DK3037426T3 - Phosphor-indeholdende forbindelse, og hærdbar epoxy-resin-sammensætning indeholdende samme - Google Patents

Phosphor-indeholdende forbindelse, og hærdbar epoxy-resin-sammensætning indeholdende samme Download PDF

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Publication number
DK3037426T3
DK3037426T3 DK14837177.6T DK14837177T DK3037426T3 DK 3037426 T3 DK3037426 T3 DK 3037426T3 DK 14837177 T DK14837177 T DK 14837177T DK 3037426 T3 DK3037426 T3 DK 3037426T3
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DK
Denmark
Prior art keywords
phosphor
resin composition
same
curable epoxy
composition containing
Prior art date
Application number
DK14837177.6T
Other languages
English (en)
Inventor
Takeshi Endo
Ken-Ichi Tamaso
Ryo Ogawa
Kozo Matsumoto
Original Assignee
Adeka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adeka Corp filed Critical Adeka Corp
Application granted granted Critical
Publication of DK3037426T3 publication Critical patent/DK3037426T3/da

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    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F9/00Compounds containing elements of Groups 5 or 15 of the Periodic Table
    • C07F9/02Phosphorus compounds
    • C07F9/28Phosphorus compounds with one or more P—C bonds
    • C07F9/30Phosphinic acids [R2P(=O)(OH)]; Thiophosphinic acids ; [R2P(=X1)(X2H) (X1, X2 are each independently O, S or Se)]
    • C07F9/32Esters thereof
    • C07F9/3258Esters thereof the ester moiety containing a substituent or a structure which is considered as characteristic
    • C07F9/3282Esters with hydroxyaryl compounds
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F9/00Compounds containing elements of Groups 5 or 15 of the Periodic Table
    • C07F9/02Phosphorus compounds
    • C07F9/28Phosphorus compounds with one or more P—C bonds
    • C07F9/30Phosphinic acids [R2P(=O)(OH)]; Thiophosphinic acids ; [R2P(=X1)(X2H) (X1, X2 are each independently O, S or Se)]
    • C07F9/32Esters thereof
    • C07F9/3258Esters thereof the ester moiety containing a substituent or a structure which is considered as characteristic
    • C07F9/3264Esters with hydroxyalkyl compounds
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F9/00Compounds containing elements of Groups 5 or 15 of the Periodic Table
    • C07F9/02Phosphorus compounds
    • C07F9/28Phosphorus compounds with one or more P—C bonds
    • C07F9/30Phosphinic acids [R2P(=O)(OH)]; Thiophosphinic acids ; [R2P(=X1)(X2H) (X1, X2 are each independently O, S or Se)]
    • C07F9/36Amides thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • C08K5/51Phosphorus bound to oxygen
    • C08K5/53Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5313Phosphinic compounds, e.g. R2=P(:O)OR'
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K21/00Fireproofing materials
    • C09K21/06Organic materials
    • C09K21/12Organic materials containing phosphorus
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K21/00Fireproofing materials
    • C09K21/14Macromolecular materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Fireproofing Substances (AREA)
DK14837177.6T 2013-08-22 2014-08-21 Phosphor-indeholdende forbindelse, og hærdbar epoxy-resin-sammensætning indeholdende samme DK3037426T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013171940 2013-08-22
PCT/JP2014/071825 WO2015025904A1 (ja) 2013-08-22 2014-08-21 含リン化合物及びそれを含有する硬化性エポキシ樹脂組成物

Publications (1)

Publication Number Publication Date
DK3037426T3 true DK3037426T3 (da) 2021-07-19

Family

ID=52483675

Family Applications (1)

Application Number Title Priority Date Filing Date
DK14837177.6T DK3037426T3 (da) 2013-08-22 2014-08-21 Phosphor-indeholdende forbindelse, og hærdbar epoxy-resin-sammensætning indeholdende samme

Country Status (10)

Country Link
US (1) US10562924B2 (da)
EP (1) EP3037426B1 (da)
JP (1) JP6618049B2 (da)
KR (1) KR102301768B1 (da)
CN (2) CN111057104A (da)
BR (1) BR112016000802B1 (da)
DK (1) DK3037426T3 (da)
ES (1) ES2878126T3 (da)
TW (1) TWI623546B (da)
WO (1) WO2015025904A1 (da)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3252102B1 (en) * 2015-01-29 2021-03-10 Adeka Corporation Flame-retardant epoxy resin composition, prepreg formed using this, and laminate plate
KR20210029718A (ko) 2018-07-04 2021-03-16 가부시키가이샤 아데카 수지 조성물, 그 경화물, 섬유 강화 플라스틱 및 섬유 강화 플라스틱의 난연화 방법

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE251134C (da)
NL259583A (da) * 1959-12-31
GB991590A (en) * 1963-08-01 1965-05-12 Shell Res Ltd Phosphinothionate insecticides
US3371046A (en) * 1963-12-30 1968-02-27 Douglas Aircraft Co Inc Inhibition of corrosion of hydraulic fluids
BE667545A (da) * 1964-07-28 1965-11-16
DE1252680B (de) * 1964-07-29 1967-10-26 Monsanto Company, St. Louis, Mo. (V. St. A.) Verfahren zur Herstellung von Phosphinsäureestern
US3383318A (en) * 1965-03-31 1968-05-14 Monsanto Co Fire resistant hydraulic fluids and lubricants
DE1956187A1 (de) * 1969-11-07 1971-05-13 Vnii Fitopatologii Als Fungizide anwendbare Organophosphorverbindungen und Verfahren zu deren Herstellung
DE2542009A1 (de) 1975-09-20 1977-03-24 Hoechst Ag Bromhaltige phosphinsaeureester
SU584008A1 (ru) * 1976-07-07 1977-12-15 Казанский Химико-Технологический Институт Имени С.М.Кирова Способ получени фениловых эфиров фосфиновых кислот
DD251134A1 (de) * 1986-07-09 1987-11-04 Univ Halle Wittenberg Verfahren zur herstellung von organosilylmethylphosphinsaeureestern
EP0742261B1 (en) 1995-04-10 2000-08-02 Shin-Etsu Chemical Co., Ltd. Semiconductor encapsulating epoxy resin compositions suitable for semiconductor encapsulation, their manufacture and use, semiconductor devices encapsulated therewith
JPH10195178A (ja) 1997-01-06 1998-07-28 Toshiba Chem Corp 難燃性エポキシ樹脂組成物、プリプレグ、積層板、銅張積層板及びプリント配線板
JPH10265487A (ja) 1997-03-21 1998-10-06 Kanagawa Univ ホスホン酸エステル類並びにポリホスホネートの 製造方法と硬化性組成物
CA2343793A1 (en) 1998-09-18 2000-03-30 Anteneh Z. Worku Halogen-free flame retardant thermoplastic polymer compositions
DE19917070A1 (de) 1999-04-15 2000-10-19 Basf Ag Stabilisierte Phosphorverbindungen beinhaltende Zusammensetzung
KR20090073474A (ko) * 2007-12-31 2009-07-03 제일모직주식회사 새로운 인계 난연제, 그 제조방법 및 이를 함유하는 난연열가소성 수지 조성물
TW201002729A (en) * 2008-03-28 2010-01-16 Nippon Kayaku Kk Aqueous dispersions of organic phosphorous compounds and flame retarding modification method using the dispersions
KR20090122819A (ko) * 2008-05-26 2009-12-01 강원대학교산학협력단 분자내 하이드로아미네이션 반응용 신규 촉매와, 이 촉매를이용한 고리형 이민 화합물의 제조방법
DE102008063640A1 (de) * 2008-12-18 2010-06-24 Clariant International Limited Verfahren zur Herstellung von gemischtsubstituierten Dialkylphosphinsäuren, -estern und -salzen und ihre Verwendung
KR101344792B1 (ko) * 2010-12-17 2013-12-24 제일모직주식회사 하드마스크 조성물, 이를 사용한 패턴 형성 방법 및 상기 패턴을 포함하는 반도체 집적회로 디바이스
WO2014206487A1 (en) 2013-06-28 2014-12-31 Fundacion Imdea Materiales A halogen free flame retardant epoxy resin composition

Also Published As

Publication number Publication date
KR102301768B1 (ko) 2021-09-14
KR20160046795A (ko) 2016-04-29
WO2015025904A1 (ja) 2015-02-26
EP3037426A4 (en) 2017-05-03
US20160152643A1 (en) 2016-06-02
BR112016000802B1 (pt) 2021-05-18
ES2878126T3 (es) 2021-11-18
EP3037426A1 (en) 2016-06-29
CN105452263A (zh) 2016-03-30
JP6618049B2 (ja) 2019-12-11
JPWO2015025904A1 (ja) 2017-04-27
CN111057104A (zh) 2020-04-24
EP3037426B1 (en) 2021-06-23
TW201512213A (zh) 2015-04-01
TWI623546B (zh) 2018-05-11
US10562924B2 (en) 2020-02-18

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