KR900014508A - 에폭시수지 혼합물 - Google Patents

에폭시수지 혼합물 Download PDF

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KR900014508A
KR900014508A KR1019900002887A KR900002887A KR900014508A KR 900014508 A KR900014508 A KR 900014508A KR 1019900002887 A KR1019900002887 A KR 1019900002887A KR 900002887 A KR900002887 A KR 900002887A KR 900014508 A KR900014508 A KR 900014508A
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epoxy resin
group
resin mixture
component
mixture according
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KR1019900002887A
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KR0176963B1 (ko
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볼프강 폰 겐츠코브
위르겐 후버
볼프강 로글러
디이터 빌헴름
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크리스트, 퀼
지멘스 악티엔게젤샤프트
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
    • C08G59/5086—Triazines; Melamines; Guanamines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31518—Next to glass or quartz
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31525—Next to glass or quartz

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Biological Depolymerization Polymers (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Disintegrating Or Milling (AREA)
  • Organic Insulating Materials (AREA)

Abstract

내용 없음

Description

에폭시수지 혼합물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (12)

  1. (A)경우에 따라 지방족 에폭시수지와 혼합되는, 인이 없는 방향족 및/ 또는 헤테로 고리 폴리에폭시수지, (B)에폭시기를 포함하는 하기일반식(Ⅰ)의 인 화합물 및 (C)경화제로서 하기 일반식(Ⅱ)의 방향족 폴리아민을 함유하는 것을 특징으로 하는 프리프레그 및 복합재료를 제조하기 위한 에폭시 수지혼합물.
    상기식에서, m=0 또는 1, n=0,1 또는 2, o=1.2 또는 3:m+n+o=3, p=0,1 또는 2이고, X는 자유전자쌍 또는 2중 결합된 O 또는 S원자이며, R은 직접 또는 O 또는 S를 통해 결합된 C1-C4-알킬기, C2-C3-알케닐기, 알릴기, 아르알킬기, 디알킬아미노기 또는 알킬 아릴아미노기 또는 3-트리알킬실릴-프로필기이고, R1은 O,S페닐렌, 디옥시페닐렌, 디옥시나프틸렌, (CH2)r, O-(CH2)r,O-(CH2)|r-O(여기서r=1내지3)로 된 다리이며, A1및 A2는 동일하거나 상이하며 단순결합 또는 R3그룹에 대응하는 다리결합이고, 3개의 방향족 부분 구조의 각각에서 R1기 및 R2기중 하나는 수소원자 및 다른 일킬기이다.
  2. 제1항에 있어서, 성분(B)은 인산의 디 또는 트리글리시딜에스테르 또는 이들 화합물의 혼합물인 것을 특징으로 하는 에폭시 수지 혼합물.
  3. 제1항에 있어서, 성분(B)은 알킬 또는 아릴포스폰산의 디글리시딜에스테르인 것을 특징으로 하는 에폭시수지 혼합물.
  4. 제1항에 있어서, 성분(B)은 인산의 디 또는 트리글리시딜에스테르 또는 이들 화합물의 혼합물인 것을 특징으로 하는 에폭시 수지 혼합물.
  5. 제1항 내지 4항중 어느 한 항에 있어서, 성분(A)와 성분(B)의 비율이 10:1 내지 1:10, 특히 4:1 내지 1:4인 것을 특징으로 하는 에폭시 수지 혼합물.
  6. 제1항 내지 5항중 어느 한항 또는 다수항에 있어서, 에폭시드-작용기와 아민수소-작용기의 비율이 0.9:1내지 1.1:1, 특히 약 1:1인 것을 특징으로 하는 에폭시 수지 혼합물.
  7. 제1항 내지 6항중 어느 한 항 또는 다수항에 있어서, 성분(C)은 2,4-및 2.6-디아소시아나토-알킬벤졸로된 혼합물을 심량체화한 후 가수분해함으로써 제조되는 폴리아민의 혼합물인 것을 특징으로 하는 에폭시 수지 혼합물.
  8. 제1항 내지 7항중 어느 한 항 또는 다수항에 있어서, 성분(C)을 경화제인 다른 방향족 및/ 또는 헤테로고리 폴리아민과 혼합하는 것을 특징으로 하는 에폭시 수지 혼합물.
  9. 제8항에 있어서, 경화제 혼합물내의 성분(C)의 양이 최소한 70중량%인 것을 특징으로 하는 에폭시 수지 혼합물.
  10. 제1항 내지 9항중 어느 한 항 또는 다수항에 있어서, 폴리에폭시수지가, 특히 0.1중량%의 가수분해가능한 할로겐을 함유하는 에폭시화된 노볼락인 것을 특징으로 하는 에폭시 수지 혼합물.
  11. 제1항 내지 10항중 어느 한 한 항 또는 다수항에 따른 에폭시 수지 혼합물로 제조되는, 섬유, 부직포 또는 직물의 형태인 또는 표면재의 형태인 유기 또는 무기 강화재를 기초로 한 프리프레그 및 복합재료.
  12. 제1항 내지 10항중 어느 한 항 또는 다수항에 따른 에폭시 수지 혼합물 및 유리 섬유직물로 제조되는 프리프레그로된 전도판.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900002887A 1989-03-03 1990-03-03 에폭시수지 혼합물 KR0176963B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE89103802.8 1989-03-03
EP89103802A EP0384940B1 (de) 1989-03-03 1989-03-03 Epoxidharzmischungen
EP89103802.8 1989-03-03

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KR900014508A true KR900014508A (ko) 1990-10-24
KR0176963B1 KR0176963B1 (ko) 1999-05-15

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US (1) US5376453A (ko)
EP (1) EP0384940B1 (ko)
JP (1) JP2797254B2 (ko)
KR (1) KR0176963B1 (ko)
AT (1) ATE107677T1 (ko)
DE (1) DE58907953D1 (ko)
FI (1) FI96034C (ko)
HK (1) HK64096A (ko)

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JPH02269730A (ja) 1990-11-05
EP0384940B1 (de) 1994-06-22
EP0384940A1 (de) 1990-09-05
FI96034C (fi) 1996-04-25
FI96034B (fi) 1996-01-15
JP2797254B2 (ja) 1998-09-17
DE58907953D1 (de) 1994-07-28
KR0176963B1 (ko) 1999-05-15
ATE107677T1 (de) 1994-07-15
HK64096A (en) 1996-04-19
FI901083A0 (fi) 1990-03-02
US5376453A (en) 1994-12-27

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