JP2009124091A - 半導体パッケージモジュール - Google Patents
半導体パッケージモジュール Download PDFInfo
- Publication number
- JP2009124091A JP2009124091A JP2007330675A JP2007330675A JP2009124091A JP 2009124091 A JP2009124091 A JP 2009124091A JP 2007330675 A JP2007330675 A JP 2007330675A JP 2007330675 A JP2007330675 A JP 2007330675A JP 2009124091 A JP2009124091 A JP 2009124091A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- substrate body
- package module
- module according
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1047—Details of electrical connections between containers
- H01L2225/107—Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1076—Shape of the containers
- H01L2225/1088—Arrangements to limit the height of the assembly
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1094—Thermal management, e.g. cooling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10545—Related components mounted on both sides of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
【解決手段】半導体パッケージモジュール500は、収納部を有する基板本体110及び前記基板本体110に形成された導電パターン120を含む回路基板100と、半導体チップを有する半導体パッケージ200と、前記導電パターン120及び前記導電端子を電気的に連結する連結部材300とを含む。回路基板100の基板本体110に収納空間を有する収納部を形成し、収納部に半導体パッケージを収納した後、連結部材を利用して半導体パッケージ200の接続端子及び基板本体110の導電パターン120を電気的に連結することにより、厚さを増加させることなく、1つの回路基板に複数の半導体パッケージ200を積層する。
【選択図】図1
Description
半導体パッケージモジュールの前記絶縁部材は、前記下面に対向する上面上に配置されて、前記導電パターンと電気的に連結される第2の連結パターンをさらに含む。
半導体パッケージモジュールは、前記基板本体に結合されて、前記収納部を覆う外部放熱カバーを含む。
半導体パッケージモジュールの前記連結部材は、リードフレームを含む。
図1及び図3を参照すると、回路基板100は、基板本体110及び導電パターン120を含む。本実施形態において、回路基板100は、例えば、プリント回路基板である。
図2及び図4を参照すると、連結部材300は、各収納部112(112a,112b)を覆う。収納部112を覆う連結部材300は、絶縁部材305及び第1の連結パターン310を含む。
図2及び図5を参照すると、連結部材300の上面302上には、導電性ビア315及び第2の連結パターン320が配置される。
110,192,194,196 基板本体
112,112a,112b,114,193,195 収納部
120 導電パターン
130 入・出力端子
160 固定部材
200,210,220,230,240 半導体パッケージ
212,222,232,242,244 半導体チップ
214,224,234,244 接続端子
300 連結部材
305 絶縁部材
306 接続端子
307,322 導電パターン
309,325 ボールランドパターン
310,320 連結パターン
315 導電性ビア
400,450 放熱部材
455 放熱フィン
480 モールディング部
500 半導体パッケージモジュール
Claims (20)
- 収納部を有する基板本体及び前記基板本体に形成された導電パターンを含む回路基板、
前記収納部に収納され、前記導電パターンと電気的に連結される導電端子及び前記導電端子と電気的に連結された半導体チップを有する半導体パッケージ、並びに、
前記導電パターンと前記導電端子とを電気的に連結する連結部材
を含むことを特徴とする、半導体パッケージモジュール。 - 前記収納部は、前記基板本体の表面に凹状に形成されたレセス(recess)であることを特徴とする、請求項1に記載の半導体パッケージモジュール。
- 前記導電端子及び前記基板本体の表面は、同一平面上に配置されることを特徴とする、請求項2に記載の半導体パッケージモジュール。
- 前記半導体パッケージは、前記半導体チップをモールディングするモールディング部材を含み、前記モールディング部材は、接着剤により前記収納部の底面に付着されることを特徴とする、請求項2に記載の半導体パッケージモジュール。
- 前記収納部は、前記基板本体の第1の面上及び前記第1の面に対向する第2の面上に、それぞれ配置されることを特徴とする、請求項2に記載の半導体パッケージモジュール。
- 前記連結部材は、絶縁部材、及び、前記収納部の底面と向かい合う絶縁部材の下面に形成されて、前記導電パターンと電気的に連結された第1の連結パターンを含むことを特徴とする、請求項1に記載の半導体パッケージモジュール。
- 前記絶縁部材は、フレキシブル基板を含むことを特徴とする、請求項6に記載の半導体パッケージモジュール。
- 前記絶縁部材は、前記下面に対向する上面上に配置されて、前記導電パターンと電気的に連結される第2の連結パターンをさらに含むことを特徴とする、請求項6に記載の半導体パッケージモジュール。
- 前記第2の連結パターンと電気的に連結された追加半導体パッケージをさらに含むことを特徴とする、請求項8に記載の半導体パッケージモジュール。
- 前記絶縁部材は、前記第2の連結パターンと前記導電パターンとを電気的に連結するために、前記絶縁部材を貫通する導電性ビアを含むことを特徴とする、請求項8に記載の半導体パッケージモジュール。
- 前記導電パターン及び前記第1の連結パターン、並びに前記導電パターン及び前記第2の連結パターンは、ソルダー及び異方性導電フィルム(ACF)のいずれかにより電気的に連結されることを特徴とする、請求項8に記載の半導体パッケージモジュール。
- 前記収納部は、前記基板本体を貫通する貫通孔であることを特徴とする、請求項1に記載の半導体パッケージモジュール。
- 前記基板本体に結合されて、前記収納部を覆う外部放熱カバーを含むことを特徴とする、請求項1に記載の半導体パッケージモジュール。
- 前記基板本体は、前記基板本体の内部に配置されて、前記半導体パッケージから発生した熱を外部に放熱するための放熱プレートを含むことを特徴とする、請求項1に記載の半導体パッケージモジュール。
- 前記放熱プレートの一部は前記基板本体から突出し、前記基板本体から突出した前記放熱プレートは、複数の放熱フィン(fin)を有することを特徴とする、請求項14に記載の半導体パッケージモジュール。
- 前記半導体パッケージと前記放熱プレートとの間には、熱伝導性接着剤が介在することを特徴とする、請求項15に記載の半導体パッケージモジュール。
- 前記基板本体は、プレート形状を有する第1の基板本体、及び前記第1の基板本体の両側に配置され、前記収納部を形成するために前記第1の基板本体を露出させる貫通部を有する第2の基板本体を含み、
前記導電パターンは、前記各第2の基板本体の表面にそれぞれ配置されることを特徴とする、請求項1に記載の半導体パッケージモジュール。 - 前記第1の基板本体は、第1の長さを有し、前記第2の基板本体は、前記第1の長さより短い第2の長さを有することを特徴とする、請求項17に記載の半導体パッケージモジュール。
- 前記半導体パッケージ及び前記連結部材を密封する密封部材をさらに含むことを特徴とする、請求項1に記載の半導体パッケージモジュール。
- 前記連結部材は、リードフレームであることを特徴とする、請求項1に記載の半導体パッケージモジュール。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070114268A KR100924547B1 (ko) | 2007-11-09 | 2007-11-09 | 반도체 패키지 모듈 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2009124091A true JP2009124091A (ja) | 2009-06-04 |
Family
ID=40622934
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007330675A Pending JP2009124091A (ja) | 2007-11-09 | 2007-12-21 | 半導体パッケージモジュール |
Country Status (5)
Country | Link |
---|---|
US (1) | US8395245B2 (ja) |
JP (1) | JP2009124091A (ja) |
KR (1) | KR100924547B1 (ja) |
CN (1) | CN101431068B (ja) |
TW (1) | TWI464850B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011176222A (ja) * | 2010-02-25 | 2011-09-08 | Mitsubishi Electric Corp | 樹脂封止形電子制御装置、及びその製造方法 |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010056099A (ja) * | 2008-08-26 | 2010-03-11 | Hitachi Ltd | 半導体装置 |
US8519537B2 (en) * | 2010-02-26 | 2013-08-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | 3D semiconductor package interposer with die cavity |
US9385095B2 (en) | 2010-02-26 | 2016-07-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | 3D semiconductor package interposer with die cavity |
TWI467735B (zh) * | 2010-12-31 | 2015-01-01 | 矽品精密工業股份有限公司 | 多晶片堆疊封裝結構及其製法 |
US9653443B2 (en) | 2014-02-14 | 2017-05-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Thermal performance structure for semiconductor packages and method of forming same |
US10026671B2 (en) | 2014-02-14 | 2018-07-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Substrate design for semiconductor packages and method of forming same |
US9935090B2 (en) | 2014-02-14 | 2018-04-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Substrate design for semiconductor packages and method of forming same |
US9768090B2 (en) | 2014-02-14 | 2017-09-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Substrate design for semiconductor packages and method of forming same |
US10056267B2 (en) | 2014-02-14 | 2018-08-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Substrate design for semiconductor packages and method of forming same |
WO2015198870A1 (ja) * | 2014-06-23 | 2015-12-30 | 株式会社村田製作所 | 部品内蔵基板および部品内蔵基板の製造方法 |
US9595505B2 (en) * | 2014-11-25 | 2017-03-14 | Nxp Usa, Inc. | Thermally-enhanced three dimensional system-in-packages and methods for the fabrication thereof |
US9564416B2 (en) | 2015-02-13 | 2017-02-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package structures and methods of forming the same |
US9576942B1 (en) * | 2015-12-18 | 2017-02-21 | Intel Corporation | Integrated circuit assembly that includes stacked dice |
US10999957B2 (en) | 2018-02-12 | 2021-05-04 | Samsung Electro-Mechanics Co., Ltd. | Communication module and mounting structure thereof |
WO2020051877A1 (en) * | 2018-09-14 | 2020-03-19 | Telefonaktiebolaget Lm Ericsson (Publ) | Pcb structure and method and apparatus for forming the pcb structure |
US11652020B2 (en) * | 2019-05-29 | 2023-05-16 | Intel Corporation | Thermal solutions for multi-package assemblies and methods for fabricating the same |
JP7074798B2 (ja) * | 2020-05-18 | 2022-05-24 | 矢崎総業株式会社 | 回路接続モジュール |
US20220264741A1 (en) * | 2021-02-18 | 2022-08-18 | Gm Cruise Holdings Llc | Heat dissipation features of autonomous vehicle sensor |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0537121A (ja) * | 1991-01-30 | 1993-02-12 | Mitsui High Tec Inc | 半導体装置実装用基板およびこれを用いた半導体装置の実装方法 |
JPH0679990A (ja) * | 1992-09-04 | 1994-03-22 | Mitsubishi Electric Corp | Icメモリカード |
JPH08124967A (ja) * | 1994-10-21 | 1996-05-17 | Nec Corp | 半導体装置 |
JPH11111914A (ja) * | 1997-10-01 | 1999-04-23 | Nec Corp | 3次元メモリモジュール |
JPH11150214A (ja) * | 1997-11-19 | 1999-06-02 | Nec Corp | 半導体集積回路装置及びその半導体ベアチップ実装方法 |
JPH11168157A (ja) * | 1997-10-01 | 1999-06-22 | Toshiba Corp | マルチチップ半導体装置 |
JP2002151648A (ja) * | 2000-11-07 | 2002-05-24 | Mitsubishi Electric Corp | 半導体モジュール |
JP2004023084A (ja) * | 2002-06-20 | 2004-01-22 | Dt Circuit Technology Co Ltd | 3次元モジュール、3次元モジュールの製造方法 |
JP2004519843A (ja) * | 2000-10-16 | 2004-07-02 | レガシー エレクトロニクス, インコーポレイテッド | キャリアベースの電子モジュール |
JP2004247724A (ja) * | 2003-02-11 | 2004-09-02 | Hewlett-Packard Development Co Lp | 電子基板から熱を放散させるシステムおよび方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5102829A (en) | 1991-07-22 | 1992-04-07 | At&T Bell Laboratories | Plastic pin grid array package |
US5291062A (en) * | 1993-03-01 | 1994-03-01 | Motorola, Inc. | Area array semiconductor device having a lid with functional contacts |
US5667884A (en) * | 1993-04-12 | 1997-09-16 | Bolger; Justin C. | Area bonding conductive adhesive preforms |
US5719745A (en) * | 1995-07-12 | 1998-02-17 | International Business Machines Corporation | Extended surface cooling for chip stack applications |
US5875097A (en) * | 1997-06-09 | 1999-02-23 | Power Trends, Inc. | Heat sink for auxiliary circuit board |
US6075710A (en) * | 1998-02-11 | 2000-06-13 | Express Packaging Systems, Inc. | Low-cost surface-mount compatible land-grid array (LGA) chip scale package (CSP) for packaging solder-bumped flip chips |
KR100304959B1 (ko) * | 1998-10-21 | 2001-09-24 | 김영환 | 칩 적층형 반도체 패키지 및 그 제조방법 |
KR100356799B1 (ko) * | 1999-12-29 | 2002-10-18 | 주식회사 하이닉스반도체 | 메모리 모듈 |
JP4329251B2 (ja) * | 2000-10-03 | 2009-09-09 | ソニー株式会社 | 積層型半導体装置の製造方法 |
KR100778912B1 (ko) * | 2001-03-28 | 2007-11-22 | 앰코 테크놀로지 코리아 주식회사 | 반도체 패키지 및 그의 제조방법 |
US20020158318A1 (en) * | 2001-04-25 | 2002-10-31 | Chen Hung Nan | Multi-chip module |
TW511450B (en) * | 2001-08-16 | 2002-11-21 | Orient Semiconductor Elect Ltd | Heat dissipation plate with inlay pin and its assembly components |
US7081373B2 (en) * | 2001-12-14 | 2006-07-25 | Staktek Group, L.P. | CSP chip stack with flex circuit |
TW200504895A (en) | 2003-06-04 | 2005-02-01 | Renesas Tech Corp | Semiconductor device |
TWI281755B (en) * | 2005-08-24 | 2007-05-21 | Advanced Semiconductor Eng | Lead frame type package |
JP2008060172A (ja) * | 2006-08-29 | 2008-03-13 | Toshiba Corp | 半導体装置 |
-
2007
- 2007-11-09 KR KR1020070114268A patent/KR100924547B1/ko not_active IP Right Cessation
- 2007-12-07 TW TW096146638A patent/TWI464850B/zh active
- 2007-12-11 US US11/953,967 patent/US8395245B2/en active Active
- 2007-12-21 JP JP2007330675A patent/JP2009124091A/ja active Pending
-
2008
- 2008-01-29 CN CN200810001494XA patent/CN101431068B/zh not_active Expired - Fee Related
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0537121A (ja) * | 1991-01-30 | 1993-02-12 | Mitsui High Tec Inc | 半導体装置実装用基板およびこれを用いた半導体装置の実装方法 |
JPH0679990A (ja) * | 1992-09-04 | 1994-03-22 | Mitsubishi Electric Corp | Icメモリカード |
JPH08124967A (ja) * | 1994-10-21 | 1996-05-17 | Nec Corp | 半導体装置 |
JPH11111914A (ja) * | 1997-10-01 | 1999-04-23 | Nec Corp | 3次元メモリモジュール |
JPH11168157A (ja) * | 1997-10-01 | 1999-06-22 | Toshiba Corp | マルチチップ半導体装置 |
JPH11150214A (ja) * | 1997-11-19 | 1999-06-02 | Nec Corp | 半導体集積回路装置及びその半導体ベアチップ実装方法 |
JP2004519843A (ja) * | 2000-10-16 | 2004-07-02 | レガシー エレクトロニクス, インコーポレイテッド | キャリアベースの電子モジュール |
JP2002151648A (ja) * | 2000-11-07 | 2002-05-24 | Mitsubishi Electric Corp | 半導体モジュール |
JP2004023084A (ja) * | 2002-06-20 | 2004-01-22 | Dt Circuit Technology Co Ltd | 3次元モジュール、3次元モジュールの製造方法 |
JP2004247724A (ja) * | 2003-02-11 | 2004-09-02 | Hewlett-Packard Development Co Lp | 電子基板から熱を放散させるシステムおよび方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011176222A (ja) * | 2010-02-25 | 2011-09-08 | Mitsubishi Electric Corp | 樹脂封止形電子制御装置、及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20090121326A1 (en) | 2009-05-14 |
TWI464850B (zh) | 2014-12-11 |
KR100924547B1 (ko) | 2009-11-02 |
CN101431068A (zh) | 2009-05-13 |
CN101431068B (zh) | 2011-05-04 |
TW200921878A (en) | 2009-05-16 |
US8395245B2 (en) | 2013-03-12 |
KR20090048064A (ko) | 2009-05-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2009124091A (ja) | 半導体パッケージモジュール | |
KR102147354B1 (ko) | 반도체 패키지 및 그 제조 방법 | |
JP2008166440A (ja) | 半導体装置 | |
US20130208426A1 (en) | Semiconductor package having heat spreader and method of forming the same | |
JP6024297B2 (ja) | 電子機器、電子機器の製造方法 | |
JP5218657B2 (ja) | 光モジュール | |
KR20220140688A (ko) | 반도체 패키지 | |
JP5413971B2 (ja) | 電子部品実装装置及びその製造方法 | |
JPH0955459A (ja) | 半導体装置 | |
JP2007305761A (ja) | 半導体装置 | |
JP2019106432A (ja) | 電子制御装置 | |
CN217239446U (zh) | 散热器、电路板和电子设备 | |
EP1178594B1 (en) | Electronic apparatus provided with an electronic circuit substrate | |
JPH0680911B2 (ja) | 電子部品を搭載したプリント配線板の放熱構造 | |
KR101069288B1 (ko) | 반도체 패키지 | |
JP2007281201A (ja) | 半導体装置 | |
JP2008004688A (ja) | 半導体パッケージ | |
JP2010245373A (ja) | 半導体装置及びその製造方法 | |
JP2004259977A (ja) | 電子回路モジュール | |
JP2011171656A (ja) | 半導体パッケージおよびその製造方法 | |
JP6452482B2 (ja) | 電子モジュール | |
KR101046378B1 (ko) | 반도체 패키지 | |
US7859102B2 (en) | Multi-layer stacked wafer level semiconductor package module | |
CN214226906U (zh) | 芯片散热结构、封装芯片和电子设备 | |
CN216599754U (zh) | 感光组件、摄像头模组及电子设备 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20101014 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20120113 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120124 |
|
RD01 | Notification of change of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7421 Effective date: 20120227 |
|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20120418 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120423 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120918 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20121217 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130319 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20130813 |