MX388439B - Aleacion de cobre para equipo electronico y electrico, material de aleacion de cobre plasticamente trabajado para equipo electronico y electrico, y componente y terminal para equipo electronico y electrico. - Google Patents
Aleacion de cobre para equipo electronico y electrico, material de aleacion de cobre plasticamente trabajado para equipo electronico y electrico, y componente y terminal para equipo electronico y electrico.Info
- Publication number
- MX388439B MX388439B MX2016001257A MX2016001257A MX388439B MX 388439 B MX388439 B MX 388439B MX 2016001257 A MX2016001257 A MX 2016001257A MX 2016001257 A MX2016001257 A MX 2016001257A MX 388439 B MX388439 B MX 388439B
- Authority
- MX
- Mexico
- Prior art keywords
- electronic
- electrical equipment
- copper alloy
- terminal
- content
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D8/00—Modifying the physical properties by deformation combined with, or followed by, heat treatment
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
- C21D9/0068—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for particular articles not mentioned below
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
- C23C30/005—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process on hard metal substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013159642 | 2013-07-31 | ||
| JP2014117998A JP5962707B2 (ja) | 2013-07-31 | 2014-06-06 | 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用銅合金塑性加工材の製造方法、電子・電気機器用部品及び端子 |
| PCT/JP2014/069942 WO2015016218A1 (ja) | 2013-07-31 | 2014-07-29 | 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用部品及び端子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| MX2016001257A MX2016001257A (es) | 2016-05-24 |
| MX388439B true MX388439B (es) | 2025-03-19 |
Family
ID=52431750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2016001257A MX388439B (es) | 2013-07-31 | 2014-07-29 | Aleacion de cobre para equipo electronico y electrico, material de aleacion de cobre plasticamente trabajado para equipo electronico y electrico, y componente y terminal para equipo electronico y electrico. |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US10294547B2 (enExample) |
| EP (1) | EP3029168A4 (enExample) |
| JP (1) | JP5962707B2 (enExample) |
| KR (1) | KR20160036038A (enExample) |
| CN (1) | CN105392908A (enExample) |
| MX (1) | MX388439B (enExample) |
| MY (1) | MY178741A (enExample) |
| TW (1) | TWI521072B (enExample) |
| WO (1) | WO2015016218A1 (enExample) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19900673A1 (de) * | 1999-01-11 | 2000-07-13 | Basf Ag | Verwendung von Bindungspartnern für 5-HT5-Rezeptoren zur Behandlung neurodegenerativer und neuropsychiatrischer Störungen |
| EP2570506B1 (en) * | 2010-05-14 | 2016-04-13 | Mitsubishi Materials Corporation | Copper alloy for electronic device, method for producing this alloy, and copper alloy rolled material for this device |
| JP5903838B2 (ja) | 2011-11-07 | 2016-04-13 | 三菱マテリアル株式会社 | 電子機器用銅合金、電子機器用銅素材、電子機器用銅合金の製造方法、電子機器用銅合金塑性加工材及び電子機器用部品 |
| JP5903842B2 (ja) | 2011-11-14 | 2016-04-13 | 三菱マテリアル株式会社 | 銅合金、銅合金塑性加工材及び銅合金塑性加工材の製造方法 |
| US10128019B2 (en) * | 2015-09-09 | 2018-11-13 | Mitsubishi Materials Corporation | Copper alloy for electronic/electrical device, plastically-worked copper alloy material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar |
| US10453582B2 (en) | 2015-09-09 | 2019-10-22 | Mitsubishi Materials Corporation | Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar |
| MY196265A (en) | 2015-09-09 | 2023-03-24 | Mitsubishi Materials Corp | Copper Alloy for Electronic/Electrical Device, Copper Alloy Plastically-Worked Material For Electronic/Electrical Device, Component for Electronic/Electrical Device, Terminal, And Busbar |
| CN108026611B (zh) * | 2015-09-09 | 2021-11-05 | 三菱综合材料株式会社 | 电子电气设备用铜合金、电子电气设备用组件、端子及汇流条 |
| WO2017043556A1 (ja) * | 2015-09-09 | 2017-03-16 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用部品、端子、及び、バスバー |
| KR102537039B1 (ko) | 2015-11-27 | 2023-05-25 | 미쓰비시 마테리알 가부시키가이샤 | 주석 도금 형성 구리 단자재 및 단자 그리고 전선 단말부 구조 |
| WO2017170699A1 (ja) | 2016-03-30 | 2017-10-05 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、バスバー、及び、リレー用可動片 |
| JP6226097B2 (ja) * | 2016-03-30 | 2017-11-08 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、バスバー、及び、リレー用可動片 |
| JP6226098B2 (ja) * | 2016-03-30 | 2017-11-08 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、バスバー、及び、リレー用可動片 |
| US11319615B2 (en) | 2016-03-30 | 2022-05-03 | Mitsubishi Materials Corporation | Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relay |
| JP6299802B2 (ja) | 2016-04-06 | 2018-03-28 | 三菱マテリアル株式会社 | 超伝導安定化材、超伝導線及び超伝導コイル |
| JP2018077942A (ja) * | 2016-11-07 | 2018-05-17 | 住友電気工業株式会社 | 被覆電線、端子付き電線、銅合金線、及び銅合金撚線 |
| JP6828444B2 (ja) | 2017-01-10 | 2021-02-10 | 日立金属株式会社 | 導電線の製造方法、並びにケーブルの製造方法 |
| KR102452709B1 (ko) * | 2017-05-30 | 2022-10-11 | 현대자동차주식회사 | 자동차 가니쉬용 합금 및 자동차용 가니쉬 |
| KR101875807B1 (ko) * | 2018-03-14 | 2018-07-06 | 주식회사 풍산 | 고강도 및 굽힘가공성이 우수한 자동차 및 전기전자 부품용 동합금재의 제조 방법 |
| WO2019189558A1 (ja) | 2018-03-30 | 2019-10-03 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー |
| JP6780187B2 (ja) | 2018-03-30 | 2020-11-04 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー |
| JP7116870B2 (ja) * | 2019-03-29 | 2022-08-12 | 三菱マテリアル株式会社 | 銅合金板、めっき皮膜付銅合金板及びこれらの製造方法 |
| EP4067517A4 (en) * | 2019-11-29 | 2023-11-22 | Mitsubishi Materials Corporation | Copper alloy, copper alloy plastic-processed material, component for electronic and electric devices, terminal, bus bar, and heat dissipation substrate |
| JP2021127495A (ja) * | 2020-02-13 | 2021-09-02 | 三菱マテリアル株式会社 | 銅合金棒線材、電子・電気機器用部品、端子およびコイルばね |
| JP7455634B2 (ja) * | 2020-03-31 | 2024-03-26 | Dowaメタルテック株式会社 | 銀めっき材およびその製造方法、並びに、端子部品 |
| US12088029B2 (en) * | 2021-07-20 | 2024-09-10 | Dell Products L.P. | Cable termination for information handling systems |
| US12237658B2 (en) * | 2021-07-29 | 2025-02-25 | Aptiv Technologies AG | Bus bar assembly with plated electrical contact surface |
| EP4556144A4 (en) * | 2022-10-24 | 2025-10-08 | Mitsubishi Materials Corp | PROCESS FOR MANUFACTURING COPPER ALLOY POWDER FOR METAL AM |
| CN118321340B (zh) * | 2024-06-07 | 2024-08-27 | 中北大学 | 一种异型金属丝的加工方法 |
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| JPS5344136B2 (enExample) * | 1974-12-23 | 1978-11-27 | ||
| JPS58128292A (ja) * | 1982-01-26 | 1983-07-30 | Furukawa Electric Co Ltd:The | りん銅ろう薄帯 |
| JPH0499235A (ja) * | 1990-08-08 | 1992-03-31 | Mitsubishi Materials Corp | 極低酸素銅の製造法 |
| JPH04350137A (ja) * | 1991-07-19 | 1992-12-04 | Mitsubishi Shindoh Co Ltd | 電気電子機器のCu合金製コネクタ |
| JPH0718354A (ja) | 1993-06-30 | 1995-01-20 | Mitsubishi Electric Corp | 電子機器用銅合金およびその製造方法 |
| JP3904118B2 (ja) * | 1997-02-05 | 2007-04-11 | 株式会社神戸製鋼所 | 電気、電子部品用銅合金とその製造方法 |
| JPH11199954A (ja) * | 1998-01-20 | 1999-07-27 | Kobe Steel Ltd | 電気・電子部品用銅合金 |
| JP3797786B2 (ja) * | 1998-03-06 | 2006-07-19 | 株式会社神戸製鋼所 | 電気・電子部品用銅合金 |
| JP2002038227A (ja) * | 2000-05-16 | 2002-02-06 | Nippon Mining & Metals Co Ltd | 深絞り性に優れたりん青銅条及びその製造方法 |
| JP4610765B2 (ja) * | 2001-03-21 | 2011-01-12 | 株式会社神戸製鋼所 | 熱間圧延可能なりん青銅 |
| US7789977B2 (en) * | 2006-10-26 | 2010-09-07 | Hitachi Cable, Ltd. | Rolled copper foil and manufacturing method thereof |
| JP4466688B2 (ja) | 2007-07-11 | 2010-05-26 | 日立電線株式会社 | 圧延銅箔 |
| JP4974197B2 (ja) | 2009-08-28 | 2012-07-11 | 古河電気工業株式会社 | スパッタリングターゲット用銅材料およびその製造方法 |
| JP4516154B1 (ja) * | 2009-12-23 | 2010-08-04 | 三菱伸銅株式会社 | Cu−Mg−P系銅合金条材及びその製造方法 |
| JP5088384B2 (ja) * | 2010-01-26 | 2012-12-05 | 三菱マテリアル株式会社 | 高強度高導電性銅合金 |
| JP5045784B2 (ja) * | 2010-05-14 | 2012-10-10 | 三菱マテリアル株式会社 | 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材 |
| JP5045783B2 (ja) | 2010-05-14 | 2012-10-10 | 三菱マテリアル株式会社 | 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材 |
| EP2570506B1 (en) * | 2010-05-14 | 2016-04-13 | Mitsubishi Materials Corporation | Copper alloy for electronic device, method for producing this alloy, and copper alloy rolled material for this device |
| JP5088425B2 (ja) * | 2011-01-13 | 2012-12-05 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、銅合金薄板および導電部材 |
| JP5903839B2 (ja) * | 2011-11-07 | 2016-04-13 | 三菱マテリアル株式会社 | 電子機器用銅合金、電子機器用銅合金の製造方法、電子機器用銅合金塑性加工材および電子機器用部品 |
| WO2012169405A1 (ja) * | 2011-06-06 | 2012-12-13 | 三菱マテリアル株式会社 | 電子機器用銅合金、電子機器用銅合金の製造方法、電子機器用銅合金塑性加工材、及び電子機器用部品 |
| JP5703975B2 (ja) * | 2011-06-06 | 2015-04-22 | 三菱マテリアル株式会社 | 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材 |
| JP5903832B2 (ja) * | 2011-10-28 | 2016-04-13 | 三菱マテリアル株式会社 | 電子機器用銅合金、電子機器用銅合金の製造方法、電子機器用銅合金圧延材及び電子機器用部品 |
| JP5910004B2 (ja) * | 2011-11-07 | 2016-04-27 | 三菱マテリアル株式会社 | 電子機器用銅合金、電子機器用銅合金の製造方法、電子機器用銅合金塑性加工材および電子機器用部品 |
| JP5903838B2 (ja) * | 2011-11-07 | 2016-04-13 | 三菱マテリアル株式会社 | 電子機器用銅合金、電子機器用銅素材、電子機器用銅合金の製造方法、電子機器用銅合金塑性加工材及び電子機器用部品 |
| JP5903842B2 (ja) * | 2011-11-14 | 2016-04-13 | 三菱マテリアル株式会社 | 銅合金、銅合金塑性加工材及び銅合金塑性加工材の製造方法 |
| JP2013104096A (ja) * | 2011-11-14 | 2013-05-30 | Mitsubishi Materials Corp | 電子機器用銅合金、電子機器用銅合金の製造方法、電子機器用銅合金塑性加工材および電子機器用部品 |
-
2014
- 2014-06-06 JP JP2014117998A patent/JP5962707B2/ja active Active
- 2014-07-28 TW TW103125685A patent/TWI521072B/zh active
- 2014-07-29 EP EP14831793.6A patent/EP3029168A4/en not_active Withdrawn
- 2014-07-29 CN CN201480039932.5A patent/CN105392908A/zh active Pending
- 2014-07-29 MY MYPI2016700236A patent/MY178741A/en unknown
- 2014-07-29 MX MX2016001257A patent/MX388439B/es unknown
- 2014-07-29 WO PCT/JP2014/069942 patent/WO2015016218A1/ja not_active Ceased
- 2014-07-29 KR KR1020167001487A patent/KR20160036038A/ko not_active Withdrawn
- 2014-07-29 US US14/907,193 patent/US10294547B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| EP3029168A1 (en) | 2016-06-08 |
| EP3029168A4 (en) | 2017-03-15 |
| TWI521072B (zh) | 2016-02-11 |
| WO2015016218A1 (ja) | 2015-02-05 |
| US10294547B2 (en) | 2019-05-21 |
| TW201522669A (zh) | 2015-06-16 |
| MX2016001257A (es) | 2016-05-24 |
| US20160160321A1 (en) | 2016-06-09 |
| JP5962707B2 (ja) | 2016-08-03 |
| MY178741A (en) | 2020-10-20 |
| CN105392908A (zh) | 2016-03-09 |
| KR20160036038A (ko) | 2016-04-01 |
| JP2015045083A (ja) | 2015-03-12 |
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