MY178741A - Copper alloy for electronic and electrical equipment, plastically worked copper alloy material for electronic and electrical equipment, and component and terminal for electronic and electrical equipment - Google Patents

Copper alloy for electronic and electrical equipment, plastically worked copper alloy material for electronic and electrical equipment, and component and terminal for electronic and electrical equipment

Info

Publication number
MY178741A
MY178741A MYPI2016700236A MYPI2016700236A MY178741A MY 178741 A MY178741 A MY 178741A MY PI2016700236 A MYPI2016700236 A MY PI2016700236A MY PI2016700236 A MYPI2016700236 A MY PI2016700236A MY 178741 A MY178741 A MY 178741A
Authority
MY
Malaysia
Prior art keywords
electronic
copper alloy
electrical equipment
terminal
component
Prior art date
Application number
MYPI2016700236A
Other languages
English (en)
Inventor
Ito Yuki
Maki Kazunari
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of MY178741A publication Critical patent/MY178741A/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D8/00Modifying the physical properties by deformation combined with, or followed by, heat treatment
    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D9/00Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
    • C21D9/0068Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for particular articles not mentioned below
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • C23C30/005Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process on hard metal substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/03Contact members characterised by the material, e.g. plating, or coating materials
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/20Recycling

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
MYPI2016700236A 2013-07-31 2014-07-29 Copper alloy for electronic and electrical equipment, plastically worked copper alloy material for electronic and electrical equipment, and component and terminal for electronic and electrical equipment MY178741A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013159642 2013-07-31
JP2014117998A JP5962707B2 (ja) 2013-07-31 2014-06-06 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用銅合金塑性加工材の製造方法、電子・電気機器用部品及び端子

Publications (1)

Publication Number Publication Date
MY178741A true MY178741A (en) 2020-10-20

Family

ID=52431750

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2016700236A MY178741A (en) 2013-07-31 2014-07-29 Copper alloy for electronic and electrical equipment, plastically worked copper alloy material for electronic and electrical equipment, and component and terminal for electronic and electrical equipment

Country Status (9)

Country Link
US (1) US10294547B2 (enExample)
EP (1) EP3029168A4 (enExample)
JP (1) JP5962707B2 (enExample)
KR (1) KR20160036038A (enExample)
CN (1) CN105392908A (enExample)
MX (1) MX388439B (enExample)
MY (1) MY178741A (enExample)
TW (1) TWI521072B (enExample)
WO (1) WO2015016218A1 (enExample)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19900673A1 (de) * 1999-01-11 2000-07-13 Basf Ag Verwendung von Bindungspartnern für 5-HT5-Rezeptoren zur Behandlung neurodegenerativer und neuropsychiatrischer Störungen
CN102822363B (zh) * 2010-05-14 2014-09-17 三菱综合材料株式会社 电子器件用铜合金及其制造方法及电子器件用铜合金轧材
JP5903838B2 (ja) 2011-11-07 2016-04-13 三菱マテリアル株式会社 電子機器用銅合金、電子機器用銅素材、電子機器用銅合金の製造方法、電子機器用銅合金塑性加工材及び電子機器用部品
JP5903842B2 (ja) 2011-11-14 2016-04-13 三菱マテリアル株式会社 銅合金、銅合金塑性加工材及び銅合金塑性加工材の製造方法
KR102474714B1 (ko) 2015-09-09 2022-12-05 미쓰비시 마테리알 가부시키가이샤 전자·전기 기기용 구리 합금, 전자·전기 기기용 구리 합금 소성 가공재, 전자·전기 기기용 부품, 단자, 및, 버스바
US20180171437A1 (en) * 2015-09-09 2018-06-21 Mitsubishi Materials Corporation Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar
JP6155407B1 (ja) * 2015-09-09 2017-06-28 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用部品、端子、及びバスバー
US10128019B2 (en) * 2015-09-09 2018-11-13 Mitsubishi Materials Corporation Copper alloy for electronic/electrical device, plastically-worked copper alloy material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar
MX374450B (es) 2015-09-09 2025-03-06 Mitsubishi Materials Corp Aleacion de cobre para dispositivo electronico/electrico, material de aleacion de cobre maquinado plasticamente para dispositivo electronico/electrico, componente para dispositivo electronico/electrico, terminal y barra colectora.
CN108352639B (zh) * 2015-11-27 2020-05-12 三菱综合材料株式会社 镀锡铜端子材及端子以及电线末端部结构
WO2017170699A1 (ja) 2016-03-30 2017-10-05 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、バスバー、及び、リレー用可動片
JP6226098B2 (ja) * 2016-03-30 2017-11-08 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、バスバー、及び、リレー用可動片
US11319615B2 (en) 2016-03-30 2022-05-03 Mitsubishi Materials Corporation Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relay
JP6226097B2 (ja) * 2016-03-30 2017-11-08 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、バスバー、及び、リレー用可動片
JP6299802B2 (ja) 2016-04-06 2018-03-28 三菱マテリアル株式会社 超伝導安定化材、超伝導線及び超伝導コイル
JP2018077942A (ja) * 2016-11-07 2018-05-17 住友電気工業株式会社 被覆電線、端子付き電線、銅合金線、及び銅合金撚線
JP6828444B2 (ja) 2017-01-10 2021-02-10 日立金属株式会社 導電線の製造方法、並びにケーブルの製造方法
KR102452709B1 (ko) * 2017-05-30 2022-10-11 현대자동차주식회사 자동차 가니쉬용 합금 및 자동차용 가니쉬
KR101875807B1 (ko) * 2018-03-14 2018-07-06 주식회사 풍산 고강도 및 굽힘가공성이 우수한 자동차 및 전기전자 부품용 동합금재의 제조 방법
JP6780187B2 (ja) 2018-03-30 2020-11-04 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー
TWI770375B (zh) 2018-03-30 2022-07-11 日商三菱綜合材料股份有限公司 電子/電氣機器用銅合金﹑電子/電氣機器用銅合金板條材料、電子/電氣機器用構件、端子及匯流排
JP7116870B2 (ja) * 2019-03-29 2022-08-12 三菱マテリアル株式会社 銅合金板、めっき皮膜付銅合金板及びこれらの製造方法
KR20220107184A (ko) * 2019-11-29 2022-08-02 미쓰비시 마테리알 가부시키가이샤 구리 합금, 구리 합금 소성 가공재, 전자·전기 기기용 부품, 단자, 버스 바, 방열 기판
JP2021127495A (ja) * 2020-02-13 2021-09-02 三菱マテリアル株式会社 銅合金棒線材、電子・電気機器用部品、端子およびコイルばね
JP7455634B2 (ja) * 2020-03-31 2024-03-26 Dowaメタルテック株式会社 銀めっき材およびその製造方法、並びに、端子部品
US12088029B2 (en) * 2021-07-20 2024-09-10 Dell Products L.P. Cable termination for information handling systems
US12237658B2 (en) * 2021-07-29 2025-02-25 Aptiv Technologies AG Bus bar assembly with plated electrical contact surface
CN120091879A (zh) * 2022-10-24 2025-06-03 三菱综合材料株式会社 金属am用铜合金粉末的制造方法
CN118321340B (zh) * 2024-06-07 2024-08-27 中北大学 一种异型金属丝的加工方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5344136B2 (enExample) * 1974-12-23 1978-11-27
JPS58128292A (ja) * 1982-01-26 1983-07-30 Furukawa Electric Co Ltd:The りん銅ろう薄帯
JPH0499235A (ja) * 1990-08-08 1992-03-31 Mitsubishi Materials Corp 極低酸素銅の製造法
JPH04350137A (ja) * 1991-07-19 1992-12-04 Mitsubishi Shindoh Co Ltd 電気電子機器のCu合金製コネクタ
JPH0718354A (ja) 1993-06-30 1995-01-20 Mitsubishi Electric Corp 電子機器用銅合金およびその製造方法
JP3904118B2 (ja) * 1997-02-05 2007-04-11 株式会社神戸製鋼所 電気、電子部品用銅合金とその製造方法
JPH11199954A (ja) * 1998-01-20 1999-07-27 Kobe Steel Ltd 電気・電子部品用銅合金
JP3797786B2 (ja) * 1998-03-06 2006-07-19 株式会社神戸製鋼所 電気・電子部品用銅合金
JP2002038227A (ja) * 2000-05-16 2002-02-06 Nippon Mining & Metals Co Ltd 深絞り性に優れたりん青銅条及びその製造方法
JP4610765B2 (ja) * 2001-03-21 2011-01-12 株式会社神戸製鋼所 熱間圧延可能なりん青銅
US7789977B2 (en) * 2006-10-26 2010-09-07 Hitachi Cable, Ltd. Rolled copper foil and manufacturing method thereof
JP4466688B2 (ja) 2007-07-11 2010-05-26 日立電線株式会社 圧延銅箔
KR101515340B1 (ko) 2009-08-28 2015-04-24 후루카와 덴키 고교 가부시키가이샤 스퍼터링 타겟용 구리재료의 제조방법
JP4516154B1 (ja) * 2009-12-23 2010-08-04 三菱伸銅株式会社 Cu−Mg−P系銅合金条材及びその製造方法
JP5088384B2 (ja) * 2010-01-26 2012-12-05 三菱マテリアル株式会社 高強度高導電性銅合金
JP5045783B2 (ja) 2010-05-14 2012-10-10 三菱マテリアル株式会社 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材
JP5045784B2 (ja) * 2010-05-14 2012-10-10 三菱マテリアル株式会社 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材
CN102822363B (zh) * 2010-05-14 2014-09-17 三菱综合材料株式会社 电子器件用铜合金及其制造方法及电子器件用铜合金轧材
JP5088425B2 (ja) * 2011-01-13 2012-12-05 三菱マテリアル株式会社 電子・電気機器用銅合金、銅合金薄板および導電部材
JP5903839B2 (ja) * 2011-11-07 2016-04-13 三菱マテリアル株式会社 電子機器用銅合金、電子機器用銅合金の製造方法、電子機器用銅合金塑性加工材および電子機器用部品
JP5703975B2 (ja) * 2011-06-06 2015-04-22 三菱マテリアル株式会社 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材
US20140096877A1 (en) 2011-06-06 2014-04-10 Mitsubishi Materials Corporation Copper alloy for electronic devices, method for producing copper alloy for electronic devices, copper alloy plastic working material for electronic devices, and component for electronic devices
JP5903832B2 (ja) * 2011-10-28 2016-04-13 三菱マテリアル株式会社 電子機器用銅合金、電子機器用銅合金の製造方法、電子機器用銅合金圧延材及び電子機器用部品
JP5903838B2 (ja) * 2011-11-07 2016-04-13 三菱マテリアル株式会社 電子機器用銅合金、電子機器用銅素材、電子機器用銅合金の製造方法、電子機器用銅合金塑性加工材及び電子機器用部品
JP5910004B2 (ja) * 2011-11-07 2016-04-27 三菱マテリアル株式会社 電子機器用銅合金、電子機器用銅合金の製造方法、電子機器用銅合金塑性加工材および電子機器用部品
JP5903842B2 (ja) * 2011-11-14 2016-04-13 三菱マテリアル株式会社 銅合金、銅合金塑性加工材及び銅合金塑性加工材の製造方法
JP2013104096A (ja) * 2011-11-14 2013-05-30 Mitsubishi Materials Corp 電子機器用銅合金、電子機器用銅合金の製造方法、電子機器用銅合金塑性加工材および電子機器用部品

Also Published As

Publication number Publication date
EP3029168A1 (en) 2016-06-08
MX2016001257A (es) 2016-05-24
MX388439B (es) 2025-03-19
EP3029168A4 (en) 2017-03-15
US20160160321A1 (en) 2016-06-09
TW201522669A (zh) 2015-06-16
WO2015016218A1 (ja) 2015-02-05
US10294547B2 (en) 2019-05-21
JP5962707B2 (ja) 2016-08-03
TWI521072B (zh) 2016-02-11
JP2015045083A (ja) 2015-03-12
KR20160036038A (ko) 2016-04-01
CN105392908A (zh) 2016-03-09

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