KR970042809A - 에폭시 수지 조성물 - Google Patents

에폭시 수지 조성물 Download PDF

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Publication number
KR970042809A
KR970042809A KR1019960069240A KR19960069240A KR970042809A KR 970042809 A KR970042809 A KR 970042809A KR 1019960069240 A KR1019960069240 A KR 1019960069240A KR 19960069240 A KR19960069240 A KR 19960069240A KR 970042809 A KR970042809 A KR 970042809A
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South Korea
Prior art keywords
epoxy resin
resin composition
flame retardant
semiconductor encapsulation
red
Prior art date
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KR1019960069240A
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English (en)
Inventor
시게히사 우에다
Original Assignee
엔다 나오또
스미또모 베이크라이트 가부시끼가이샤
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Publication of KR970042809A publication Critical patent/KR970042809A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K2003/026—Phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

할로겐 및 안티몬이 없고, 납땜 균열 내성 및 고온 저장성이 탁월하고, 난연성이 저하됨이 없는 반도체 봉지용 에폭시 수지 조성물로서, (A) 에폭시 수지, (B) 페놀 수지 경화제, (C) 경화 촉진제, (D) 무기 충전제 및 (E) 적린 기재 난연제를 필수 성분으로 함유하고, 페놀 수지 경화제의 페놀성 히드록실기의 수 (b) 에 대한 에폭시 수지의 에폭시기의 수 (a) 의 비[(a)/(b)]가 0.8 내지 1.2이고, 에폭시 수지 조성물중에 함유된 무기 충전제 (D) 의 양이 에폭시 수지 조성물의 총량을 기준으로 70 내지 90 중량%이고, 에폭시 수지 조성물의 경화 생성물이 100 내지 160 ℃의 유리 전이 온도를 지니며, 25 ℃ 에서의 선팽창 계수가 0.8 내지 1.8 ×10-5/℃임을 특징으로하는 반도체 봉지용 에폭시 수지 조성물.

Description

에폭시 수지 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (4)

  1. (A) 에폭시 수지, (B) 페놀 수지 경화제, (C) 경화 촉진제, (D) 무기 충전제 및 (E) 적린 기재 난연제를 필수 성분으로 함유하는 반도체 봉지용 에폭시 수지 조성물로서, 페놀 수지 경화제의 페놀성 히드록실기의 수 (b) 에 대한 에폭시 수지의 에폭시기의 수 (a) 의 비[(a)/(b)]가 0.8 내지 1.2이고, 에폭시 수지 조성물중에 함유된 무기 충전제 (D) 의 양이 에폭시 수지 조성물의 총량을 기준으로 70 내지 90 중량%이고, 에폭시 수지 조성물의 경화 생성물이 100 내지 160 ℃의 유리 전이 온도를 지니며, 25 ℃ 에서의 선팽창 계수가 0.8 내지 1.8 ×10-5/℃임을 특징으로하는 반도체 봉지용 에폭시 수지 조성물.
  2. 제1항에 있어서, 적린의 표면을 수산화 알루이늄으로 피복하고, 이어서 생성된 표면을 페놀 수지로 추가로 피복하여 적린 기재 난연제 (E)를 수득하고, 상기 적린 기재 난연제 (E)중에 함유된 적린의 함량이 적린 기재 난연제의 중량을 기준으로 60 내지 95 중량 % 이며, 적린 기재 난연제 (E)가 10 내지 70㎛의 평균 입자 크기 및 150㎛ 이하의 최대 입자 크기를 가짐을 특징으로하는 반도체 봉지용 에폭시 수지 조성물.
  3. 제1항 또는 제 2항에 있어서, 이온 포획제 및 에폭시 수지 조성물의 총중량을 기준으로 0.2 내지 2 중량%의 이온 포획제를 추가로 함유함을 특징으로하는 반도체 봉지용 에폭시 수지 조성물.
  4. 제3항에 있어서, 이온 포획제가 BiOx(OH)y(NO3)Z(여기에서, x = 0.9 - 1.1, y = 0.6 - 0.8 이고, z = 0.2 - 0.4 이다) 또는 Mg4.3Al2(OH)12.6CO|3ㆍ3.5H2O 또는 이의 혼합물인 반도체 봉지용 에폭시 수지 조성물.
KR1019960069240A 1995-12-22 1996-12-20 에폭시 수지 조성물 KR970042809A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP95-334726 1995-12-22
JP33472695 1995-12-22

Publications (1)

Publication Number Publication Date
KR970042809A true KR970042809A (ko) 1997-07-26

Family

ID=18280537

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960069240A KR970042809A (ko) 1995-12-22 1996-12-20 에폭시 수지 조성물

Country Status (8)

Country Link
US (1) US5869553A (ko)
EP (1) EP0783025B1 (ko)
KR (1) KR970042809A (ko)
CN (1) CN1159461A (ko)
DE (1) DE69610690T2 (ko)
MY (1) MY114445A (ko)
SG (1) SG77127A1 (ko)
TW (1) TW339353B (ko)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6594688B2 (en) * 1993-10-01 2003-07-15 Collaboration Properties, Inc. Dedicated echo canceler for a workstation
US5994429A (en) * 1995-03-10 1999-11-30 Toshiba Chemical Corporation Halogen-free flame-retardant epoxy resin composition
WO1997024402A1 (fr) * 1995-12-28 1997-07-10 Toray Industries, Inc. Composition de resine epoxy
JP2000281874A (ja) * 1999-03-31 2000-10-10 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP3909751B2 (ja) * 2000-05-25 2007-04-25 日本化学工業株式会社 エポキシ樹脂用赤燐系難燃剤、エポキシ樹脂用赤燐系難燃剤組成物、それらの製造方法、半導体封止材用エポキシ樹脂組成物、封止材および半導体装置
SG90752A1 (en) * 2000-09-26 2002-08-20 Sumitomo Bakelite Co Epoxy resin composition and semiconductor device
KR100679366B1 (ko) * 2000-12-29 2007-02-05 주식회사 케이씨씨 환경친화형 난연제를 사용한 반도체 소자 봉지용 에폭시수지 조성물
US6576690B1 (en) 2002-03-22 2003-06-10 Chang Chung Plastics Co., Ltd. Phosphorous-containing flame retarding epoxy resin and an epoxy resin composition containing the same
AU2003244280A1 (en) * 2002-06-20 2004-01-06 Hiromitsu Kuramoto Transparent composite composition
US6882058B2 (en) * 2002-11-05 2005-04-19 Henkel Corporation Organic acid containing compositions and methods for use thereof
JP2005120228A (ja) * 2003-10-16 2005-05-12 Nitto Denko Corp 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置
CN100551659C (zh) * 2004-05-20 2009-10-21 雅宝公司 制成粒状的溴化阴离子苯乙烯系聚合物及其制备和应用
CN100497475C (zh) * 2005-11-16 2009-06-10 广东生益科技股份有限公司 一种无卤树脂组合物及其在粘结片和覆铜板中的应用
CN102790018A (zh) * 2006-12-05 2012-11-21 住友电木株式会社 半导体封装件、芯层材料、积层材料及密封树脂组合物
BR112014020987B1 (pt) * 2012-03-01 2021-05-04 Sumitomo Bakelite Co., Ltd composição de resina para fixação de rotor, rotor e veículo automotivo
JP2016023283A (ja) * 2014-07-24 2016-02-08 富士ゼロックス株式会社 樹脂組成物および樹脂成形体
CN104804378A (zh) * 2015-04-29 2015-07-29 海太半导体（无锡）有限公司 一种半导体塑封材料

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4668719A (en) * 1985-09-23 1987-05-26 Toagosei Chemical Industry Co., Ltd. Insulating protective material
US4879067A (en) * 1986-06-19 1989-11-07 Rinkagaku Kogyo Co., Ltd. Red phosphorus flame retardant and nonflammable resinous composition containing the same
JPS6395266A (ja) * 1986-10-13 1988-04-26 Nippon Chem Ind Co Ltd:The 難燃性樹脂組成物
JPS63244835A (ja) * 1987-03-31 1988-10-12 Hitachi Ltd フライバツクトランスの製造方法
KR950011902B1 (ko) * 1990-04-04 1995-10-12 도오레 가부시끼가이샤 반도체 장치 캡슐 봉입 에폭시 수지 조성물
JP2843244B2 (ja) * 1993-12-08 1999-01-06 住友ベークライト株式会社 エポキシ樹脂組成物
JPH07173372A (ja) * 1993-12-20 1995-07-11 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
JPH08151427A (ja) * 1994-09-27 1996-06-11 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
JP3343704B2 (ja) * 1994-11-29 2002-11-11 住友ベークライト株式会社 エポキシ樹脂組成物

Also Published As

Publication number Publication date
DE69610690D1 (de) 2000-11-23
MY114445A (en) 2002-10-31
EP0783025A3 (en) 1997-10-01
EP0783025A2 (en) 1997-07-09
SG77127A1 (en) 2000-12-19
TW339353B (en) 1998-09-01
DE69610690T2 (de) 2001-03-15
EP0783025B1 (en) 2000-10-18
CN1159461A (zh) 1997-09-17
US5869553A (en) 1999-02-09

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