KR960014415A - 전자부품등의 세정방법 및 장치 - Google Patents

전자부품등의 세정방법 및 장치 Download PDF

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Publication number
KR960014415A
KR960014415A KR1019950039268A KR19950039268A KR960014415A KR 960014415 A KR960014415 A KR 960014415A KR 1019950039268 A KR1019950039268 A KR 1019950039268A KR 19950039268 A KR19950039268 A KR 19950039268A KR 960014415 A KR960014415 A KR 960014415A
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KR
South Korea
Prior art keywords
cleaning method
electronic parts
electronic
cleaning
parts
Prior art date
Application number
KR1019950039268A
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English (en)
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KR100223695B1 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of KR960014415A publication Critical patent/KR960014415A/ko
Application granted granted Critical
Publication of KR100223695B1 publication Critical patent/KR100223695B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
    • C02F1/461—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
    • C02F1/46104—Devices therefor; Their operating or servicing
    • C02F1/4618—Devices therefor; Their operating or servicing for producing "ionised" acidic or basic water
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B9/00—Cells or assemblies of cells; Constructional parts of cells; Assemblies of constructional parts, e.g. electrode-diaphragm assemblies; Process-related cell features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/42—Treatment of water, waste water, or sewage by ion-exchange
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/44—Treatment of water, waste water, or sewage by dialysis, osmosis or reverse osmosis
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
    • C02F2103/02—Non-contaminated water, e.g. for industrial water supply
    • C02F2103/04—Non-contaminated water, e.g. for industrial water supply for obtaining ultra-pure water
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2201/00—Apparatus for treatment of water, waste water or sewage
    • C02F2201/46—Apparatus for electrochemical processes
    • C02F2201/461—Electrolysis apparatus
    • C02F2201/46105—Details relating to the electrolytic devices
    • C02F2201/4611—Fluid flow
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2201/00—Apparatus for treatment of water, waste water or sewage
    • C02F2201/46—Apparatus for electrochemical processes
    • C02F2201/461—Electrolysis apparatus
    • C02F2201/46105—Details relating to the electrolytic devices
    • C02F2201/46115—Electrolytic cell with membranes or diaphragms
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2201/00—Apparatus for treatment of water, waste water or sewage
    • C02F2201/46—Apparatus for electrochemical processes
    • C02F2201/461—Electrolysis apparatus
    • C02F2201/46105—Details relating to the electrolytic devices
    • C02F2201/46195—Cells containing solid electrolyte
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F9/00—Multistage treatment of water, waste water or sewage
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/30—Hydrogen technology
    • Y02E60/36—Hydrogen production from non-carbon containing sources, e.g. by water electrolysis

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Hydrology & Water Resources (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Environmental & Geological Engineering (AREA)
  • Water Supply & Treatment (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Water Treatment By Electricity Or Magnetism (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Detergent Compositions (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
KR1019950039268A 1994-10-28 1995-10-28 반도체기판,유리기판,전자부품및 이들의 제조장치부품의 세정방법및장치 KR100223695B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6265811A JPH08126873A (ja) 1994-10-28 1994-10-28 電子部品等の洗浄方法及び装置
JP94-265811 1994-10-28

Publications (2)

Publication Number Publication Date
KR960014415A true KR960014415A (ko) 1996-05-22
KR100223695B1 KR100223695B1 (ko) 1999-10-15

Family

ID=17422387

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950039268A KR100223695B1 (ko) 1994-10-28 1995-10-28 반도체기판,유리기판,전자부품및 이들의 제조장치부품의 세정방법및장치

Country Status (7)

Country Link
US (1) US5635053A (ko)
JP (1) JPH08126873A (ko)
KR (1) KR100223695B1 (ko)
CN (1) CN1059878C (ko)
DE (1) DE19540471A1 (ko)
GB (1) GB2294590B (ko)
TW (1) TW326549B (ko)

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JP3198899B2 (ja) * 1995-11-30 2001-08-13 アルプス電気株式会社 ウエット処理方法
US5645737A (en) * 1996-02-21 1997-07-08 Micron Technology, Inc. Wet clean for a surface having an exposed silicon/silica interface
US6103627A (en) 1996-02-21 2000-08-15 Micron Technology, Inc. Treatment of a surface having an exposed silicon/silica interface
US5716535A (en) * 1996-03-05 1998-02-10 Micron Technology, Inc. Methods and etchants for etching oxides of silicon with low selectivity
JP3590470B2 (ja) * 1996-03-27 2004-11-17 アルプス電気株式会社 洗浄水生成方法および洗浄方法ならびに洗浄水生成装置および洗浄装置
CN1299333C (zh) 1996-08-20 2007-02-07 奥加诺株式会社 清洗电子元件或其制造设备的元件的方法和装置
JPH1092777A (ja) * 1996-09-12 1998-04-10 Komatsu Electron Metals Co Ltd 半導体ウェハの製造方法
JP3087680B2 (ja) * 1997-04-04 2000-09-11 日本電気株式会社 半導体製造装置
US5849643A (en) * 1997-05-23 1998-12-15 Advanced Micro Devices, Inc. Gate oxidation technique for deep sub quarter micron transistors
US6048466A (en) * 1997-08-20 2000-04-11 Fine Glass Technology Co., Ltd. Method of cleaning glass substrate for magnetic disk or semiconductor substrate
JP3920429B2 (ja) * 1997-12-02 2007-05-30 株式会社ルネサステクノロジ 位相シフトフォトマスクの洗浄方法および洗浄装置
US5913981A (en) 1998-03-05 1999-06-22 Micron Technology, Inc. Method of rinsing and drying semiconductor wafers in a chamber with a moveable side wall
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KR100654413B1 (ko) * 1998-04-30 2006-12-05 가부시키가이샤 에바라 세이사꾸쇼 기판의 도금방법
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CN103500658B (zh) * 2013-10-17 2016-06-22 中国振华（集团）新云电子元器件有限责任公司 降低高压大容量钽电解电容器漏电流的方法
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CN105448657A (zh) * 2014-09-02 2016-03-30 无锡华润上华半导体有限公司 一种改善高压器件阈值电压均匀性的方法
JP6373394B2 (ja) 2014-09-16 2018-08-15 オルガノ株式会社 希釈液製造方法および希釈液製造装置
JP6154860B2 (ja) * 2015-07-17 2017-06-28 野村マイクロ・サイエンス株式会社 洗浄用水素水の製造方法及び製造装置
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JP6299912B1 (ja) * 2017-03-30 2018-03-28 栗田工業株式会社 ｐＨ及び酸化還元電位を制御可能な希釈薬液の製造装置
US11145521B2 (en) * 2017-09-28 2021-10-12 Taiwan Semiconductor Manufacturing Co., Ltd. Method for cleaning a semiconductor substrate
CN109266467A (zh) * 2018-08-20 2019-01-25 四川建元天地环保科技有限公司 有机电解液在产品表面去污的用途
WO2020217453A1 (ja) * 2019-04-26 2020-10-29 神田　智一 洗浄液生成装置、洗浄・コーティング液生成装置
JP6900975B2 (ja) * 2019-06-12 2021-07-14 栗田工業株式会社 ｐＨ調整水製造装置
CN114653665B (zh) * 2022-02-14 2024-09-03 浙江富芯微电子科技有限公司 一种在碳化硅衬底化学抛光后清洗的方法
CN116804508A (zh) * 2023-08-28 2023-09-26 西安聚能超导线材科技有限公司 一种无氧铜的清洗干燥方法

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Also Published As

Publication number Publication date
DE19540471A1 (de) 1996-05-02
TW326549B (en) 1998-02-11
CN1130689A (zh) 1996-09-11
US5635053A (en) 1997-06-03
CN1059878C (zh) 2000-12-27
JPH08126873A (ja) 1996-05-21
GB2294590A (en) 1996-05-01
GB9522047D0 (en) 1996-01-03
GB2294590B (en) 1999-04-14
KR100223695B1 (ko) 1999-10-15

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