MX2018001527A - Cuerpo moldeado y dispositivo electrico que tiene un cuerpo moldeado para aplicaciones de alto voltaje. - Google Patents

Cuerpo moldeado y dispositivo electrico que tiene un cuerpo moldeado para aplicaciones de alto voltaje.

Info

Publication number
MX2018001527A
MX2018001527A MX2018001527A MX2018001527A MX2018001527A MX 2018001527 A MX2018001527 A MX 2018001527A MX 2018001527 A MX2018001527 A MX 2018001527A MX 2018001527 A MX2018001527 A MX 2018001527A MX 2018001527 A MX2018001527 A MX 2018001527A
Authority
MX
Mexico
Prior art keywords
molded body
electrical device
high voltage
voltage applications
electrical component
Prior art date
Application number
MX2018001527A
Other languages
English (en)
Inventor
Glenn Darin
BLACKBURN Scott
Original Assignee
Vishay Dale Electronics Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vishay Dale Electronics Llc filed Critical Vishay Dale Electronics Llc
Publication of MX2018001527A publication Critical patent/MX2018001527A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49589—Capacitor integral with or on the leadframe
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Details Of Resistors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Casings For Electric Apparatus (AREA)
  • Connector Housings Or Holding Contact Members (AREA)

Abstract

Se proporciona un dispositivo eléctrico que comprende un cuerpo moldeado estriado que aloja un componente eléctrico. El cuerpo moldeado estriado incluye al menos una superficie o porción que tiene una pluralidad de estrías a lo largo de al menos una porción de la superficie. El componente eléctrico puede ser un componente eléctrico pasivo o activo. El componente eléctrico puede conectarse a un bastidor de conductores y moldearse en el cuerpo moldeado estriado.
MX2018001527A 2015-08-07 2016-08-04 Cuerpo moldeado y dispositivo electrico que tiene un cuerpo moldeado para aplicaciones de alto voltaje. MX2018001527A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562202580P 2015-08-07 2015-08-07
PCT/US2016/045534 WO2017027315A1 (en) 2015-08-07 2016-08-04 Molded body and electrical device having a molded body for high voltage applications

Publications (1)

Publication Number Publication Date
MX2018001527A true MX2018001527A (es) 2018-05-17

Family

ID=57983699

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2018001527A MX2018001527A (es) 2015-08-07 2016-08-04 Cuerpo moldeado y dispositivo electrico que tiene un cuerpo moldeado para aplicaciones de alto voltaje.

Country Status (11)

Country Link
US (2) US9865532B2 (es)
EP (1) EP3332421B1 (es)
JP (1) JP7042738B2 (es)
KR (1) KR102536008B1 (es)
CN (2) CN108140629A (es)
CA (1) CA2995090A1 (es)
HK (1) HK1256144A1 (es)
IL (1) IL257339B (es)
MX (1) MX2018001527A (es)
TW (1) TWI708269B (es)
WO (1) WO2017027315A1 (es)

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US10483178B2 (en) * 2017-01-03 2019-11-19 Infineon Technologies Ag Semiconductor device including an encapsulation material defining notches
CN110165442B (zh) * 2018-02-12 2020-11-03 泰达电子股份有限公司 金属块焊接柱组合及其应用的电源模块
JP7169771B2 (ja) * 2018-05-25 2022-11-11 Koa株式会社 抵抗器
US11609248B2 (en) * 2018-07-11 2023-03-21 Lem International Sa Current transducer with integrated primary conductor
US11682606B2 (en) * 2019-02-07 2023-06-20 Ford Global Technologies, Llc Semiconductor with integrated electrically conductive cooling channels
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Also Published As

Publication number Publication date
US20180261533A1 (en) 2018-09-13
EP3332421A4 (en) 2019-04-10
IL257339A (en) 2018-03-29
JP2018522423A (ja) 2018-08-09
KR20180039121A (ko) 2018-04-17
US20170040239A1 (en) 2017-02-09
IL257339B (en) 2021-07-29
US10566272B2 (en) 2020-02-18
TWI708269B (zh) 2020-10-21
WO2017027315A1 (en) 2017-02-16
TW201717223A (zh) 2017-05-16
HK1256144A1 (zh) 2019-09-13
US9865532B2 (en) 2018-01-09
KR102536008B1 (ko) 2023-05-23
CA2995090A1 (en) 2017-02-16
CN108140629A (zh) 2018-06-08
JP7042738B2 (ja) 2022-03-28
EP3332421B1 (en) 2024-01-03
CN116314100A (zh) 2023-06-23
EP3332421A1 (en) 2018-06-13

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