KR970005724B1 - 플라스틱 캡슐형 멀티칩 하이브리드 집적회로 - Google Patents

플라스틱 캡슐형 멀티칩 하이브리드 집적회로 Download PDF

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Publication number
KR970005724B1
KR970005724B1 KR1019890007245A KR890007245A KR970005724B1 KR 970005724 B1 KR970005724 B1 KR 970005724B1 KR 1019890007245 A KR1019890007245 A KR 1019890007245A KR 890007245 A KR890007245 A KR 890007245A KR 970005724 B1 KR970005724 B1 KR 970005724B1
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KR
South Korea
Prior art keywords
integrated circuit
flag
leadframe
chip
bonding
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KR1019890007245A
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English (en)
Korean (ko)
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KR900001004A (ko
Inventor
디. 홉슨 래리
Original Assignee
버어 브라운 코오퍼레이션
제임스 제이.버언스
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Publication of KR900001004A publication Critical patent/KR900001004A/ko
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Publication of KR970005724B1 publication Critical patent/KR970005724B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/49531—Additional leads the additional leads being a wiring board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H—ELECTRICITY
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    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
KR1019890007245A 1988-06-02 1989-05-30 플라스틱 캡슐형 멀티칩 하이브리드 집적회로 KR970005724B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US20158988A 1988-06-02 1988-06-02
US201,589 1988-06-02

Publications (2)

Publication Number Publication Date
KR900001004A KR900001004A (ko) 1990-01-31
KR970005724B1 true KR970005724B1 (ko) 1997-04-19

Family

ID=22746444

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890007245A KR970005724B1 (ko) 1988-06-02 1989-05-30 플라스틱 캡슐형 멀티칩 하이브리드 집적회로

Country Status (5)

Country Link
JP (1) JPH0712071B2 (de)
KR (1) KR970005724B1 (de)
DE (1) DE3916980A1 (de)
FR (1) FR2632454A1 (de)
GB (1) GB2219435B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7625286B2 (en) 2004-05-06 2009-12-01 Sony Computer Entertainment Inc. Electronic device and a game controller

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2582013B2 (ja) * 1991-02-08 1997-02-19 株式会社東芝 樹脂封止型半導体装置及びその製造方法
JPH02201949A (ja) * 1989-01-30 1990-08-10 Toshiba Corp 半導体装置
EP0506122A3 (en) * 1991-03-29 1994-09-14 Matsushita Electric Ind Co Ltd Power module
US5491360A (en) * 1994-12-28 1996-02-13 National Semiconductor Corporation Electronic package for isolated circuits
DE102005014746A1 (de) 2005-03-31 2006-10-05 Friwo Mobile Power Gmbh Aktive primärseitige Schaltungsanordnung für ein Schaltnetzteil
DE102006033175A1 (de) * 2006-07-18 2008-01-24 Robert Bosch Gmbh Elektronikanordnung
JP6420617B2 (ja) * 2014-09-30 2018-11-07 ルネサスエレクトロニクス株式会社 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0015053A1 (de) * 1979-01-27 1980-09-03 LUCAS INDUSTRIES public limited company Verfahren zur Herstellung einer Baugruppe mit Leistungshalbleiter und nach diesem Verfahren hergestellte Baugruppe
JPS6041249A (ja) * 1983-08-17 1985-03-04 Nec Corp 混成集積回路装置
JPS60207358A (ja) * 1984-03-30 1985-10-18 Nec Kansai Ltd ハイブリツドｉｃ
JPS6292653U (de) * 1985-11-29 1987-06-13

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7625286B2 (en) 2004-05-06 2009-12-01 Sony Computer Entertainment Inc. Electronic device and a game controller

Also Published As

Publication number Publication date
FR2632454A1 (fr) 1989-12-08
JPH0232558A (ja) 1990-02-02
JPH0712071B2 (ja) 1995-02-08
GB2219435A (en) 1989-12-06
DE3916980A1 (de) 1989-12-14
GB8911054D0 (en) 1989-06-28
GB2219435B (en) 1991-07-03
KR900001004A (ko) 1990-01-31

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