JP4846434B2 - セメント抵抗器 - Google Patents
セメント抵抗器 Download PDFInfo
- Publication number
- JP4846434B2 JP4846434B2 JP2006130795A JP2006130795A JP4846434B2 JP 4846434 B2 JP4846434 B2 JP 4846434B2 JP 2006130795 A JP2006130795 A JP 2006130795A JP 2006130795 A JP2006130795 A JP 2006130795A JP 4846434 B2 JP4846434 B2 JP 4846434B2
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- case
- cement
- radiator
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C3/00—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids
- H01C3/06—Flexible or folding resistors, whereby such a resistor can be looped or collapsed upon itself
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/08—Cooling, heating or ventilating arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/40—Heating elements having the shape of rods or tubes
- H05B3/42—Heating elements having the shape of rods or tubes non-flexible
- H05B3/48—Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material
- H05B3/50—Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material heating conductor arranged in metal tubes, the radiating surface having heat-conducting fins
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49083—Heater type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49099—Coating resistive material on a base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Details Of Resistors (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
11,21 中央部分
12,14,22,24 垂直部分
13,23 平面部分
20 放熱体
30 セラミックケース
31 開放面
32 底面
33,35 ケース上面
34,36 外壁面
37,38 凹部
40 セメント材
42 絶縁材
51 ランドパターン
Claims (5)
- 金属板を折り曲げて形成した抵抗体を、電極部分が露出するように一面を開放面とした箱体状のケース内に配置し、セメント材を前記ケース内に充填した面実装形のセメント抵抗器において、
金属板を折り曲げて形成した放熱体を、ケースの開放面に沿って延びる放熱電極部分が前記抵抗体のケースの開放面に沿って延びる電極部分と同一面で露出するように前記ケース内に配置し、且つ、前記抵抗体と前記放熱体とは互いに接触せず、交差状に配置したことを特徴とするセメント抵抗器。 - 前記抵抗体と前記放熱体とが交差する部分において、前記抵抗体を前記ケースの開放面側に、前記放熱体を前記ケースの底面側に配置したことを特徴とする請求項1記載のセメント抵抗器。
- 前記ケースの内部に、前記放熱体を収容するための凹部を設けたことを特徴とする請求項1記載のセメント抵抗器。
- 前記ケース内に、前記抵抗体と前記放熱体とが接触しないようにするための絶縁部材を配置したことを特徴とする請求項1記載のセメント抵抗器。
- 前記抵抗体の中央部分に細幅部を設けたことを特徴とする請求項1記載のセメント抵抗器。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006130795A JP4846434B2 (ja) | 2006-05-09 | 2006-05-09 | セメント抵抗器 |
US11/797,542 US7420454B2 (en) | 2006-05-09 | 2007-05-04 | Cement resistor |
CN2007101011681A CN101071664B (zh) | 2006-05-09 | 2007-05-09 | 粘结电阻器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006130795A JP4846434B2 (ja) | 2006-05-09 | 2006-05-09 | セメント抵抗器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007305695A JP2007305695A (ja) | 2007-11-22 |
JP4846434B2 true JP4846434B2 (ja) | 2011-12-28 |
Family
ID=38684579
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006130795A Active JP4846434B2 (ja) | 2006-05-09 | 2006-05-09 | セメント抵抗器 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7420454B2 (ja) |
JP (1) | JP4846434B2 (ja) |
CN (1) | CN101071664B (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4982894B2 (ja) * | 2007-08-03 | 2012-07-25 | コーア株式会社 | セメント抵抗器 |
JP6152377B2 (ja) * | 2011-05-03 | 2017-06-21 | ヴィシェイ デール エレクトロニクス エルエルシー | 電気部品用ヒートスプレッダ |
JP6439149B2 (ja) * | 2014-02-27 | 2018-12-19 | パナソニックIpマネジメント株式会社 | チップ抵抗器 |
CN116314100A (zh) | 2015-08-07 | 2023-06-23 | 韦沙戴尔电子有限公司 | 模制体和用于高电压应用的具有模制体的电气装置 |
US10083781B2 (en) | 2015-10-30 | 2018-09-25 | Vishay Dale Electronics, Llc | Surface mount resistors and methods of manufacturing same |
DE102017207424A1 (de) * | 2017-05-03 | 2018-11-08 | Robert Bosch Gmbh | Verfahren zur Herstellung einer elektrischen Vorrichtung mit einer Umhüllmasse |
JP6855991B2 (ja) * | 2017-09-20 | 2021-04-07 | 株式会社デンソー | 抵抗器 |
US10438729B2 (en) | 2017-11-10 | 2019-10-08 | Vishay Dale Electronics, Llc | Resistor with upper surface heat dissipation |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3772452A (en) * | 1972-04-17 | 1973-11-13 | Globe Union Inc | An encapsulated electrical device |
NL7701813A (nl) * | 1977-02-21 | 1978-08-23 | Philips Nv | Verwarmingselement met een ptc-weerstands- lichaam. |
US4333069A (en) * | 1980-11-14 | 1982-06-01 | Trw, Inc. | Electrical resistor for a printed circuit board and method of making the same |
US4678890A (en) * | 1986-05-09 | 1987-07-07 | North American Philips Corporation | Hermetically sealed metal film resistor |
US4672358A (en) * | 1986-05-19 | 1987-06-09 | North American Philips Corp. | Surface-mounted power resistors |
US5300919A (en) * | 1992-05-05 | 1994-04-05 | Caddock Electronics, Inc. | Vibration and shock-resistant film-type power resistor |
JPH09148050A (ja) * | 1995-11-29 | 1997-06-06 | Matsushita Electric Ind Co Ltd | Ptcヒータ |
JP3870537B2 (ja) * | 1998-03-05 | 2007-01-17 | 松下電器産業株式会社 | 抵抗器 |
JP3560518B2 (ja) * | 1999-10-15 | 2004-09-02 | タクマン電子株式会社 | 抵抗器 |
JP3731108B2 (ja) * | 2000-02-29 | 2006-01-05 | 三菱電機株式会社 | 抵抗器の放熱構造 |
JP2002290090A (ja) * | 2001-03-28 | 2002-10-04 | Mitsumi Electric Co Ltd | 基板実装型部品の放熱保持装置 |
-
2006
- 2006-05-09 JP JP2006130795A patent/JP4846434B2/ja active Active
-
2007
- 2007-05-04 US US11/797,542 patent/US7420454B2/en not_active Expired - Fee Related
- 2007-05-09 CN CN2007101011681A patent/CN101071664B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN101071664A (zh) | 2007-11-14 |
CN101071664B (zh) | 2011-12-28 |
US7420454B2 (en) | 2008-09-02 |
JP2007305695A (ja) | 2007-11-22 |
US20070262845A1 (en) | 2007-11-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4846434B2 (ja) | セメント抵抗器 | |
CN106793675B (zh) | 屏蔽组件 | |
JP5737664B2 (ja) | チップ型ヒューズ | |
EP2361005A1 (en) | Circuit module | |
JP7411621B2 (ja) | 配線回路基板 | |
JP4887273B2 (ja) | 電子制御装置 | |
CN214477410U (zh) | 一种散热模组和终端 | |
JP4203499B2 (ja) | チップ抵抗器及びチップ抵抗器の製造方法 | |
JP2007019125A (ja) | 電力変換装置 | |
JP6420590B2 (ja) | セメント抵抗器 | |
KR101075664B1 (ko) | 칩 저항기 및 이의 제조 방법 | |
JP2013171963A (ja) | プリント基板装置および電子機器 | |
JP4482824B2 (ja) | 両面冷却型半導体装置 | |
JP2005197394A (ja) | 金属抵抗器 | |
JP2007067067A (ja) | 樹脂注型形電力用回路ユニット | |
JP6908278B2 (ja) | 半導体装置および電子機器 | |
JP5124329B2 (ja) | 半導体装置 | |
JP2016036002A (ja) | 金属板抵抗器 | |
JP2006041199A (ja) | 電子装置 | |
JP6727732B2 (ja) | 電力変換装置 | |
JPS61265849A (ja) | 電力半導体装置 | |
US9642256B2 (en) | Electronic assembly with frame for thermal dissipation | |
CN213150486U (zh) | 一种加强散热能力的贴片合金电阻 | |
JP2014135329A (ja) | ケース外装型コンデンサの製造方法及びケース外装型コンデンサ | |
TWM563137U (zh) | 具防emi遮蔽結構的散熱裝置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20090327 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20101005 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101126 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110712 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110902 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110920 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20111012 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20141021 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4846434 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |