KR970042809A - 에폭시 수지 조성물 - Google Patents
에폭시 수지 조성물 Download PDFInfo
- Publication number
- KR970042809A KR970042809A KR1019960069240A KR19960069240A KR970042809A KR 970042809 A KR970042809 A KR 970042809A KR 1019960069240 A KR1019960069240 A KR 1019960069240A KR 19960069240 A KR19960069240 A KR 19960069240A KR 970042809 A KR970042809 A KR 970042809A
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy resin
- resin composition
- flame retardant
- semiconductor encapsulation
- red
- Prior art date
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract 19
- 229920000647 polyepoxide Polymers 0.000 title claims abstract 19
- 239000000203 mixture Substances 0.000 title claims abstract 16
- 239000003795 chemical substances by application Substances 0.000 claims abstract 7
- 239000004065 semiconductor Substances 0.000 claims abstract 7
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract 6
- 238000005538 encapsulation Methods 0.000 claims abstract 6
- 239000003063 flame retardant Substances 0.000 claims abstract 6
- 239000005011 phenolic resin Substances 0.000 claims abstract 5
- 239000011256 inorganic filler Substances 0.000 claims abstract 4
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract 4
- 125000003700 epoxy group Chemical group 0.000 claims abstract 2
- 230000009477 glass transition Effects 0.000 claims abstract 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 3
- 150000002500 ions Chemical class 0.000 claims 3
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 244000249914 Hemigraphis reptans Species 0.000 claims 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract 1
- 229910052787 antimony Inorganic materials 0.000 abstract 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 abstract 1
- 229910052736 halogen Inorganic materials 0.000 abstract 1
- 150000002367 halogens Chemical class 0.000 abstract 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 1
- 229920001568 phenolic resin Polymers 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K2003/026—Phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP95-334726 | 1995-12-22 | ||
| JP33472695 | 1995-12-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR970042809A true KR970042809A (ko) | 1997-07-26 |
Family
ID=18280537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960069240A KR970042809A (ko) | 1995-12-22 | 1996-12-20 | 에폭시 수지 조성물 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US5869553A (de) |
| EP (1) | EP0783025B1 (de) |
| KR (1) | KR970042809A (de) |
| CN (1) | CN1159461A (de) |
| DE (1) | DE69610690T2 (de) |
| MY (1) | MY114445A (de) |
| SG (1) | SG77127A1 (de) |
| TW (1) | TW339353B (de) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6594688B2 (en) * | 1993-10-01 | 2003-07-15 | Collaboration Properties, Inc. | Dedicated echo canceler for a workstation |
| US5994429A (en) * | 1995-03-10 | 1999-11-30 | Toshiba Chemical Corporation | Halogen-free flame-retardant epoxy resin composition |
| WO1997024402A1 (fr) * | 1995-12-28 | 1997-07-10 | Toray Industries, Inc. | Composition de resine epoxy |
| JP2000281874A (ja) * | 1999-03-31 | 2000-10-10 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP3909751B2 (ja) * | 2000-05-25 | 2007-04-25 | 日本化学工業株式会社 | エポキシ樹脂用赤燐系難燃剤、エポキシ樹脂用赤燐系難燃剤組成物、それらの製造方法、半導体封止材用エポキシ樹脂組成物、封止材および半導体装置 |
| SG90752A1 (en) * | 2000-09-26 | 2002-08-20 | Sumitomo Bakelite Co | Epoxy resin composition and semiconductor device |
| KR100679366B1 (ko) * | 2000-12-29 | 2007-02-05 | 주식회사 케이씨씨 | 환경친화형 난연제를 사용한 반도체 소자 봉지용 에폭시수지 조성물 |
| US6576690B1 (en) | 2002-03-22 | 2003-06-10 | Chang Chung Plastics Co., Ltd. | Phosphorous-containing flame retarding epoxy resin and an epoxy resin composition containing the same |
| AU2003244280A1 (en) * | 2002-06-20 | 2004-01-06 | Hiromitsu Kuramoto | Transparent composite composition |
| US6882058B2 (en) * | 2002-11-05 | 2005-04-19 | Henkel Corporation | Organic acid containing compositions and methods for use thereof |
| JP2005120228A (ja) * | 2003-10-16 | 2005-05-12 | Nitto Denko Corp | 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置 |
| CN100551659C (zh) * | 2004-05-20 | 2009-10-21 | 雅宝公司 | 制成粒状的溴化阴离子苯乙烯系聚合物及其制备和应用 |
| CN100497475C (zh) * | 2005-11-16 | 2009-06-10 | 广东生益科技股份有限公司 | 一种无卤树脂组合物及其在粘结片和覆铜板中的应用 |
| CN102790018A (zh) * | 2006-12-05 | 2012-11-21 | 住友电木株式会社 | 半导体封装件、芯层材料、积层材料及密封树脂组合物 |
| BR112014020987B1 (pt) * | 2012-03-01 | 2021-05-04 | Sumitomo Bakelite Co., Ltd | composição de resina para fixação de rotor, rotor e veículo automotivo |
| JP2016023283A (ja) * | 2014-07-24 | 2016-02-08 | 富士ゼロックス株式会社 | 樹脂組成物および樹脂成形体 |
| CN104804378A (zh) * | 2015-04-29 | 2015-07-29 | 海太半导体（无锡）有限公司 | 一种半导体塑封材料 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4668719A (en) * | 1985-09-23 | 1987-05-26 | Toagosei Chemical Industry Co., Ltd. | Insulating protective material |
| US4879067A (en) * | 1986-06-19 | 1989-11-07 | Rinkagaku Kogyo Co., Ltd. | Red phosphorus flame retardant and nonflammable resinous composition containing the same |
| JPS6395266A (ja) * | 1986-10-13 | 1988-04-26 | Nippon Chem Ind Co Ltd:The | 難燃性樹脂組成物 |
| JPS63244835A (ja) * | 1987-03-31 | 1988-10-12 | Hitachi Ltd | フライバツクトランスの製造方法 |
| KR950011902B1 (ko) * | 1990-04-04 | 1995-10-12 | 도오레 가부시끼가이샤 | 반도체 장치 캡슐 봉입 에폭시 수지 조성물 |
| JP2843244B2 (ja) * | 1993-12-08 | 1999-01-06 | 住友ベークライト株式会社 | エポキシ樹脂組成物 |
| JPH07173372A (ja) * | 1993-12-20 | 1995-07-11 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物 |
| JPH08151427A (ja) * | 1994-09-27 | 1996-06-11 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物 |
| JP3343704B2 (ja) * | 1994-11-29 | 2002-11-11 | 住友ベークライト株式会社 | エポキシ樹脂組成物 |
-
1996
- 1996-12-10 TW TW085115251A patent/TW339353B/zh active
- 1996-12-10 US US08/762,941 patent/US5869553A/en not_active Expired - Fee Related
- 1996-12-11 SG SG1996011622A patent/SG77127A1/en unknown
- 1996-12-14 MY MYPI96005279A patent/MY114445A/en unknown
- 1996-12-17 EP EP96120272A patent/EP0783025B1/de not_active Expired - Lifetime
- 1996-12-17 DE DE69610690T patent/DE69610690T2/de not_active Expired - Fee Related
- 1996-12-20 CN CN96123145A patent/CN1159461A/zh active Pending
- 1996-12-20 KR KR1019960069240A patent/KR970042809A/ko not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| DE69610690D1 (de) | 2000-11-23 |
| MY114445A (en) | 2002-10-31 |
| EP0783025A3 (de) | 1997-10-01 |
| EP0783025A2 (de) | 1997-07-09 |
| SG77127A1 (en) | 2000-12-19 |
| TW339353B (en) | 1998-09-01 |
| DE69610690T2 (de) | 2001-03-15 |
| EP0783025B1 (de) | 2000-10-18 |
| CN1159461A (zh) | 1997-09-17 |
| US5869553A (en) | 1999-02-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E601 | Decision to refuse application |