KR970702155A - 열인자판과 그에 사용되는 기판 및 그 기판의 제조방법 - Google Patents

열인자판과 그에 사용되는 기판 및 그 기판의 제조방법

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KR970702155A
KR970702155A KR1019960705857A KR19960705857A KR970702155A KR 970702155 A KR970702155 A KR 970702155A KR 1019960705857 A KR1019960705857 A KR 1019960705857A KR 19960705857 A KR19960705857 A KR 19960705857A KR 970702155 A KR970702155 A KR 970702155A
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South Korea
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substrate
heat
green sheet
heat generating
resistance means
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KR1019960705857A
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English (en)
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KR100219735B1 (ko
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히데오 다니구찌
시노부 오바따
히로시 기노시따
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사토 켄이치로
로무 가부시키가이샤
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Priority claimed from JP7095098A external-priority patent/JPH0867022A/ja
Priority claimed from JP7095099A external-priority patent/JPH0867023A/ja
Application filed by 사토 켄이치로, 로무 가부시키가이샤 filed Critical 사토 켄이치로
Publication of KR970702155A publication Critical patent/KR970702155A/ko
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Publication of KR100219735B1 publication Critical patent/KR100219735B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/33535—Substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/3355—Structure of thermal heads characterised by materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33555—Structure of thermal heads characterised by type
    • B41J2/3357—Surface type resistors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33585—Hollow parts under the heater
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49431—Connecting portions the connecting portions being staggered on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49433—Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor

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Abstract

1. 청구범위에 기재된 발명이 속한 기술분야
본 발명은 소요전력특성을 개선시킨 열인자판에 관한 것이다.
2. 발명이 해결하려고 하는 기술적과제
본 발명은 열인자판과 기판(2) 및 기판(2)의 유리한 제조방법을 제공하는데 있다.
3. 발명의 해결방법의 요지
균일한 절연재료만으로 된 일체의 기판(2)과 복수의 발열도트를 형성하기 위해 상기한 기판(2)상에 형성된 발열저항수단(3)과 그 발열저항수단(3)에 전기적으로 접속되도록 기판(2)상에 형성된 도체패턴(5),(6)과 상기한 도체패턴(5),(6)을 거쳐서 발열도트를 선택적으로 발열시키기 위한 구동수단과를 구비한 열인자판으로서, 상기한 기판(2)은 발열저항수단(3)의 위치에 일체의 융기부(2a)를 갖고 있고 다시 또 상기한 기판(2)은 융기부(2a)의 위치에 있어서 그 벽두께내부에 발열저항수단(3)에 따라 뻗는 중공부(10)를 구비하고 있는 것을 특징으로 하는 열인자판이다.
4. 발명의 중요한 용도
본 발명은 열인자판에 관한 것이며 특히 소요전력특성을 개선시킨 열인자판에 관한 것이다.

Description

열인자판과 그에 사용되는 기판 및 그 기판의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 아주 적당한 실시예에 관한 열인자판의 주요부를 나타내는 부분평면도,
제2도는 제1도의 II-II선에 따른 단면도,
제3a도는 상기한 열인자판의 동작시에 있어서의 온도분포를 나타내는 그래프,
제3b도는 상기한 열인자판을 약간 변형한 비교예에 있어서의 온도분포를 나타내는 그래프,
제4도는 제1도 및 제2도에 나타내는 열인자판에 사용되는 기판을 나타내는 사시도.

Claims (22)

  1. 균일한 절연재료만으로 된 일체의 기판(2)과 복수의 발열도트를 형성하기 위해 상기한 기판(2)상에 형성된 발열저항수단(3)과 그 발열저항수단(3)에 전기적으로 접속되도록 기판(2)상에 형성된 도체패턴(5),(6)과 상기한 도체패턴(5),(6)을 거쳐서 발열도트를 선택적으로 발열시키기 위한 구동수단과를 구비한 열인자판으로서, 상기한 기판(2)은 발열저항수단(3)의 위치에 일체의 융기부(2a)를 갖고 있고 다시 또 상기한 기판(2)은 융기부(2a)의 위치에 있어서 그 벽두께내부에 발열저항수단(3)에 따라 뻗는 중공부(10)를 구비하고 있는 것을 특징으로 하는 열인자판.
  2. 제1항에 있어서, 융기부(2a)가 사다리꼴단면을 갖고 있는 것을 특징으로 하는 열인자판.
  3. 제1항에 있어서, 융기부(2a)가 원호상단면을 갖고 있는 것을 특징으로 하는 열인자판.
  4. 제1항에 있어서, 중공부(10)는 단면형상이 다른 상부와 하부를 갖고 있는 것을 특징으로 하는 열인자판.
  5. 제4항에 있어서, 중공부(10)의 상부는 사다리꼴단면을 갖고 중공부(10)의 하부는 직4각형단면을 갖고 있는 것을 특징으로 하는 열인자판.
  6. 제1항에 있어서, 기판(2)은 균질의 결정화유리로 구성되어 있는 것을 특징으로 하는 열인자판.
  7. 제6항에 있어서, 기판(2)은 알루미나와 유리재료와의 균질의 혼합물로 되어 있는 것을 특징으로 하는 열인자판.
  8. 제1항에 있어서, 발열저항수단(3) 및 도체패턴(5),(6)은 보호수단에 의해 덮여있고 이 보호수단은 상기한 발열저항수단(3)의 위치에 있어서, 기판(2)보다도 높은 열전도율을 갖고 있는 것을 특징으로 하는 열인자판.
  9. 제8항에 있어서, 보호수단은 발열저항수단(3)의 양측에 있어서, 도체패턴(5),(6)을 덮는 보다 낮은 열전도율을 갖는 제1보호층과 발열저항수단(3)을 덮는 보다 높은 열전도율을 갖는 제2보호층과를 포함하는 것을 특징으로 하는 열인자판.
  10. 제9항에 있어서, 제2보호층은 열전도율을 높이기 위한 충전재료를 함유하는 재료로 구성되어 있는 것을 특징으로 하는 열인자판.
  11. 균일한 절연재료만으로 된 일체의 인자판용기판(2)으로서 표면에 긴형상의 일체의 융기부(2a)를 갖고 또한 이 융기부(2a)의 위치에 있어서, 그 벽두께 내부에 상기한 융기부(2a)의 길이방향으로 뻗는 중공부(10)를 구비한 것을 특징으로 하는 열인자판용기판.
  12. 제11항에 있어서, 융기부(2a)가 사다리꼴단면을 갖고 있는 것을 특징으로 하는 열인자판용기판.
  13. 제11항에 있어서, 융기부(2a)가 원호상단면을 갖고 있는 것을 특징으로 하는 열인자판용기판.
  14. 중공부(10)는 단면형상이 다른 상부와 하부를 갖고 있는 것을 특징으로 하는 열인자판.
  15. 제14항에 있어서, 중공부(10)의 상부는 사다리꼴단면을 갖고 중공부(10)의 하부는 직4각형단면을 갖고 있는 것을 특징으로 하는 열인자판용기판.
  16. 제11항에 있어서, 균질의 결정화유리로 구성되어 있는 것을 특징으로 하는 열인자판용기판.
  17. 제16항에 있어서, 알루미나와 유리재료와의 균질의 혼합물로 되어 있는 것을 특징으로 하는 열인자판용기판.
  18. 복수의 그린시이트를 적층 및 소성하는 것에 의한 열인자판용기판(2)의 제조방법으로서, 오목한부를 획정하는 적어도 1개의 융기부(2a)가 형성된 표면그린시이트를 준비함과 동시에 적어도 1매의 베이스형성용그린시이트를 준비하고 상기한 오목한부가 베이스형성용그린시이트를 향하도록 표면그린시이트와 베이스형성용그린시이트를 적층하고 얻어진 적층체를 소성하는 각 단계를 포함하는 것을 특징으로 하는 열인자판용기판의 제조방법.
  19. 제18항에 있어서, 표면그린시이트와 베이스형성용 그린시이트와의 사이에 표면그린시이트의 오목한부에 대응하는 슬릿을 갖는 적어도 1매의 천공그린시이트를 개재시킨 상태에서 상기한 적층단계를 행하는 것을 특징으로 하는 열인자판용기판의 제조방법.
  20. 제18항에 있어서, 표면그린시이트의 오목한부에 열분해성수지를 충전시킨상태에서 상기한 적층 및 소성단계를 행하는 것을 특징으로 하는 열인자판용기판의 제조방법.
  21. 제18항에 있어서, 오목한부를 획정하는 융기부(2a)의 형성은 오목한부를 갖는 금형과 볼록한 부를 갖는 금형과를 사용해서 표면그린시이트를 프레스하므로서 행하는 것을 특징으로 하는 열인자판용기판의 제조방법.
  22. 복수의 그린시이트를 적층 및 소성하는 것에 의한 열인자판용기판(2)의 제조방법으로서, 오목한부를 획정하는 적어도 1개의 융기부(2a)가 형성된 표면그린시이트를 준비함과 동시에 복수의 베이스형성용그린시이트를 적층해서 된 베이스적층체를 준비하고 상기한 오목한부가 베이스적층체를 향하도록 표면그린시이트와 베이스적층체를 적층하고 얻어진 활성적층체를 소성하는 각 단계를 포함하는 것을 특징으로 하는 열인자판용기판의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960705857A 1994-06-21 1995-06-19 열인자판과 그에 사용되는 기판 및 그 기판의 제조방법 KR100219735B1 (ko)

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Application Number Priority Date Filing Date Title
JP94-138573 1994-06-21
JP13857394 1994-06-21
JP94-179237 1994-07-29
JP17923794 1994-07-29
JP95-95098 1995-04-20
JP7095098A JPH0867022A (ja) 1994-06-21 1995-04-20 サーマルプリントヘッド及びその基板の製造方法
JP95-95099 1995-04-20
JP7095099A JPH0867023A (ja) 1994-06-21 1995-04-20 サーマルプリントヘッド
PCT/JP1995/001216 WO1995035213A1 (en) 1994-06-21 1995-06-19 Thermal printing head, substrate used therefor and method for producing the substrate

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KR970702155A true KR970702155A (ko) 1997-05-13
KR100219735B1 KR100219735B1 (ko) 1999-09-01

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Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3332069B2 (ja) * 1997-08-25 2002-10-07 株式会社村田製作所 インダクタ及びその製造方法
US6304280B1 (en) * 1997-11-26 2001-10-16 Rohm Co., Ltd. Thermal printhead and method of making the same
TW455547B (en) * 1998-09-09 2001-09-21 Rohm Co Ltd Thermal printing head
EP1226951A3 (en) * 2001-01-29 2003-03-12 Alps Electric Co., Ltd. Power-saving thermal head
JP3868755B2 (ja) * 2001-04-05 2007-01-17 アルプス電気株式会社 サーマルヘッド及びその製造方法
US7489229B2 (en) * 2001-06-11 2009-02-10 Wickmann-Werke Gmbh Fuse component
US20060232656A1 (en) * 2005-04-15 2006-10-19 Eastman Kodak Company Thermal printer, print head, printing method and substrate for use therewith
WO2007041744A1 (en) * 2005-10-10 2007-04-19 Silverbrook Research Pty Ltd Low loss electrode connection for inkjet printhead
US7401890B2 (en) 2005-10-11 2008-07-22 Silverbrook Research Pty Ltd Intercolour surface barriers in multi colour inkjet printhead
US7845765B2 (en) 2005-10-11 2010-12-07 Silverbrook Research Pty Ltd Inkjet printers with elongate chambers, nozzles and heaters
US7510267B2 (en) 2005-10-11 2009-03-31 Silverbrook Research Pty Ltd Reduced stiction printhead surface
US7708387B2 (en) 2005-10-11 2010-05-04 Silverbrook Research Pty Ltd Printhead with multiple actuators in each chamber
US7753496B2 (en) 2005-10-11 2010-07-13 Silverbrook Research Pty Ltd Inkjet printhead with multiple chambers and multiple nozzles for each drive circuit
US7465041B2 (en) 2005-10-11 2008-12-16 Silverbrook Research Pty Ltd Inkjet printhead with inlet priming feature
US7857428B2 (en) 2005-10-11 2010-12-28 Silverbrook Research Pty Ltd Printhead with side entry ink chamber
US7401910B2 (en) 2005-10-11 2008-07-22 Silverbrook Research Pty Ltd Inkjet printhead with bubble trap
US7322681B2 (en) 2005-10-11 2008-01-29 Silverbrook Research Pty Ltd Printhead with ink feed to chamber via adjacent chamber
US7645026B2 (en) 2005-10-11 2010-01-12 Silverbrook Research Pty Ltd Inkjet printhead with multi-nozzle chambers
US7712876B2 (en) 2005-10-11 2010-05-11 Silverbrook Research Pty Ltd Inkjet printhead with opposing actuator electrode polarities
US7470010B2 (en) 2005-10-11 2008-12-30 Silverbrook Research Pty Ltd Inkjet printhead with multiple ink inlet flow paths
US7712884B2 (en) 2005-10-11 2010-05-11 Silverbrook Research Pty Ltd High density thermal ink jet printhead
US7744195B2 (en) 2005-10-11 2010-06-29 Silverbrook Research Pty Ltd Low loss electrode connection for inkjet printhead
US7465032B2 (en) 2005-10-11 2008-12-16 Silverbrook Research Pty Ltd. Printhead with inlet filter for ink chamber
JP5039940B2 (ja) * 2005-10-25 2012-10-03 セイコーインスツル株式会社 発熱抵抗素子、サーマルヘッド、プリンタ、及び発熱抵抗素子の製造方法
JP2007245666A (ja) * 2006-03-17 2007-09-27 Sony Corp サーマルヘッド及びプリンタ装置
JP2007245672A (ja) * 2006-03-17 2007-09-27 Sony Corp サーマルヘッド及びこれを備えたプリンタ装置
JP4548370B2 (ja) 2006-03-17 2010-09-22 ソニー株式会社 サーマルヘッド及びプリンタ装置
JP5181107B2 (ja) * 2007-10-10 2013-04-10 セイコーインスツル株式会社 発熱抵抗素子部品およびプリンタ
US7768541B2 (en) * 2007-10-23 2010-08-03 Seiko Instruments Inc. Heating resistor element, manufacturing method for the same, thermal head, and printer
JP2010214724A (ja) * 2009-03-16 2010-09-30 Alps Electric Co Ltd サーマルヘッド
JP5477741B2 (ja) * 2009-11-30 2014-04-23 セイコーインスツル株式会社 サーマルヘッドおよびその製造方法、並びにプリンタ
JP5787247B2 (ja) * 2010-09-24 2015-09-30 セイコーインスツル株式会社 サーマルヘッドの製造方法
US8885005B2 (en) * 2011-05-16 2014-11-11 Kyocera Corporation Thermal head and thermal printer provided with same
US10543696B2 (en) * 2017-06-08 2020-01-28 Rohm Co., Ltd. Thermal print head
CN111372786B (zh) * 2017-08-10 2022-03-25 罗姆股份有限公司 热敏打印头及热敏打印头的制造方法
JP2020203389A (ja) * 2019-06-14 2020-12-24 ローム株式会社 サーマルプリントヘッドおよびサーマルプリントヘッドの製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5764576A (en) * 1980-10-06 1982-04-19 Mitsubishi Electric Corp Thermal head
JPS5983682A (ja) * 1982-11-04 1984-05-15 Nec Corp セラミツクサ−マルヘツド
JPS606478A (ja) * 1983-06-24 1985-01-14 Hitachi Ltd 感熱記録ヘツド
JPS6013565A (ja) * 1983-07-05 1985-01-24 Oki Electric Ind Co Ltd サ−マルヘツド
JPS61254362A (ja) * 1985-05-08 1986-11-12 Oki Electric Ind Co Ltd 熱線放射ヘツド
JPS6295240A (ja) * 1985-10-23 1987-05-01 Alps Electric Co Ltd サ−マルヘツド
JPS6295239A (ja) * 1985-10-23 1987-05-01 Alps Electric Co Ltd サ−マルヘツド
JPH0245163A (ja) * 1988-08-05 1990-02-15 Alps Electric Co Ltd サーマルヘッド
DE3906484A1 (de) * 1989-03-01 1990-09-20 Siemens Ag Thermodruckerkopf
JP2651496B2 (ja) * 1990-04-06 1997-09-10 セイコー電子工業株式会社 サーマルヘッド
JP3057813B2 (ja) * 1991-05-23 2000-07-04 富士ゼロックス株式会社 サーマルヘッドおよびその製造方法
JPH05177854A (ja) * 1991-11-26 1993-07-20 Tdk Corp サーマルヘッド
JP3277397B2 (ja) * 1992-12-23 2002-04-22 日本碍子株式会社 サーマルヘッド
US5357271A (en) * 1993-01-19 1994-10-18 Intermec Corporation Thermal printhead with enhanced laterla heat conduction

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KR100219735B1 (ko) 1999-09-01
TW290783B (ko) 1996-11-11
CN1151135A (zh) 1997-06-04
DE69511698D1 (de) 1999-09-30
WO1995035213A1 (en) 1995-12-28
EP0767065A4 (en) 1997-02-11
EP0767065A1 (en) 1997-04-09
CN1086640C (zh) 2002-06-26
EP0767065B1 (en) 1999-08-25
DE69511698T2 (de) 2000-06-08
US5949465A (en) 1999-09-07

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