MX173437B - Empaque metalico con cavidad hacia arriba, para arreglo de rejilla con perno y proceso para su fabricacion - Google Patents
Empaque metalico con cavidad hacia arriba, para arreglo de rejilla con perno y proceso para su fabricacionInfo
- Publication number
- MX173437B MX173437B MX023531A MX2353190A MX173437B MX 173437 B MX173437 B MX 173437B MX 023531 A MX023531 A MX 023531A MX 2353190 A MX2353190 A MX 2353190A MX 173437 B MX173437 B MX 173437B
- Authority
- MX
- Mexico
- Prior art keywords
- base component
- circuit
- grille
- bolt
- manufacture
- Prior art date
Links
Classifications
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- H01L23/00—Details of semiconductor or other solid state devices
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- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
La presente invención se refiere a un paquete de formación de rejilla con perno o pasador de metal, caracterizado por: un componente de cubierta; un componente de base de metal o aleación de metal que tiene una primera formación de agujeros; un circuito colocado entre el componente de cubierta y el componente de base; una pluralidad de pasadores terminales interconectados eléctricamente con el circuito y que se extienden a través de la primera formación de agujeros; un elemento de sellado dieléctrico para ligar el componente de cubierta tanto con el circuito como con el componente de base y el componente de base con el circuito; y el elemento de sellado dieléctrico que se extiende hacia la primera formación de agujeros aislando eléctricamente la pluralidad de pasadores terminales desde el componente de base.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/442,877 US5103292A (en) | 1989-11-29 | 1989-11-29 | Metal pin grid array package |
Publications (1)
Publication Number | Publication Date |
---|---|
MX173437B true MX173437B (es) | 1994-03-03 |
Family
ID=23758502
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX023531A MX173437B (es) | 1989-11-29 | 1990-11-29 | Empaque metalico con cavidad hacia arriba, para arreglo de rejilla con perno y proceso para su fabricacion |
Country Status (9)
Country | Link |
---|---|
US (1) | US5103292A (es) |
EP (2) | EP0721212A1 (es) |
JP (1) | JPH05501638A (es) |
AU (1) | AU6750190A (es) |
CA (1) | CA2067384A1 (es) |
DE (1) | DE69027781T2 (es) |
HK (1) | HK1008113A1 (es) |
MX (1) | MX173437B (es) |
WO (1) | WO1991008587A1 (es) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5102829A (en) * | 1991-07-22 | 1992-04-07 | At&T Bell Laboratories | Plastic pin grid array package |
US5200640A (en) * | 1991-08-12 | 1993-04-06 | Electron Power Inc. | Hermetic package having covers and a base providing for direct electrical connection |
JP2765673B2 (ja) * | 1992-06-04 | 1998-06-18 | インターナショナル・ビジネス・マシーンズ・コーポレイション | メタライゼーション層及びその形成方法 |
US5828126A (en) * | 1992-06-17 | 1998-10-27 | Vlsi Technology, Inc. | Chip on board package with top and bottom terminals |
US5608267A (en) * | 1992-09-17 | 1997-03-04 | Olin Corporation | Molded plastic semiconductor package including heat spreader |
US5540378A (en) * | 1993-09-27 | 1996-07-30 | Olin Corporation | Method for the assembly of an electronic package |
US5578869A (en) * | 1994-03-29 | 1996-11-26 | Olin Corporation | Components for housing an integrated circuit device |
US5455387A (en) * | 1994-07-18 | 1995-10-03 | Olin Corporation | Semiconductor package with chip redistribution interposer |
US5629835A (en) * | 1994-07-19 | 1997-05-13 | Olin Corporation | Metal ball grid array package with improved thermal conductivity |
US6184575B1 (en) * | 1994-08-26 | 2001-02-06 | National Semiconductor Corporation | Ultra-thin composite package for integrated circuits |
US5534356A (en) * | 1995-04-26 | 1996-07-09 | Olin Corporation | Anodized aluminum substrate having increased breakdown voltage |
EP0882384A4 (en) * | 1995-07-14 | 1999-03-24 | Olin Corp | WELDED GRID ELECTRONIC BOX |
US5723905A (en) * | 1995-08-04 | 1998-03-03 | International Business Machines Corporation | Semiconductor package with low strain seal |
US5710695A (en) * | 1995-11-07 | 1998-01-20 | Vlsi Technology, Inc. | Leadframe ball grid array package |
US5689089A (en) * | 1996-09-20 | 1997-11-18 | Motorola, Inc. | Electronic control module having fluid-tight seals of a polymer material which expands when wet |
US5900312A (en) | 1996-11-08 | 1999-05-04 | W. L. Gore & Associates, Inc. | Integrated circuit chip package assembly |
US6117705A (en) * | 1997-04-18 | 2000-09-12 | Amkor Technology, Inc. | Method of making integrated circuit package having adhesive bead supporting planar lid above planar substrate |
JP3269434B2 (ja) * | 1997-09-05 | 2002-03-25 | 株式会社村田製作所 | 電子部品 |
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-
1989
- 1989-11-29 US US07/442,877 patent/US5103292A/en not_active Expired - Fee Related
-
1990
- 1990-11-13 CA CA002067384A patent/CA2067384A1/en not_active Abandoned
- 1990-11-13 AU AU67501/90A patent/AU6750190A/en not_active Abandoned
- 1990-11-13 EP EP96100021A patent/EP0721212A1/en not_active Withdrawn
- 1990-11-13 WO PCT/US1990/006600 patent/WO1991008587A1/en active IP Right Grant
- 1990-11-13 EP EP90917154A patent/EP0502887B1/en not_active Expired - Lifetime
- 1990-11-13 DE DE69027781T patent/DE69027781T2/de not_active Expired - Fee Related
- 1990-11-13 JP JP3500561A patent/JPH05501638A/ja active Pending
- 1990-11-29 MX MX023531A patent/MX173437B/es unknown
-
1998
- 1998-06-27 HK HK98107154A patent/HK1008113A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
AU6750190A (en) | 1991-06-26 |
WO1991008587A1 (en) | 1991-06-13 |
US5103292A (en) | 1992-04-07 |
DE69027781T2 (de) | 1997-02-27 |
DE69027781D1 (de) | 1996-08-14 |
EP0502887B1 (en) | 1996-07-10 |
CA2067384A1 (en) | 1991-05-30 |
EP0721212A1 (en) | 1996-07-10 |
JPH05501638A (ja) | 1993-03-25 |
EP0502887A1 (en) | 1992-09-16 |
HK1008113A1 (en) | 1999-04-30 |
EP0502887A4 (en) | 1992-10-28 |
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