SG77127A1 - Epoxy resin compositions - Google Patents

Epoxy resin compositions

Info

Publication number
SG77127A1
SG77127A1 SG1996011622A SG1996011622A SG77127A1 SG 77127 A1 SG77127 A1 SG 77127A1 SG 1996011622 A SG1996011622 A SG 1996011622A SG 1996011622 A SG1996011622 A SG 1996011622A SG 77127 A1 SG77127 A1 SG 77127A1
Authority
SG
Singapore
Prior art keywords
epoxy resin
resin compositions
compositions
epoxy
resin
Prior art date
Application number
SG1996011622A
Other languages
English (en)
Inventor
Ueda Shigehisa
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of SG77127A1 publication Critical patent/SG77127A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K2003/026—Phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
SG1996011622A 1995-12-22 1996-12-11 Epoxy resin compositions SG77127A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33472695 1995-12-22

Publications (1)

Publication Number Publication Date
SG77127A1 true SG77127A1 (en) 2000-12-19

Family

ID=18280537

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996011622A SG77127A1 (en) 1995-12-22 1996-12-11 Epoxy resin compositions

Country Status (8)

Country Link
US (1) US5869553A (de)
EP (1) EP0783025B1 (de)
KR (1) KR970042809A (de)
CN (1) CN1159461A (de)
DE (1) DE69610690T2 (de)
MY (1) MY114445A (de)
SG (1) SG77127A1 (de)
TW (1) TW339353B (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6594688B2 (en) * 1993-10-01 2003-07-15 Collaboration Properties, Inc. Dedicated echo canceler for a workstation
EP0763566A4 (de) * 1995-03-10 1997-05-28 Toshiba Chem Corp Halogenfreie flammhemmende epoxidharzzusammensetzung
CN1125135C (zh) * 1995-12-28 2003-10-22 东丽株式会社 环氧树脂组合物
JP2000281874A (ja) * 1999-03-31 2000-10-10 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
WO2001090242A1 (en) * 2000-05-25 2001-11-29 Nippon Chemical Industrial Co., Ltd. Red phosphorus-base flame retardant for epoxy resins, red phosphorus-base flame retardant compositions therefor, processes for the production of both, epoxy resin compositions for sealing semiconductor devices, sealants and semiconductor devices
SG90752A1 (en) * 2000-09-26 2002-08-20 Sumitomo Bakelite Co Epoxy resin composition and semiconductor device
KR100679366B1 (ko) * 2000-12-29 2007-02-05 주식회사 케이씨씨 환경친화형 난연제를 사용한 반도체 소자 봉지용 에폭시수지 조성물
US6576690B1 (en) 2002-03-22 2003-06-10 Chang Chung Plastics Co., Ltd. Phosphorous-containing flame retarding epoxy resin and an epoxy resin composition containing the same
KR20050010776A (ko) * 2002-06-20 2005-01-28 스미또모 베이크라이트 가부시키가이샤 투명 복합체 조성물
US6882058B2 (en) * 2002-11-05 2005-04-19 Henkel Corporation Organic acid containing compositions and methods for use thereof
JP2005120228A (ja) * 2003-10-16 2005-05-12 Nitto Denko Corp 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置
WO2005118245A1 (en) * 2004-05-20 2005-12-15 Albemarle Corporation Pelletized brominated anionic styrenic polymers and their preparation and use
CN100497475C (zh) * 2005-11-16 2009-06-10 广东生益科技股份有限公司 一种无卤树脂组合物及其在粘结片和覆铜板中的应用
JP5608977B2 (ja) 2006-12-05 2014-10-22 住友ベークライト株式会社 半導体パッケージ、コア層材料、ビルドアップ層材料および封止樹脂組成物
JP6469943B2 (ja) * 2012-03-01 2019-02-13 住友ベークライト株式会社 ローター固定用樹脂組成物およびローター
JP2016023283A (ja) * 2014-07-24 2016-02-08 富士ゼロックス株式会社 樹脂組成物および樹脂成形体
CN104804378A (zh) * 2015-04-29 2015-07-29 海太半导体（无锡）有限公司 一种半导体塑封材料

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4668719A (en) * 1985-09-23 1987-05-26 Toagosei Chemical Industry Co., Ltd. Insulating protective material
US4879067A (en) * 1986-06-19 1989-11-07 Rinkagaku Kogyo Co., Ltd. Red phosphorus flame retardant and nonflammable resinous composition containing the same
JPS6395266A (ja) * 1986-10-13 1988-04-26 Nippon Chem Ind Co Ltd:The 難燃性樹脂組成物
JPS63244835A (ja) * 1987-03-31 1988-10-12 Hitachi Ltd フライバツクトランスの製造方法
KR950011902B1 (ko) * 1990-04-04 1995-10-12 도오레 가부시끼가이샤 반도체 장치 캡슐 봉입 에폭시 수지 조성물
JP2843244B2 (ja) * 1993-12-08 1999-01-06 住友ベークライト株式会社 エポキシ樹脂組成物
JPH07173372A (ja) * 1993-12-20 1995-07-11 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
JPH08151427A (ja) * 1994-09-27 1996-06-11 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
JP3343704B2 (ja) * 1994-11-29 2002-11-11 住友ベークライト株式会社 エポキシ樹脂組成物

Also Published As

Publication number Publication date
KR970042809A (ko) 1997-07-26
US5869553A (en) 1999-02-09
EP0783025B1 (de) 2000-10-18
EP0783025A3 (de) 1997-10-01
DE69610690T2 (de) 2001-03-15
CN1159461A (zh) 1997-09-17
DE69610690D1 (de) 2000-11-23
TW339353B (en) 1998-09-01
EP0783025A2 (de) 1997-07-09
MY114445A (en) 2002-10-31

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