KR960037767A - 반도체 캡슐화 에폭시 수지 조성물 및 그것으로 캡슐화된 반도체 장치 - Google Patents

반도체 캡슐화 에폭시 수지 조성물 및 그것으로 캡슐화된 반도체 장치 Download PDF

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Publication number
KR960037767A
KR960037767A KR1019960010722A KR19960010722A KR960037767A KR 960037767 A KR960037767 A KR 960037767A KR 1019960010722 A KR1019960010722 A KR 1019960010722A KR 19960010722 A KR19960010722 A KR 19960010722A KR 960037767 A KR960037767 A KR 960037767A
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South Korea
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epoxy resin
weight
parts
resin composition
semiconductor
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KR1019960010722A
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English (en)
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KR100243708B1 (ko
Inventor
에이이치 아사노
다카유키 아오키
도시오 시오바라
플루리 피터
샤르프 볼프강
다다시 오카다
Original Assignee
다키노 다케오
신에츠 가가쿠 고교 가부시키가이샤
한스 피터 비틀린
시바-가이기 악티엔게젤샤프트
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Publication of KR960037767A publication Critical patent/KR960037767A/ko
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Publication of KR100243708B1 publication Critical patent/KR100243708B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C08K5/523—Esters of phosphoric acids, e.g. of H3PO4 with hydroxyaryl compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(A) 에폭시수지 20 내지 80중량부, (B) 경화제 20 내지 80중량부, (C) 인함유 난연제 0.1 내지 50중량부 및 (D) 무기충전제 200 내지 1.200중량부로 이루어지는 에폭시수지 조성물은 개선된 고온방치성, 난연성 및 내리플로우 균열성을 갖는 제조물로 경화된다, 조성물은 삼산화안티몬 및 브롬화 화합물의 조합을 제거하고, 반도체 장치를 캡슐화하는데 이용하여 고온신뢰성을 부여한다.

Description

반도체 캡슐화 에폭시 수지 조성물 및 그것으로 캡슐화된 반도체 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (5)

  1. (A) 에폭시수지 20 내지 80중량부, (B) 경화제 20 내지 80중량부, (C) 하기 일반식⑴의 화합물 0.1 내지 50중량부, (D) 무기충전제 200 내지 1.200중량부로 이루어지는 것을 특징으로 하는 반도체 캡슐화 에폭시수지 조성물.
    (상기 식에서, R1및 R2각각은 1 내지 4개의 탄소원자를 갖는 알킬이기고, R3및 R4각각은 수소원자 또는 1 내지 4개의 탄소원자를 갖는 알킬기이고, R5는 수소원자, 수산기 또는기를 갖으며, R6및 R7은 수소원자, 수산기 그리고 로 표시되는 기들로 구성된 군으로부터 독립적으로 선택되고, R8및 R9각각은 수소원자 또는 메틸기이며, n은 0 내지 10의 정수이다.)
  2. 제1항에 있어서, 식⑴의 화합물이 하기 식⑵ 또는 ⑶의 화합물인 것을 특징으로 조성물.
    (상기 식에서 m은 1 내지 11의 정수이다.)
  3. 제1항 또는 제2항에 있어서, 추가로 하기 식⑷ 또는 ⑸의 인함유 화합물의 형태로 난연보조제(E)로 이루어지는 것을 특징으로 하는 조성물.
  4. 제1항 내지 제3항 중 어느 한 항에 있어서, 에폭시 수지(A)가 비페닐형 에폭시 수지인 것을 특징으로 하는 조성물.
  5. 제1항 내지 제4항중 어느 한 항의 반도체 캡슐화 에폭시 수지 조성물의 경화 생성물로 캡슐화된 반도체 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.
KR1019960010722A 1995-04-10 1996-04-10 반도체 캡슐화 에폭시 수지조성물 및 그것으로 캡슐화된 반도체장치(Semiconductor Encapsulating Epoxy Resin Compositions and Semiconductor Devices Encapsulated Therewith) KR100243708B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP95-109059 1995-04-10
JP10905995 1995-04-10

Publications (2)

Publication Number Publication Date
KR960037767A true KR960037767A (ko) 1996-11-19
KR100243708B1 KR100243708B1 (ko) 2000-03-02

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960010722A KR100243708B1 (ko) 1995-04-10 1996-04-10 반도체 캡슐화 에폭시 수지조성물 및 그것으로 캡슐화된 반도체장치(Semiconductor Encapsulating Epoxy Resin Compositions and Semiconductor Devices Encapsulated Therewith)

Country Status (10)

Country Link
US (1) US5739187A (ko)
EP (1) EP0742261B1 (ko)
KR (1) KR100243708B1 (ko)
CN (1) CN1077121C (ko)
AT (1) ATE195138T1 (ko)
CA (1) CA2173681A1 (ko)
DE (1) DE69609557T2 (ko)
HK (1) HK1019011A1 (ko)
SG (1) SG65576A1 (ko)
TW (1) TW436509B (ko)

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Also Published As

Publication number Publication date
DE69609557D1 (de) 2000-09-07
KR100243708B1 (ko) 2000-03-02
CN1077121C (zh) 2002-01-02
EP0742261A3 (en) 1999-01-07
DE69609557T2 (de) 2001-04-19
SG65576A1 (en) 2000-08-22
CN1138602A (zh) 1996-12-25
TW436509B (en) 2001-05-28
EP0742261B1 (en) 2000-08-02
ATE195138T1 (de) 2000-08-15
CA2173681A1 (en) 1996-10-11
HK1019011A1 (en) 2000-01-14
US5739187A (en) 1998-04-14
EP0742261A2 (en) 1996-11-13

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