWOLPJ-UHFFFAOYSA-N 0.000 description 1
- OBDVFOBWBHMJDG-UHFFFAOYSA-N 3-mercapto-1-propanesulfonic acid Chemical compound OS(=O)(=O)CCCS OBDVFOBWBHMJDG-UHFFFAOYSA-N 0.000 description 1
- GZFGOTFRPZRKDS-UHFFFAOYSA-N 4-bromophenol Chemical compound OC1=CC=C(Br)C=C1 GZFGOTFRPZRKDS-UHFFFAOYSA-N 0.000 description 1
- JQVAPEJNIZULEK-UHFFFAOYSA-N 4-chlorobenzene-1,3-diol Chemical compound OC1=CC=C(Cl)C(O)=C1 JQVAPEJNIZULEK-UHFFFAOYSA-N 0.000 description 1
- RNMDNPCBIKJCQP-UHFFFAOYSA-N 5-nonyl-7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-ol Chemical compound C(CCCCCCCC)C1=C2C(=C(C=C1)O)O2 RNMDNPCBIKJCQP-UHFFFAOYSA-N 0.000 description 1
- MWXMWLZIZRDIBL-UHFFFAOYSA-N 5-phenyl-4a,10-dihydro-4h-phenazin-10-ium-2-amine;chloride Chemical compound [Cl-].C12=CC=CC=C2[NH2+]C2=CC(N)=CCC2N1C1=CC=CC=C1 MWXMWLZIZRDIBL-UHFFFAOYSA-N 0.000 description 1
- KYOGPZIVCWSXTO-UHFFFAOYSA-N 6-methyl-1h-pyrimidine-2-thione;2-sulfanylidene-1h-pyrimidin-4-one Chemical compound CC1=CC=NC(=S)N1.O=C1C=CNC(=S)N1 KYOGPZIVCWSXTO-UHFFFAOYSA-N 0.000 description 1
- BBGFVQCCZUXILQ-UHFFFAOYSA-N 7-methyl-n,10-diphenylphenazin-10-ium-2-amine;sulfate Chemical compound [O-]S([O-])(=O)=O.C=12C=C(NC=3C=CC=CC=3)C=CC2=NC2=CC(C)=CC=C2[N+]=1C1=CC=CC=C1.C=12C=C(NC=3C=CC=CC=3)C=CC2=NC2=CC(C)=CC=C2[N+]=1C1=CC=CC=C1 BBGFVQCCZUXILQ-UHFFFAOYSA-N 0.000 description 1
- VZCCTDLWCKUBGD-UHFFFAOYSA-N 8-[[4-(dimethylamino)phenyl]diazenyl]-10-phenylphenazin-10-ium-2-amine;chloride Chemical compound [Cl-].C1=CC(N(C)C)=CC=C1N=NC1=CC=C(N=C2C(C=C(N)C=C2)=[N+]2C=3C=CC=CC=3)C2=C1 VZCCTDLWCKUBGD-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- 239000004375 Dextrin Substances 0.000 description 1
- 229920001353 Dextrin Polymers 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- 125000003047 N-acetyl group Chemical group 0.000 description 1
- IPCRBOOJBPETMF-UHFFFAOYSA-N N-acetylthiourea Chemical compound CC(=O)NC(N)=S IPCRBOOJBPETMF-UHFFFAOYSA-N 0.000 description 1
- PCNDJXKNXGMECE-UHFFFAOYSA-N Phenazine Natural products C1=CC=CC2=NC3=CC=CC=C3N=C21 PCNDJXKNXGMECE-UHFFFAOYSA-N 0.000 description 1
- 229920000463 Poly(ethylene glycol)-block-poly(propylene glycol)-block-poly(ethylene glycol) Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- LWIAAYVISAAATJ-UHFFFAOYSA-L [Na+].[Na+].S(=O)(=O)([O-])C(CCSSCCC(O)S(=O)(=O)[O-])O Chemical compound [Na+].[Na+].S(=O)(=O)([O-])C(CCSSCCC(O)S(=O)(=O)[O-])O LWIAAYVISAAATJ-UHFFFAOYSA-L 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 150000001241 acetals Chemical class 0.000 description 1
- 150000003926 acrylamides Chemical class 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000010405 anode material Substances 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- KCXMKQUNVWSEMD-UHFFFAOYSA-N benzyl chloride Chemical compound ClCC1=CC=CC=C1 KCXMKQUNVWSEMD-UHFFFAOYSA-N 0.000 description 1
- 229940073608 benzyl chloride Drugs 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 235000010980 cellulose Nutrition 0.000 description 1
- UGWKCNDTYUOTQZ-UHFFFAOYSA-N copper;sulfuric acid Chemical compound [Cu].OS(O)(=O)=O UGWKCNDTYUOTQZ-UHFFFAOYSA-N 0.000 description 1
- 238000002484 cyclic voltammetry Methods 0.000 description 1
- 230000000254 damaging effect Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 235000019425 dextrin Nutrition 0.000 description 1
- 229960004698 dichlorobenzyl alcohol Drugs 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- WIYCQLLGDNXIBA-UHFFFAOYSA-L disodium;3-(3-sulfonatopropyldisulfanyl)propane-1-sulfonate Chemical compound [Na+].[Na+].[O-]S(=O)(=O)CCCSSCCCS([O-])(=O)=O WIYCQLLGDNXIBA-UHFFFAOYSA-L 0.000 description 1
- NPMNVMGOSNUOHS-UHFFFAOYSA-L disodium;3-(3-sulfonatopropylsulfanyl)propane-1-sulfonate Chemical compound [Na+].[Na+].[O-]S(=O)(=O)CCCSCCCS([O-])(=O)=O NPMNVMGOSNUOHS-UHFFFAOYSA-L 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- LRMHFDNWKCSEQU-UHFFFAOYSA-N ethoxyethane;phenol Chemical compound CCOCC.OC1=CC=CC=C1 LRMHFDNWKCSEQU-UHFFFAOYSA-N 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 150000002440 hydroxy compounds Chemical class 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- 150000002605 large molecules Chemical class 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- LNGQDLWAPLXXDF-UHFFFAOYSA-L n,n,1-trimethyl-10-phenylphenazin-10-ium-2-amine;sulfate Chemical compound [O-]S([O-])(=O)=O.C12=C(C)C(N(C)C)=CC=C2N=C2C=CC=CC2=[N+]1C1=CC=CC=C1.C12=C(C)C(N(C)C)=CC=C2N=C2C=CC=CC2=[N+]1C1=CC=CC=C1 LNGQDLWAPLXXDF-UHFFFAOYSA-L 0.000 description 1
- XQURAQQWHLZZJZ-UHFFFAOYSA-L n,n,7-trimethyl-10-phenylphenazin-10-ium-2-amine;sulfate Chemical compound [O-]S([O-])(=O)=O.C12=CC(N(C)C)=CC=C2N=C2C=C(C)C=CC2=[N+]1C1=CC=CC=C1.C12=CC(N(C)C)=CC=C2N=C2C=C(C)C=CC2=[N+]1C1=CC=CC=C1 XQURAQQWHLZZJZ-UHFFFAOYSA-L 0.000 description 1
- CSPOBUGOIOVNRS-UHFFFAOYSA-M n,n-dimethyl-10-phenylphenazin-10-ium-2-amine;chloride Chemical compound [Cl-].C12=CC(N(C)C)=CC=C2N=C2C=CC=CC2=[N+]1C1=CC=CC=C1 CSPOBUGOIOVNRS-UHFFFAOYSA-M 0.000 description 1
- PTJZRLCLRPDVEY-UHFFFAOYSA-L n,n-dimethyl-3,7,10-triphenylphenazin-10-ium-2-amine;sulfate Chemical compound [O-]S([O-])(=O)=O.C12=CC=C(C=3C=CC=CC=3)C=C2N=C2C=C(C=3C=CC=CC=3)C(N(C)C)=CC2=[N+]1C1=CC=CC=C1.C12=CC=C(C=3C=CC=CC=3)C=C2N=C2C=C(C=3C=CC=CC=3)C(N(C)C)=CC2=[N+]1C1=CC=CC=C1 PTJZRLCLRPDVEY-UHFFFAOYSA-L 0.000 description 1
- MQWKHMLZCMWUMX-UHFFFAOYSA-N n-carbamothioyl-2-cyanoacetamide;ethylthiourea Chemical compound CCNC(N)=S.NC(=S)NC(=O)CC#N MQWKHMLZCMWUMX-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- ACLZYRNSDLQOIA-UHFFFAOYSA-N o-tolylthiourea Chemical compound CC1=CC=CC=C1NC(N)=S ACLZYRNSDLQOIA-UHFFFAOYSA-N 0.000 description 1
- 150000002898 organic sulfur compounds Chemical class 0.000 description 1
- 125000001741 organic sulfur group Chemical group 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 150000002988 phenazines Chemical class 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical class N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001281 polyalkylene Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- RIFYBBXGYKFBFC-UHFFFAOYSA-K trisodium;thiophosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=S RIFYBBXGYKFBFC-UHFFFAOYSA-K 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Chemically Coating (AREA)
- Paints Or Removers (AREA)
- Electrolytic Production Of Metals (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10337669A DE10337669B4 (de) | 2003-08-08 | 2003-08-08 | Wässrige, saure Lösung und Verfahren zum galvanischen Abscheiden von Kupferüberzügen sowie Verwendung der Lösung |
| PCT/EP2004/008492 WO2005014891A2 (en) | 2003-08-08 | 2004-07-28 | Aqueous, acidic solution and method for electrolytically depositing copper coatings as well as use of said solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MXPA06001555A true MXPA06001555A (es) | 2006-05-15 |
Family
ID=34112129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MXPA06001555A MXPA06001555A (es) | 2003-08-08 | 2004-07-28 | Solucion acida y acuosa y metodo para depositar electroliticamente revestimientos de cobre asi como uso de la solucion. |
Country Status (14)
| Country | Link |
|---|---|
| US (1) | US20080142370A1 (OSRAM) |
| EP (1) | EP1651801B1 (OSRAM) |
| JP (1) | JP4586020B2 (OSRAM) |
| KR (1) | KR101105938B1 (OSRAM) |
| CN (1) | CN1833054B (OSRAM) |
| AT (1) | ATE384808T1 (OSRAM) |
| BR (1) | BRPI0413376A (OSRAM) |
| CA (1) | CA2532445C (OSRAM) |
| DE (2) | DE10337669B4 (OSRAM) |
| ES (1) | ES2298799T3 (OSRAM) |
| MX (1) | MXPA06001555A (OSRAM) |
| MY (1) | MY138397A (OSRAM) |
| TW (1) | TW200512318A (OSRAM) |
| WO (1) | WO2005014891A2 (OSRAM) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4750486B2 (ja) * | 2005-07-06 | 2011-08-17 | 株式会社Adeka | 電解銅メッキ用添加剤、該添加剤を含有する電解銅メッキ浴及び該メッキ浴を使用する電解銅メッキ方法 |
| ATE506468T1 (de) * | 2008-04-28 | 2011-05-15 | Atotech Deutschland Gmbh | Wässriges saures bad und verfahren zum elektrolytischen abschneiden von kupfer |
| US8262894B2 (en) * | 2009-04-30 | 2012-09-11 | Moses Lake Industries, Inc. | High speed copper plating bath |
| CN101899687A (zh) * | 2010-08-03 | 2010-12-01 | 济南德锡科技有限公司 | 单剂染料型光亮酸性镀铜添加剂及其制备方法和应用 |
| EP2465976B1 (en) | 2010-12-15 | 2013-04-03 | Rohm and Haas Electronic Materials LLC | Method of electroplating uniform copper layer on the edge and walls of though holes of a substrate. |
| CN103834972B (zh) * | 2014-02-10 | 2017-01-18 | 东莞华威铜箔科技有限公司 | 4微米无载体电解铜箔用添加剂、制备方法及其应用 |
| CN110295382B (zh) * | 2019-03-22 | 2021-07-13 | 苏州昕皓新材料科技有限公司 | 酸铜整平剂及其应用、铜电镀溶液及其制备方法 |
| CN110541179B (zh) * | 2019-09-23 | 2020-07-21 | 深圳市创智成功科技有限公司 | 用于晶圆级封装超级tsv铜互连材料的电镀铜溶液及电镀方法 |
| CN110846694B (zh) * | 2019-12-31 | 2020-12-08 | 天长市飞龙金属制品有限公司 | 一种镀锌液 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL291575A (OSRAM) * | 1962-04-16 | |||
| DE1246347B (de) * | 1966-03-08 | 1967-08-03 | Schering Ag | Saures galvanisches Kupferbad |
| DE2028803C3 (de) * | 1970-06-06 | 1980-08-14 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Polymere Phenazoniumverbindungen |
| FR2096936A1 (en) * | 1970-07-17 | 1972-03-03 | Labolac | Tin plating bath additive - 2,4,6-substd phenol for strong bright dep |
| JPS4916176B1 (OSRAM) * | 1970-11-16 | 1974-04-20 | ||
| US4000047A (en) * | 1972-11-17 | 1976-12-28 | Lea-Ronal, Inc. | Electrodeposition of tin, lead and tin-lead alloys |
| ES440918A1 (es) * | 1975-03-11 | 1977-06-01 | Oxy Metal Industries Corp | Un metodo para la preparacion de una poli (sal de alcanol- amonio cuaternario). |
| DE2746938C2 (de) * | 1977-10-17 | 1987-04-09 | Schering AG, 1000 Berlin und 4709 Bergkamen | Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung dieses Bades |
| US4417956A (en) * | 1980-07-17 | 1983-11-29 | Electrochemical Products, Inc. | Alkaline plating baths and electroplating process |
| US4376685A (en) * | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
| FR2510145B1 (fr) * | 1981-07-24 | 1986-02-07 | Rhone Poulenc Spec Chim | Additif pour bain de cuivrage electrolytique acide, son procede de preparation et son application au cuivrage des circuits imprimes |
| JPS59501829A (ja) * | 1982-09-30 | 1984-11-01 | リ−ロ−ナル インコ−ポレ−テツド | 電気銅メッキ液 |
| AU554236B2 (en) * | 1983-06-10 | 1986-08-14 | Omi International Corp. | Electrolyte composition and process for electrodepositing copper |
| US4601847A (en) * | 1983-08-22 | 1986-07-22 | Macdermid, Incorporated | Composition for use in electroplating of metals |
| DE4032864A1 (de) * | 1990-10-13 | 1992-04-16 | Schering Ag | Saures bad zur galvanischen abscheidung von kupferueberzuegen und verfahren unter verwendung dieser kombination |
| JPH07316876A (ja) * | 1994-05-23 | 1995-12-05 | C Uyemura & Co Ltd | 電気銅めっき用添加剤及び電気銅めっき浴 |
| CA2320278C (en) * | 1998-02-12 | 2006-01-03 | Acm Research, Inc. | Plating apparatus and method |
| TW577938B (en) * | 1998-11-05 | 2004-03-01 | Uyemura C & Co Ltd | Tin-copper alloy electroplating bath and plating process therewith |
| US6652731B2 (en) * | 2001-10-02 | 2003-11-25 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| US6773573B2 (en) * | 2001-10-02 | 2004-08-10 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| US6736954B2 (en) * | 2001-10-02 | 2004-05-18 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| US6911068B2 (en) * | 2001-10-02 | 2005-06-28 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
-
2003
- 2003-08-08 DE DE10337669A patent/DE10337669B4/de not_active Expired - Fee Related
-
2004
- 2004-07-28 CA CA2532445A patent/CA2532445C/en not_active Expired - Fee Related
- 2004-07-28 MX MXPA06001555A patent/MXPA06001555A/es active IP Right Grant
- 2004-07-28 JP JP2006522934A patent/JP4586020B2/ja not_active Expired - Fee Related
- 2004-07-28 BR BRPI0413376-5A patent/BRPI0413376A/pt not_active Application Discontinuation
- 2004-07-28 AT AT04763597T patent/ATE384808T1/de active
- 2004-07-28 EP EP04763597A patent/EP1651801B1/en not_active Expired - Lifetime
- 2004-07-28 KR KR1020067002737A patent/KR101105938B1/ko not_active Expired - Fee Related
- 2004-07-28 ES ES04763597T patent/ES2298799T3/es not_active Expired - Lifetime
- 2004-07-28 CN CN200480022211XA patent/CN1833054B/zh not_active Expired - Fee Related
- 2004-07-28 WO PCT/EP2004/008492 patent/WO2005014891A2/en not_active Ceased
- 2004-07-28 DE DE602004011520T patent/DE602004011520T2/de not_active Expired - Lifetime
- 2004-07-28 US US10/566,913 patent/US20080142370A1/en not_active Abandoned
- 2004-08-05 TW TW093123517A patent/TW200512318A/zh unknown
- 2004-08-06 MY MYPI20043199A patent/MY138397A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| DE602004011520D1 (de) | 2008-03-13 |
| EP1651801A2 (en) | 2006-05-03 |
| WO2005014891A2 (en) | 2005-02-17 |
| ES2298799T3 (es) | 2008-05-16 |
| ATE384808T1 (de) | 2008-02-15 |
| CA2532445C (en) | 2012-03-13 |
| CN1833054A (zh) | 2006-09-13 |
| TW200512318A (en) | 2005-04-01 |
| BRPI0413376A (pt) | 2006-10-17 |
| WO2005014891A3 (en) | 2005-05-26 |
| CA2532445A1 (en) | 2005-02-17 |
| KR20060058109A (ko) | 2006-05-29 |
| DE602004011520T2 (de) | 2009-02-05 |
| JP4586020B2 (ja) | 2010-11-24 |
| JP2007501899A (ja) | 2007-02-01 |
| DE10337669B4 (de) | 2006-04-27 |
| KR101105938B1 (ko) | 2012-01-18 |
| CN1833054B (zh) | 2011-09-07 |
| US20080142370A1 (en) | 2008-06-19 |
| EP1651801B1 (en) | 2008-01-23 |
| DE10337669A1 (de) | 2005-03-03 |
| MY138397A (en) | 2009-05-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3354767B2 (ja) | アルカリ亜鉛および亜鉛合金電気めっき浴およびプロセス | |
| JP2859326B2 (ja) | 光沢があり、亀裂を有さない銅被膜を電気的に析出させる酸性水浴及び印刷回路の導電路補強法 | |
| CN101435099A (zh) | 镀铜方法 | |
| CN102965700B (zh) | 不含氰化物的白青铜的粘着促进性 | |
| JPS6056084A (ja) | 亜鉛及び亜鉛合金電着浴及びその方法 | |
| US5169514A (en) | Plating compositions and processes | |
| US4444629A (en) | Zinc-iron alloy electroplating baths and process | |
| BR112020003856B1 (pt) | Composições de galvanização para deposição eletrolítica de cobre,seu uso e método para deposição eletrolítica de uma camada de cobre ou liga de cobre sobre pelo menos uma superfície de um substrato | |
| GB2062010A (en) | Electroplating Bath and Process | |
| JP5103372B2 (ja) | ポリビニルアンモニウム化合物、ポリビニルアンモニウム化合物の製造方法、ポリビニルアンモニウム化合物を含有する酸性溶液及び銅めっきを電気分解的に析出する方法 | |
| CA2532445C (en) | Aqueous, acidic solution and method for electrolytically depositing copper coatings as well as use of said solution | |
| US5849171A (en) | Acid bath for copper plating and process with the use of this combination | |
| US20040074775A1 (en) | Pulse reverse electrolysis of acidic copper electroplating solutions | |
| US11174566B2 (en) | Aqueous acidic copper electroplating bath and method for electrolytically depositing of a copper coating | |
| JP2009149978A (ja) | 銅−亜鉛合金電気めっき浴およびこれを用いためっき方法 | |
| US4397718A (en) | Zinc plating baths with condensating polymer brighteners | |
| US4134804A (en) | Cyanide-free zinc plating bath and process | |
| EP1766106A2 (en) | Pulse reverse electrolysis of acidic copper electroplating solutions | |
| KR100851229B1 (ko) | 양극의 부동태화를 방지할 수 있는 아연-코발트-텅스텐합금전기도금용액 | |
| WO2010101212A1 (ja) | 銅－亜鉛合金電気めっき浴およびこれを用いためっき方法 | |
| JPS6252039B2 (OSRAM) | ||
| JP2006057165A (ja) | 鋳鉄へのアルカリ性亜鉛系めっき方法 | |
| JPH08176882A (ja) | リフロー処理なしで光沢錫めっきが得られるめっき浴 | |
| CN102471911A (zh) | 具有降低的起泡形成倾向的锌压铸件的电解镀铜方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG | Grant or registration |