KR960701455A - 두세트의 전도체 사이에 이방성 전도성 경로 및 결합을 제공하기 위한 조성물 및 방법(compositions and methods for providing anisotropic conductive pathways and bonds between two sets of conductors) - Google Patents

두세트의 전도체 사이에 이방성 전도성 경로 및 결합을 제공하기 위한 조성물 및 방법(compositions and methods for providing anisotropic conductive pathways and bonds between two sets of conductors) Download PDF

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KR960701455A
KR960701455A KR1019950704166A KR19950704166A KR960701455A KR 960701455 A KR960701455 A KR 960701455A KR 1019950704166 A KR1019950704166 A KR 1019950704166A KR 19950704166 A KR19950704166 A KR 19950704166A KR 960701455 A KR960701455 A KR 960701455A
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composition
particles
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conductive particles
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버나드 맥아들 시어런
버크 조지프
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데이비드 피. 멜로디
록타이트(아일랜드)리미티드
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Abstract

본 발명은 (i)비-자성 담체 액체에서 강자성 입자의 콜로이드성 현탁액(4)으로 이루어진 강자성유체와 (ⅱ)실질적으로 균일한 크기와 모양을 갖는 강자성유체에서 분산되어 있는 다수의 전기-전도성 입자(5)로 구성된 조성물(3)을 제공한다. 실질적으로 비-자성 전기-전도성 입자(5)의 다양한 유형이 기술되어 있다.
자석수단(8)에 의해 조성물(3)로의 실질적으로 균일한 자기장의 인가는 전기-전도성 입자(5)가 규칙적인 패턴(9)을 형성하게 한다. 조성물은 전자산업에서 두 세트의 전도체(2a, 2b; 7a,7b)사이에서 이방성 전도성 경로(9a, 9b)의 제공을 위해 이용된다. 조성물은 전도체를 결합시키는 경화성 접착제 조성물일 수도 있다. 또한 게다가 전기-전동성 입자는 잠재적인 접착제 특성을 가질 수 있는 예를 들면 입자는 땜납 입자일 수 있다.

Description

두 세트의 전도체 사이에 이방성 전도성 경로 및 결합을 제공하기 위한 조성물 및 방법(COMPOSITIONS AND METHODS FOR PROVIDING ANISOTROPIC CONDUCTIVE PATHWAYS AND BONDS BETWEEN TWO SETS OF CONDUCTORS)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1양태으 결합방법을 도시하는 도면이고;
제2도는 본 발명의 제2양태의 결합방법을 도시하는 도면이고;
제3a도는 자기장의 인가전 강자성유체 APG 511A내에서 상표명 Dynospheres(Q 496)로 시판되는 폴리스티렌/디비닐벤젠(55%) 구상입자의 이방성 분포를 나타내며(실시예1);
제3b도는 샘플에 평행하게 자기장을 인가한 후제3a도의 구체의 X-Y면에서의 이방성 분포를 나타내며(실시예 1);
제3c도는 수평 샘플에 편향된 각으로 자기장을 인가한 후 제3a도의 구체의 면회이방성(z측 성분)을 나타내며(실시예 1).

Claims (32)

  1. (i)비－자성 담체 액체에 강자성 입자의 콜로이드 현탁액으로 이루어진 강자성 유체, 및(ⅱ)강자성유체에 분산되어 있는 실질적으로 균일한 크기와 형태를 갖는 다수의 전기-전도성 입자로 구성된 조성물.
  2. 제1항에 있어서, 전기－전도성 입자의 평균 입자 크기는 콜로이드 강자성 입자 크기의 적어도 10배인 것을 특징으로 하는 조성물.
  3. 제1항에 있어서, 전기－전도성 입자는 실질적으로 비－자성인 것을 특징으로 하는 조성물.
  4. 제3항에 있어서, 전기－전도성 입자는 전기－전도성 금속으로 코팅된 비－자성, 비－전도성 핵으로 구성 된 것을 특징으로 하는 조성물.
  5. 제4항에 있어서, 핵이 플라스틱 재료와 글라스로부터 선택되고 선택적으로 중공인 것을 특징으로 하는 조성물.
  6. 제1항에 있어서, 비－자성 담체 액체는 경화성이고 조성물은 경화성 조성물인 것을 특징으로 하는 조성물.
  7. 제6항에 있어서, 경화성 조성물은 접착제 조성물인 것을 특징으로 하는 조성물.
  8. 제7항에 있어서, 강자성유체는 경화성유체의 접착제 조정물중의 콜로이드 자성 입자의 분산물인 것을 특징으로 하는 조성물.
  9. 제7항에 있어서, 강자성유체는 경화성 접착제 조성물의 혼합물과 액체 담체중의 콜로이드 자성 입자의 분산물인 것을 특징으로 하는 조성물.
  10. 제1항에 있어서, 전기－전도성 입자는 잠재적인 접착제 특성을 갖는 것을 특징으로 하는 조성물.
  11. 제10항에 있어서, 잠재적인 접착제 특성이 열에 의해 활성화되는 것을 특징으로 하는 조성물.
  12. 제1항 또는 11항에 있어서, 전기－전도성 입자는 가용성 금속, 특히 전기－전도성 금속 합금의 땜납입자로 구성된 것을 특징으로 하는 조성물.
  13. 제1항 또는 제11항에 있어서, 전도성 입자는 전도성 재료이거나 이들 위에 전도성 코팅을 갖고 열이나 다른 수단에 의해 활성화할 수 있는 접착제의 외부 코팅을 갖는 입자로 이루어지는 것을 특징으로 하는 조성물.
  14. 두 세트의 전도체 사이에 이방성 전도성 경로를 제공하는 방법에 있어서, 상기 경로를 실질적으로 균일한 크기와 모양을 갖는 다수의 전기－전도성 입자로 형성하는 것으로 구성되며, 상기 전기－전도성 입자는 제1항에 따른 조성물에 실질적으로 균일한 자기장의 인가에 의해 규칙적인 패턴으로 배열되어 있는 것을 특징으로 하는 방법.
  15. 제14항에 있어서, 전기－전도성 입자는 단일층 및/또는 컬럼의 규칙적인 패턴으로 배열되어 있는 것을 특징으로 하는 방법.
  16. 제14항에 있어서, 각 세트의 전도체 사이의 분리는 전기－전도성 입자의 평균 직경과실질적으로 같거나 그 미만인 것을 특징으로 하는 방법.
  17. 제14항에 있어서, 각 전도체를 서로를 향해 밀어내기 위해 압력을 가하는 것을 포함하는 것을 특징으로 하는 방법.
  18. 두 세트의 전도체 사이의 경화된 조성물에서 이방성 전도성 경로를 형성하는 방법에 있어서, (a)실질적으로 균일한 자기장을 제6항에 따른 경화성 조성물에 인가하여 강자성 유체와 전기－전도성 입자 사이의 상호 작용이 전기－전도성 입자가 규칙적인 패턴을 형성하게 하고 (b)조성물을 경화하여 제자리에 패턴을 고정하는 것으로 이루어진 방법.
  19. 두 세트의 전도체 사이의 이방성－전도성 결합을 만드는 방법에 있어서, (a)한 세트의 전도체에 제7항에 따른 접착제 조성물층을 적용하고; (b)다른 한 세트의 전도체를 접착제 조성물층에 대해 가져오며; (c)접착제 조성물층을 실질적으로 균일한 자기장에 노출시켜 강사성유체와 전기－전도성 입자 사이의 상호작용은 전기－전도 입자가 근접한 입자 및/또는 하나 또는 두 세트의 전도체와 각각 전기적으로 접촉하여 입자의 규칙적인 패턴을 형성하게 하고 이에 의해 전도성 경로는 한 세트의 전도체로부터 다른 세트까지 제공되는데 각 경로는 하나 이상의 전기 전도 입자로 이루어지고; (d)조성물을 경화시켜 패턴을 제위치에 고정하고 전도체를 결합하는 것으로 이루어진 방법.
  20. 제18항 또는 제19항에 있어서, 경화단계 전 및/또는 경화과정 동안 서로를 향해 각 세트의 전도체를 밀어내기 위해 압력을 가하는 것을 포함하는 것을 특징으로 하는 방법.
  21. 제18항 내지 제20항에 있어서, 경화시에 각 세트의 전도체 사이의 분리는 전기－전도성 입자의 평균직경과 실질적으로 같거나 그 미만인 것을 특징으로 하는 방법.
  22. 제19항에 있어서, 자기장은 접착제 조성물층에 대해 수직으로 인가되고 전기－전도성 입자는 단일층 또는 컬럼으로 규칙적인 입자의 배열을 형성하는 것을 특징으로 하는 방법.
  23. 제19항에 있어서, 자기장은 접착제 조성물층에 대해 평행하게 (즉 X방향)인가되고, 전기－전도성 입자는 입자의 평행한 체인을 형성하는데 같은 체인의 근접입자 또는 입자들과 각각 전기접촉하고 있는 것을 특징으로 하는 방법.
  24. 두 세트의 전도체 사이에 이방성 전도성 결합을 만드는 방법에 있어서, (a)한 세트의 전도체에 제10항에 따른 조성물층을 적용하고; (b)또 다른 한 세트의 전도체를 조성물층에 대해 가져오며; (c)접착제 조성물층을 실질적으로 균일한 자기장에 노출시켜 강자성유체와 전기－전도성 입자 사이의 상호작용은 전기－전도성 입자가 근접한 입자 및/또는 하나 또는 두 세트의 전도체와 각각 접촉하여 입자의 규칙적인 패턴을 형성하게 하며; (d)입자의 잠재적인 접착제 특성을 활성화하여 이에 의해 전도성 경로가 한 세트의 전도체로부터 다른 세트의 전도체로 제공되고 각 경로는 하나 이상의 전기－전도성 입자로 이루어진 전도체가 입자에 의해 결합되는 것으로 이루어진 방법.
  25. 제24항에 있어서, 잠재적인 접착제 특성의 활성화 이전 및/또는 활성화 동안 서로를 향해 각 세트의전도체를 밀어내기 위해 압력을 가하는 것을 포함하는 것을 특징으로 하는 방법.
  26. 제24항 또는 제25항에 있어서, 잠재적인 접착제 특성의 활성화시 각 세트의 전도체 상이의 분리가 실질적으로 전기－전도성 입자의 평균 직경 이하인 것을 특징으로 하는 방법.
  27. 제24항에 있어서, 자기장은 조성물층에 대해 수직으로 인가되고 전기－전도성 입자는 단일층으로 입자의 규칙적인 배열을 형성하는 것을 특징으로 하는 방법.
  28. 제24항에 있어서, 자기장은 접착제 조성물충에 평행하게 (즉, X방향)인가되고 전기－전도성 입자는 평행한 입자의 체인을 형성하는데 같은 체인의 근접입자 또는 입ㅈ자들과 각각 전기접촉하고 있는 것을 특징으로 하는 방법.
  29. 제24항에 있어서, 전기－전도성 입자는 전기－전도성 금속 합금의 땜납 입자인 것을 특징으로 하는 방법.
  30. 제29항에 있어서, 비－자성 담체 액체는 로진을 주성분으로 하는 플럭스인 것을 특징으로 하는 방법.
  31. 제30항에 있어서, (e)강자성유체 조성물에 대해 밀봉제나 캡슐화 조성물을 적용하고 강자성유체 조성물을 제자리에 밀봉하기 위해 밀봉제나 캡슐화제 조성물을 경화하는 단계를 더 포함하는 것을 특징으로 하는 방법.
  32. 제30항에 있어서, (e)강자성유체를 전도체 사이로부터 빼내고 전도체 사이에 접착제, 밀봉제 또는 캡슐화 조성물을 주입하는 단계를 더 포함하는 것을 특징으로 하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950704166A 1994-01-27 1995-01-26 두세트의전도체사이에이방성전도성경로및결합을제공하기위한조성물및방법 KR100389743B1 (ko)

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MX9504078A (es) 1997-06-28
NO953809L (no) 1995-09-26
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JPH08508610A (ja) 1996-09-10
CA2158941A1 (en) 1995-08-03
EP0692137A1 (en) 1996-01-17
JP3057577B2 (ja) 2000-06-26
KR100389743B1 (ko) 2003-10-04
DE69526287D1 (de) 2002-05-16
EP0692137B1 (en) 2002-04-10
US5769996A (en) 1998-06-23
DE69526287T2 (de) 2002-10-31
US6110399A (en) 2000-08-29
WO1995020820A1 (en) 1995-08-03
ATE216122T1 (de) 2002-04-15

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