KR960009821A - 프린트 배선기판 및 장착 구조체 - Google Patents

프린트 배선기판 및 장착 구조체 Download PDF

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Publication number
KR960009821A
KR960009821A KR1019950023786A KR19950023786A KR960009821A KR 960009821 A KR960009821 A KR 960009821A KR 1019950023786 A KR1019950023786 A KR 1019950023786A KR 19950023786 A KR19950023786 A KR 19950023786A KR 960009821 A KR960009821 A KR 960009821A
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KR
South Korea
Prior art keywords
solder
printed wiring
terminal
pad
wiring board
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KR1019950023786A
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English (en)
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KR0184624B1 (ko
Inventor
도루 나까니시
히데오 오꾸마
Original Assignee
윌리암 티. 엘리스
인터내셔널 비지네스 머신즈 코포레이션
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Publication of KR960009821A publication Critical patent/KR960009821A/ko
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Publication of KR0184624B1 publication Critical patent/KR0184624B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

단자의 피치가 좁은 소자를 납땜할 때 생기기 쉬운 땜납 브리지를 방지한다.
솔더 레지스트(20)에 땜납 패드(22)의 단부(22A)보다 단자(14)의 선단측에 솔더 레지스트(20)가 설치되어 있지 않은 잉여 땜납 흡수 영역(24)을 둔다. 단자(14)를 납땜할 때 땜납 패드(22)상에 땜납 페이스트가 많게 부착한 때는 가열 히터의 열에 의해 용융된 잉여 땜납(28)은 단자(14)를 거쳐서 잉여 땜납 흡수 영역(24)내를 단자(14)의 선단 방향으로 흐른다. 잉여 땜납(28)이 단자(14)와 단자(14)의 사이의 솔더 레지스트(20)를 타넘지 않으므로 땜납 브리지를 형성하는 일이 없다.

Description

프린트 배선기판 및 장착 구조체
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1실시예에 관한 것으로서 납땜 전의 프린트 배선기판 및 소자의 사시도.
제2도는 땜납 패드상에 납땜한 단자를 도시하는 평면도.
제3도는 제2도의 3-3선 단면도.
제4도는 본 발명의 제2실시예에 관한 것으로서 납땜 전의 프린트 배선기판 및 소자의 사시도.
제5도는 본 발명의 제3실시예에 관한 것으로서 납땜 전의 프린트 배선기판 및 소자의 사시도.

Claims (5)

  1. 복수의 긴 단자를 가진 소자를 표면 장착하는 프린트 배선기판에 있어서, 회로기판과, 상기 회로기판상에 설치되고 상기 단자를 얹어놓고 납땜하기 위한 복수의 땜납 패드와, 상기 회로기판상에 상기 땜납 패드의 사이 및 땜납 패드를 제외하는 소정의 영역에 설치되어서 용융 땜납의 부착을 방지하는 솔더 레지스트를 구비하며, 상기 회로기판상의 상기 땜납 패드의 상기 소자측과는 반대측에 상기 땜납 패드와 상기 단자를 납땜할때 발생한 잉여 용융 땜납을 퍼지게 하기 위해서 솔더 레지스트가 설치되어 있지 않은 잉여 땜납 흡수 영역을 설치한 것을 특징으로 하는 프린트 배선기판.
  2. 제1항에 있어서, 상기 잉여 땜납 흡수 영역을 포함하는 상기 솔더 레지스트의 상기 땜납 패드를 노출시키고 있는 개구 부분에 있어서의 상기 땜납 패드를 제외한 나머지 부분이 상기 잉여의 용융 땜납을 흡수할 수 있는 크기로 설치되어 있는 것을 특징으로 하는 프린트 배선 기판.
  3. 제1항 또는 제2항에 있어서, 상기 단자를 상기 땜납 패드의 소정 위치에 대응시켰을때 상기 잉여 땜납 흡수 영역은 상기 땜납 패드보다 돌출한 상기 단자의 선단측에 대향하는 것을 특징으로 하는 프린트 배선 기판.
  4. 제3항에 있어서, 상기 잉여 땜납 흡수 영역의 상기 땜납 패드의 상기 소자측과 반대측의 단부로부터 상기 단자의 선단 방향으로 계측한 길이를 상기 단자를 상기 땜납 패드의 소정 위치에 대응시켰을때의 상기 땜납 패드로부터 상기 소자측과는 반대측에 돌출한 상기 단자의 부분의 길이에 상기 솔더 레지스트의 인쇄 위치 맞춤 허용 오차 치수를 보탠 치수보다 크게 한 것을 특징으로 하는 프린트 배선 기판.
  5. 제1항 내지 제4항중의 어느 한 항에 기재된 프린트 배선기판의 상기 땜납 패드에 상기 소자의 상기 단자가 납땜되어서 상기 소자가 표면 장착된 것을 특징으로 하는 장착 구조체.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950023786A 1994-08-03 1995-08-02 프린트 배선기판 및 장착 구조체 KR0184624B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6182395A JP2673098B2 (ja) 1994-08-03 1994-08-03 プリント配線基板及び実装構造体
JP94-182395 1994-08-03

Publications (2)

Publication Number Publication Date
KR960009821A true KR960009821A (ko) 1996-03-22
KR0184624B1 KR0184624B1 (ko) 1999-05-15

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Country Status (4)

Country Link
US (1) US5815919A (ko)
EP (1) EP0696159A1 (ko)
JP (1) JP2673098B2 (ko)
KR (1) KR0184624B1 (ko)

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KR19990035273A (ko) * 1997-10-31 1999-05-15 소니 비디오 타이완 캄파니 리미티드 전자 장치 조립 방법 및 회로 보드

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Publication number Priority date Publication date Assignee Title
KR19990035273A (ko) * 1997-10-31 1999-05-15 소니 비디오 타이완 캄파니 리미티드 전자 장치 조립 방법 및 회로 보드

Also Published As

Publication number Publication date
EP0696159A1 (en) 1996-02-07
US5815919A (en) 1998-10-06
JP2673098B2 (ja) 1997-11-05
KR0184624B1 (ko) 1999-05-15
JPH0864939A (ja) 1996-03-08

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