JP5737664B2 - チップ型ヒューズ - Google Patents
チップ型ヒューズ Download PDFInfo
- Publication number
- JP5737664B2 JP5737664B2 JP2014500692A JP2014500692A JP5737664B2 JP 5737664 B2 JP5737664 B2 JP 5737664B2 JP 2014500692 A JP2014500692 A JP 2014500692A JP 2014500692 A JP2014500692 A JP 2014500692A JP 5737664 B2 JP5737664 B2 JP 5737664B2
- Authority
- JP
- Japan
- Prior art keywords
- fuse
- chip
- opening
- type fuse
- portions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000463 material Substances 0.000 claims description 25
- 230000000630 rising effect Effects 0.000 claims description 13
- 230000002093 peripheral effect Effects 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 35
- 239000011324 bead Substances 0.000 description 28
- 239000011521 glass Substances 0.000 description 19
- 229920002050 silicone resin Polymers 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000007747 plating Methods 0.000 description 8
- 239000010949 copper Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 238000003825 pressing Methods 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004568 cement Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/143—Electrical contacts; Fastening fusible members to such contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/18—Casing fillings, e.g. powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
- H01H69/02—Manufacture of fuses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/0013—Means for preventing damage, e.g. by ambient influences to the fuse
- H01H85/0021—Means for preventing damage, e.g. by ambient influences to the fuse water or dustproof devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/165—Casings
- H01H85/175—Casings characterised by the casing shape or form
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/38—Means for extinguishing or suppressing arc
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/0241—Structural association of a fuse and another component or apparatus
- H01H2085/0275—Structural association with a printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2223/00—Casings
- H01H2223/002—Casings sealed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/143—Electrical contacts; Fastening fusible members to such contacts
- H01H85/147—Parallel-side contacts
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Fuses (AREA)
- Connection Of Batteries Or Terminals (AREA)
Description
Claims (10)
- 基板への取り付け用端子の2つの平板状部を間隔をあけて同一水平面上に有し、当該水平面とは異なる高さにある水平面における前記2つの平板状部間に位置するヒューズが、前記2つの平板状部と一体に形成されている端子一体型ヒューズと、
一方の面が閉じられ、前記一方の面と異なる水平面に位置する他方の面が開口され、前記開口の周縁から前記一方の面に向かう周壁部を有し、前記ヒューズが前記開口から前記一方の面側に向かう中途の位置に位置し、前記2つの平板状部が前記周壁部にそれぞれ接触しているケースと、
前記ケース内において前記ヒューズに設けられた消弧材部とを、
具備するチップ型ヒューズ。 - 請求項1記載のチップ型ヒューズにおいて、前記ヒューズは、前記2つの平板状部における前記開口側にある縁部と一体に結合され、前記2つの平板状部における周壁部の外面側にある縁部から前記一方の面側に前記周壁部に接触して立ち上がり部が立ち上がっているチップ型ヒューズ。
- 請求項2記載のチップ型ヒューズにおいて、前記2つの平板状部における前記開口側にある縁部は前記開口の縁に接してあり、前記開口側にある縁部から前記ケースの中央側に向かって傾斜した傾斜部の先端側に前記ヒューズが一体に形成されているチップ型ヒューズ。
- 請求項1記載のチップ型ヒューズにおいて、前記消弧材部は、前記ケース内において前記ヒューズをその内部に含んでいるチップ型ヒューズ。
- 請求項4記載のチップ型ヒューズにおいて、前記消弧材部は、前記ケース内全域に満たされているチップ型ヒューズ。
- 請求項4記載のチップ型ヒューズにおいて、前記開口が蓋によって閉じられているチップ型ヒューズ。
- 請求項1記載のチップ型ヒューズにおいて、前記消弧材部は、前記ヒューズの両端付近のみに設けられているチップ型ヒューズ。
- 請求項7記載のチップ型ヒューズにおいて、前記開口が封止されているチップ型ヒューズ。
- 請求項8記載のチップ型ヒューズにおいて、前記開口の封止は、前記開口に板状体を設けることによって行っているチップ型ヒューズ。
- 請求項8記載のチップ型ヒューズにおいて、前記開口の封止は、前記ケース内に板状体を配置し、この板状体と前記開口との間に樹脂層を形成することによって行っているチップ型ヒューズ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014500692A JP5737664B2 (ja) | 2012-02-20 | 2013-02-15 | チップ型ヒューズ |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012033875 | 2012-02-20 | ||
JP2012033875 | 2012-02-20 | ||
PCT/JP2013/053670 WO2013125461A1 (ja) | 2012-02-20 | 2013-02-15 | チップ型ヒューズ |
JP2014500692A JP5737664B2 (ja) | 2012-02-20 | 2013-02-15 | チップ型ヒューズ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP5737664B2 true JP5737664B2 (ja) | 2015-06-17 |
JPWO2013125461A1 JPWO2013125461A1 (ja) | 2015-07-30 |
Family
ID=49005648
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014500692A Active JP5737664B2 (ja) | 2012-02-20 | 2013-02-15 | チップ型ヒューズ |
Country Status (4)
Country | Link |
---|---|
US (1) | US9378917B2 (ja) |
JP (1) | JP5737664B2 (ja) |
CN (1) | CN104137217B (ja) |
WO (1) | WO2013125461A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022140210A (ja) * | 2021-03-11 | 2022-09-26 | 功得電子工業股▲分▼有限公司 | 表面実装ヒューズ |
JP2022158782A (ja) * | 2021-03-31 | 2022-10-17 | 功得電子工業股▲分▼有限公司 | キャビティ付き気密型表面実装ヒューズ |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150200067A1 (en) * | 2014-01-10 | 2015-07-16 | Littelfuse, Inc. | Ceramic chip fuse with offset fuse element |
CN104103463A (zh) * | 2014-07-16 | 2014-10-15 | 东莞市博钺电子有限公司 | 一体式熔断器 |
JP6483987B2 (ja) * | 2014-09-26 | 2019-03-13 | デクセリアルズ株式会社 | ヒューズエレメント、ヒューズ素子、及び発熱体内蔵ヒューズ素子 |
US10947785B2 (en) * | 2015-08-19 | 2021-03-16 | Halliburton Energy Services, Inc. | High-power fuse-protected capacitor for downhole electrocrushing drilling |
KR102133236B1 (ko) * | 2016-03-25 | 2020-07-13 | 수조우 리텔퓨즈 오브이에스 컴퍼니 리미티드 | 솔더리스 표면 실장 퓨즈 |
CN107452558B (zh) * | 2017-08-30 | 2020-03-31 | Aem科技(苏州)股份有限公司 | 一种表面贴装熔断器及其制造方法 |
CN111133548B (zh) * | 2017-09-29 | 2022-06-28 | 株式会社村田制作所 | 片式熔断器 |
CN108321063B (zh) * | 2018-01-26 | 2024-07-12 | Aem科技(苏州)股份有限公司 | 一种表面贴装熔断器及其生产方法 |
CN108923007B (zh) * | 2018-08-21 | 2024-04-26 | 广东亿鑫丰智能装备股份有限公司 | 一种高效动力电池模组 |
CN109192635B (zh) * | 2018-10-19 | 2024-02-13 | Aem科技(苏州)股份有限公司 | 一种熔断器及其生产方法 |
JP6981953B2 (ja) * | 2018-11-26 | 2021-12-17 | 太平洋精工株式会社 | 基板表面実装ヒューズ |
JP7421321B2 (ja) * | 2019-12-03 | 2024-01-24 | Koa株式会社 | チップ形電流ヒューズおよびチップ形電流ヒューズの実装構造 |
TWI709991B (zh) * | 2020-01-03 | 2020-11-11 | 功得電子工業股份有限公司 | 表面貼裝式微型保險絲 |
JP7500735B2 (ja) | 2020-01-30 | 2024-06-17 | シュルター アクチェンゲゼルシャフト | 限流ヒューズ |
JP7324239B2 (ja) * | 2021-02-18 | 2023-08-09 | 松尾電機株式会社 | チップ型ヒューズ |
US11804351B1 (en) * | 2022-09-14 | 2023-10-31 | Littelfuse, Inc. | High breaking capacity fuse with fire-extinguishing pads |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS4710822Y1 (ja) * | 1969-06-13 | 1972-04-21 | ||
JPH11273541A (ja) * | 1998-03-25 | 1999-10-08 | Skk:Kk | ヒューズ |
JP2004152518A (ja) * | 2002-10-29 | 2004-05-27 | Matsushita Electric Ind Co Ltd | 回路保護素子およびその製造方法 |
Family Cites Families (16)
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JPS6011538Y2 (ja) * | 1982-12-01 | 1985-04-17 | 三王株式会社 | チツプ型ヒユ−ズ |
JPS6022538Y2 (ja) * | 1982-12-03 | 1985-07-04 | 三王株式会社 | チツプ型ヒユ−ズ |
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JPH06342623A (ja) * | 1993-06-01 | 1994-12-13 | S O C Kk | チップヒューズ |
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JP2004134091A (ja) * | 2002-10-08 | 2004-04-30 | Matsushita Electric Ind Co Ltd | チップ型ヒューズおよびその製造方法 |
WO2007119358A1 (ja) * | 2006-03-16 | 2007-10-25 | Matsushita Electric Industrial Co., Ltd. | 面実装型電流ヒューズ |
TWI323906B (en) * | 2007-02-14 | 2010-04-21 | Besdon Technology Corp | Chip-type fuse and method of manufacturing the same |
CN201829441U (zh) * | 2010-10-08 | 2011-05-11 | Aem科技(苏州)股份有限公司 | 一种表面贴装熔断器 |
-
2013
- 2013-02-15 US US14/372,948 patent/US9378917B2/en active Active
- 2013-02-15 WO PCT/JP2013/053670 patent/WO2013125461A1/ja active Application Filing
- 2013-02-15 CN CN201380010087.4A patent/CN104137217B/zh active Active
- 2013-02-15 JP JP2014500692A patent/JP5737664B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS4710822Y1 (ja) * | 1969-06-13 | 1972-04-21 | ||
JPH11273541A (ja) * | 1998-03-25 | 1999-10-08 | Skk:Kk | ヒューズ |
JP2004152518A (ja) * | 2002-10-29 | 2004-05-27 | Matsushita Electric Ind Co Ltd | 回路保護素子およびその製造方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022140210A (ja) * | 2021-03-11 | 2022-09-26 | 功得電子工業股▲分▼有限公司 | 表面実装ヒューズ |
JP7368418B2 (ja) | 2021-03-11 | 2023-10-24 | 功得電子工業股▲分▼有限公司 | 表面実装ヒューズ |
JP2022158782A (ja) * | 2021-03-31 | 2022-10-17 | 功得電子工業股▲分▼有限公司 | キャビティ付き気密型表面実装ヒューズ |
JP7217312B2 (ja) | 2021-03-31 | 2023-02-02 | 功得電子工業股▲分▼有限公司 | キャビティ付き気密型表面実装ヒューズ |
Also Published As
Publication number | Publication date |
---|---|
WO2013125461A1 (ja) | 2013-08-29 |
US20150002258A1 (en) | 2015-01-01 |
CN104137217B (zh) | 2016-10-19 |
US9378917B2 (en) | 2016-06-28 |
CN104137217A (zh) | 2014-11-05 |
JPWO2013125461A1 (ja) | 2015-07-30 |
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