KR960030451A - 확산마스크 및 그것을 이용한 pn접합소자의 제조방법 - Google Patents
확산마스크 및 그것을 이용한 pn접합소자의 제조방법 Download PDFInfo
- Publication number
- KR960030451A KR960030451A KR1019960000117A KR19960000117A KR960030451A KR 960030451 A KR960030451 A KR 960030451A KR 1019960000117 A KR1019960000117 A KR 1019960000117A KR 19960000117 A KR19960000117 A KR 19960000117A KR 960030451 A KR960030451 A KR 960030451A
- Authority
- KR
- South Korea
- Prior art keywords
- diffusion
- mask
- diffusion mask
- source
- ain
- Prior art date
Links
- 238000009792 diffusion process Methods 0.000 title claims abstract 20
- 238000004519 manufacturing process Methods 0.000 title description 2
- 238000000034 method Methods 0.000 title 1
- 239000007790 solid phase Substances 0.000 claims abstract 2
- 239000012535 impurity Substances 0.000 claims 3
- 150000001875 compounds Chemical class 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 abstract 1
- 229910004298 SiO 2 Inorganic materials 0.000 abstract 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 abstract 1
- 238000000137 annealing Methods 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 abstract 1
- 238000005260 corrosion Methods 0.000 abstract 1
- 239000011229 interlayer Substances 0.000 abstract 1
- 240000004308 marijuana Species 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/0004—Devices characterised by their operation
- H01L33/0008—Devices characterised by their operation having p-n or hi-lo junctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
- H01L21/2258—Diffusion into or out of AIIIBV compounds
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Devices (AREA)
- Drying Of Semiconductors (AREA)
Abstract
HF계 에찬트에 대해서 내식성을 가지는 확산마스크를 제공한다.
n-GaAS기판 10의 겉쪽의 주면 10a위에 차례로, AIN 확산마스크 18, 확산원 20 및 AIN 애닐캡 22를 형성한다.
확산원 20은 ZnO 및 SiO2의 혼합막이다.
또 기판 안쪽의 주면 10b위에 AIN 애닐캡 24를 형성한다.
그런 후에 고상확산에 의해 Zn확산영역을 26을 형성한다.
이어서 열인산에 의해, 애닐캡 22,24를 제거하고, 또 HF 또는 버퍼드 HF에 의해 확산원 20을 제거한다.
확산마스크 18은 HF 혹은 버퍼드 HF에 대해서 내식성을 가지기 때문에, 확산원 20을 에칭해도, 확산마스크 18의 확산창 16이 넓어진다든지, 혹은 확산마스크 18에 구멍이 생긴다든지 하지 않는다.
이 때문에 확산마스크 18을 층간절연기능을 손상하는일 없이 확산원 20을 에칭제거할 수 있다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3도는 실시예의 설명에 관한 제조공정도이다.
Claims (2)
- 화합물반도체에 불순물을 선택적으로 확산시키기 위한 확산 마스트를 AIN막으로써 구성하는 것을 특징으로 하는 확산마스크.
- 화합물반도체위에 청구항 1기재의 확산마스크를 형성하는 공정과, 상기 확산마스크위에 확산원막을 형성하는 공정과, 고상확산법에 의해 상기 화합물반도체에 불순물을 확산시키는 공정과 불순물확산의 종료 후, 확산원막을 HF계 에찬트를 이용해서 에칭제거하는 공정을 포함해서 구성하는 것을 특징으로 하는 pn접합소자의 제조방법※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP95-6139 | 1995-01-19 | ||
JP95-006139 | 1995-01-19 | ||
JP613995A JP3157690B2 (ja) | 1995-01-19 | 1995-01-19 | pn接合素子の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960030451A true KR960030451A (ko) | 1996-08-17 |
KR100417988B1 KR100417988B1 (ko) | 2004-05-20 |
Family
ID=11630184
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960000117A KR100417988B1 (ko) | 1995-01-19 | 1996-01-05 | 확산마스크를이용한pn접합소자의제조방법 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5700714A (ko) |
EP (1) | EP0723285B1 (ko) |
JP (1) | JP3157690B2 (ko) |
KR (1) | KR100417988B1 (ko) |
DE (1) | DE69525922T2 (ko) |
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US5821567A (en) * | 1995-12-13 | 1998-10-13 | Oki Electric Industry Co., Ltd. | High-resolution light-sensing and light-emitting diode array |
US5955747A (en) | 1996-07-25 | 1999-09-21 | Oki Electric Industry Co., Ltd. | High-density light-emitting-diode array utilizing a plurality of isolation channels |
JP3268731B2 (ja) * | 1996-10-09 | 2002-03-25 | 沖電気工業株式会社 | 光電変換素子 |
JPH10290025A (ja) | 1997-04-15 | 1998-10-27 | Oki Electric Ind Co Ltd | Ledアレイ |
JP3181262B2 (ja) * | 1998-06-04 | 2001-07-03 | スタンレー電気株式会社 | 平面実装型led素子およびその製造方法 |
JP2000332248A (ja) * | 1999-05-14 | 2000-11-30 | Internatl Business Mach Corp <Ibm> | 薄膜トランジスタおよびその製造方法 |
JP4221818B2 (ja) * | 1999-05-28 | 2009-02-12 | 沖電気工業株式会社 | 光半導体素子の製造方法 |
DE10041689A1 (de) * | 2000-08-24 | 2002-03-14 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung von dotiertem Halbleitermaterial |
US7001057B2 (en) * | 2001-05-23 | 2006-02-21 | Ivoclar Vivadent A.G. | Lighting apparatus for guiding light onto a light polymerizable piece to effect hardening thereof |
US7030428B2 (en) * | 2001-12-03 | 2006-04-18 | Cree, Inc. | Strain balanced nitride heterojunction transistors |
US6982204B2 (en) * | 2002-07-16 | 2006-01-03 | Cree, Inc. | Nitride-based transistors and methods of fabrication thereof using non-etched contact recesses |
US7045404B2 (en) * | 2004-01-16 | 2006-05-16 | Cree, Inc. | Nitride-based transistors with a protective layer and a low-damage recess and methods of fabrication thereof |
US7901994B2 (en) * | 2004-01-16 | 2011-03-08 | Cree, Inc. | Methods of manufacturing group III nitride semiconductor devices with silicon nitride layers |
US7612390B2 (en) | 2004-02-05 | 2009-11-03 | Cree, Inc. | Heterojunction transistors including energy barriers |
US7170111B2 (en) * | 2004-02-05 | 2007-01-30 | Cree, Inc. | Nitride heterojunction transistors having charge-transfer induced energy barriers and methods of fabricating the same |
US7439609B2 (en) * | 2004-03-29 | 2008-10-21 | Cree, Inc. | Doping of gallium nitride by solid source diffusion and resulting gallium nitride structures |
US7432142B2 (en) * | 2004-05-20 | 2008-10-07 | Cree, Inc. | Methods of fabricating nitride-based transistors having regrown ohmic contact regions |
US7084441B2 (en) | 2004-05-20 | 2006-08-01 | Cree, Inc. | Semiconductor devices having a hybrid channel layer, current aperture transistors and methods of fabricating same |
DE102004026231B4 (de) | 2004-05-28 | 2019-01-31 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Bereichs mit reduzierter elektrischer Leitfähigkeit innerhalb einer Halbleiterschicht und optoelektronisches Halbleiterbauelement |
US7238560B2 (en) * | 2004-07-23 | 2007-07-03 | Cree, Inc. | Methods of fabricating nitride-based transistors with a cap layer and a recessed gate |
US20060017064A1 (en) * | 2004-07-26 | 2006-01-26 | Saxler Adam W | Nitride-based transistors having laterally grown active region and methods of fabricating same |
US7456443B2 (en) * | 2004-11-23 | 2008-11-25 | Cree, Inc. | Transistors having buried n-type and p-type regions beneath the source region |
US7709859B2 (en) * | 2004-11-23 | 2010-05-04 | Cree, Inc. | Cap layers including aluminum nitride for nitride-based transistors |
US7161194B2 (en) * | 2004-12-06 | 2007-01-09 | Cree, Inc. | High power density and/or linearity transistors |
US7355215B2 (en) * | 2004-12-06 | 2008-04-08 | Cree, Inc. | Field effect transistors (FETs) having multi-watt output power at millimeter-wave frequencies |
US7465967B2 (en) * | 2005-03-15 | 2008-12-16 | Cree, Inc. | Group III nitride field effect transistors (FETS) capable of withstanding high temperature reverse bias test conditions |
US8575651B2 (en) | 2005-04-11 | 2013-11-05 | Cree, Inc. | Devices having thick semi-insulating epitaxial gallium nitride layer |
US7626217B2 (en) * | 2005-04-11 | 2009-12-01 | Cree, Inc. | Composite substrates of conductive and insulating or semi-insulating group III-nitrides for group III-nitride devices |
US7615774B2 (en) * | 2005-04-29 | 2009-11-10 | Cree.Inc. | Aluminum free group III-nitride based high electron mobility transistors |
US7544963B2 (en) * | 2005-04-29 | 2009-06-09 | Cree, Inc. | Binary group III-nitride based high electron mobility transistors |
US9331192B2 (en) | 2005-06-29 | 2016-05-03 | Cree, Inc. | Low dislocation density group III nitride layers on silicon carbide substrates and methods of making the same |
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US7709269B2 (en) | 2006-01-17 | 2010-05-04 | Cree, Inc. | Methods of fabricating transistors including dielectrically-supported gate electrodes |
DE102007020888A1 (de) * | 2007-05-04 | 2008-11-06 | Micro Systems Engineering Gmbh & Co. Kg | Keramisches Substratmaterial, Verfahren zur Herstellung und Verwendung desselben sowie Antenne oder Antennenarray |
US8030188B2 (en) * | 2008-12-05 | 2011-10-04 | Electronics And Telecommunications Research Institute | Methods of forming a compound semiconductor device including a diffusion region |
US8969912B2 (en) | 2011-08-04 | 2015-03-03 | Avogy, Inc. | Method and system for a GaN vertical JFET utilizing a regrown channel |
JP6477396B2 (ja) * | 2015-09-30 | 2019-03-06 | 豊田合成株式会社 | 窒化物半導体装置の製造方法 |
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CN113053736B (zh) * | 2021-03-11 | 2024-05-03 | 捷捷半导体有限公司 | 一种半导体器件制作方法 |
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-
1995
- 1995-01-19 JP JP613995A patent/JP3157690B2/ja not_active Expired - Fee Related
- 1995-12-13 DE DE69525922T patent/DE69525922T2/de not_active Expired - Lifetime
- 1995-12-13 EP EP95309079A patent/EP0723285B1/en not_active Expired - Lifetime
-
1996
- 1996-01-05 KR KR1019960000117A patent/KR100417988B1/ko not_active IP Right Cessation
- 1996-01-19 US US08/588,890 patent/US5700714A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69525922D1 (de) | 2002-04-25 |
EP0723285A3 (en) | 1997-04-02 |
EP0723285B1 (en) | 2002-03-20 |
JP3157690B2 (ja) | 2001-04-16 |
DE69525922T2 (de) | 2002-11-07 |
JPH08195506A (ja) | 1996-07-30 |
EP0723285A2 (en) | 1996-07-24 |
US5700714A (en) | 1997-12-23 |
KR100417988B1 (ko) | 2004-05-20 |
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