WO2016063396A1 - 配線板、電動機、電気機器及び空気調和機 - Google Patents
配線板、電動機、電気機器及び空気調和機 Download PDFInfo
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- WO2016063396A1 WO2016063396A1 PCT/JP2014/078197 JP2014078197W WO2016063396A1 WO 2016063396 A1 WO2016063396 A1 WO 2016063396A1 JP 2014078197 W JP2014078197 W JP 2014078197W WO 2016063396 A1 WO2016063396 A1 WO 2016063396A1
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- wiring board
- wiring
- footprint
- pin
- resist
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/0094—Structural association with other electrical or electronic devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/89—Arrangement or mounting of control or safety devices
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/30—Structural association with control circuits or drive circuits
- H02K11/33—Drive circuits, e.g. power electronics
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K5/00—Casings; Enclosures; Supports
- H02K5/04—Casings or enclosures characterised by the shape, form or construction thereof
- H02K5/08—Insulating casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/20—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for measuring, monitoring, testing, protecting or switching
- H02K11/21—Devices for sensing speed or position, or actuated thereby
- H02K11/215—Magnetic effect devices, e.g. Hall-effect or magneto-resistive elements
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K15/00—Methods or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines
- H02K15/12—Impregnating, heating or drying of windings, stators, rotors or machines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09027—Non-rectangular flat PCB, e.g. circular
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10757—Bent leads
- H05K2201/10772—Leads of a surface mounted component bent for providing a gap between the lead and the pad during soldering
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention relates to a wiring board, an electric motor, an electric device, and an air conditioner.
- Patent Document 1 which is an example of a technique for preventing positional misalignment, states that “printing with improved yield and reliability when reflow soldering a surface mount component with asymmetrical number of electrodes on a printed wiring board is disclosed. “Providing a printed circuit board is a problem” and “the length of the pad 12 (1) on the side with a smaller number of electrodes is extended in the same direction to form the extended pad 12 (1a). The lead electrode 22 (1) on the side of the mounting component 20 having a small number of electrodes is soldered to the corresponding pad 12 (1a) of the printed wiring board 10 while maintaining a sufficient solder joint surface. A substrate is disclosed.
- Patent Document 1 which is the conventional technique described above is the suppression of positional misalignment at a level that does not cause solder failure, and is similar to the Hall IC or Hall element that detects the rotor magnetic pole rotation position of the motor. There is a problem that it cannot be applied to the connection of an IC that requires a high positional accuracy of 2 mm or less.
- a solder resist which is an insulating film that protects the circuit pattern, is formed on the surface of such a wiring board, and a resist opening is provided at the position of the footprint to which the Hall IC or Hall element is connected. Yes.
- the resist opening is formed larger than the footprint. Therefore, the footprint shape at the resist opening becomes asymmetrical depending on the wiring drawing direction on the wiring board, and a force is applied to the wiring drawing direction at the time of reflow, causing a mounting IC position shift. .
- the present invention has been made in view of the above, and an object thereof is to obtain a wiring board having both high mounting position accuracy and high solder strength.
- the present invention provides a wiring board on which an electronic component having a plurality of pins is mounted, and includes a base substrate and a plurality of wirings provided on the base substrate. And a resist that covers the plurality of wirings, and a plurality of footprints that are connected to the plurality of wirings, the entire surface is exposed in the openings of the resist, and the plurality of pins are soldered by reflowing,
- the pin is a wiring board in which a drawing direction of the pin is parallel to a drawing direction of the wiring.
- FIG. 1 The figure which shows the structure of the wiring board concerning Embodiment 1.
- FIG. 1 The figure which shows the structure of the wiring board concerning Embodiment 1.
- FIG. The figure which shows the IC chip mounted by soldering on the wiring board concerning Embodiment 1 The figure which shows the positional relationship of Hall IC in Embodiment 1, and a rotor rotating shaft.
- the figure which shows the positional relationship of the wiring which is a comparative example in Embodiment 1, and a footprint.
- Sectional drawing which shows the connection state of radial direction when connecting an IC pin and a footprint on the wiring board concerning Embodiment 1.
- FIG. The figure which shows the electric motor concerning Embodiment 2.
- FIG. The figure which shows the air conditioner which is an example of the electric equipment concerning Embodiment 3.
- FIG. 1 and 2 are diagrams showing a configuration of a first embodiment of a wiring board according to the present invention.
- FIG. 1 shows the surface on which the component is mounted, that is, the surface of the wiring board 10
- FIG. 2 shows the surface on which the component is not mounted, that is, the back surface of the wiring board 10. .
- the circular wiring board 10 has a hole 11 in the center, and includes a connector 12, a surface mount inverter IC 13 and Hall ICs 14a to 14c.
- wiring may be formed on the base substrate 10a on which components are mounted, and a chip resistor or a chip capacitor may be provided, or the connector 12 and the inverter IC 13 may not be provided.
- a rotating shaft passes through the hole 11 of the wiring board 10, the surface of the wiring board 10 on which the component is mounted is disposed on the stator side, and the back surface of the wiring board 10 on which the component is not mounted is disposed on the anti-stator side. .
- the wiring board 10 is formed by mounting wiring and components on the base substrate 10a.
- FIGS. 3 and 4 are views showing the configuration of the first embodiment of the wiring board according to the present invention and showing a different form from FIGS. 3 shows the surface on which the component is mounted, that is, the surface of the wiring board 15, and FIG. 4 shows the surface on which the component is not mounted, that is, the back surface of the wiring board 15. . Only the magnetic position sensor circuit is formed on the wiring board 15 shown in FIGS.
- the wiring board 15 includes a connector 16 and Hall ICs 17a to 17c.
- wiring is formed on the base substrate 15a on which components are mounted, and a chip resistor or a chip capacitor may be provided, or the connector 16 may not be provided.
- the front surface of the wiring board 15 on which the components of the wiring board 15 are mounted is disposed on the stator side, and the back surface of the wiring board 15 on which no components are mounted is disposed on the anti-stator side.
- the wiring board 15 is formed by mounting wiring and components on the base substrate 15a.
- FIG. 5 is a diagram showing an IC chip mounted on the wiring board 10 shown in FIGS. 1 and 2 or the wiring board 15 shown in FIGS. 3 and 4 by soldering.
- the IC chip shown in FIG. 5 includes an IC body 20 and IC pins 21a to 21c.
- the IC body 20 corresponds to the Hall ICs 14a to 14c shown in FIG. 1 or the Hall ICs 17a to 17c shown in FIG. 3, and the IC pins 21a to 21c are connected to the wiring board 10 or the wiring board 15 by soldering.
- the soldering is performed by reflow. That is, reflow mounting is performed.
- the direction of the force applied to the IC pins 21a to 21c causing the mounting position deviation is a direction parallel to the wiring connected to the footprint exposed by the resist opening, that is, the wiring drawing direction.
- the IC chip includes three IC pins is illustrated, but the present invention is not limited to this, and the number of IC pins is changed as appropriate. be able to.
- the positional accuracy in the radial direction of the rotor is not required, and only the positional accuracy in the circumferential direction is required.
- the pin pull-out direction of the Hall IC or Hall element and the radial direction of the rotor are arranged in parallel, and the clearance in the circumferential direction between the Hall IC or Hall element pin and the footprint to which the pin is connected is reduced to 0.2 mm or less. Then, the mounting position accuracy in the circumferential direction can be improved.
- the radial direction refers to the radial direction with reference to the rotation axis
- the circumferential direction refers to the direction of drawing an arc with reference to the rotation axis
- the radial direction and the circumferential direction are orthogonal to each other.
- the circumferential clearance is a distance between one end of a pin connected to the footprint in the circumferential direction and one end of the footprint closer to the one end.
- the radial clearance is a distance between one end of a pin connected to the footprint in the radial direction and one end of the footprint closer to the one end.
- FIG. 6 is a diagram illustrating the positional relationship between the Hall IC and the rotor rotation axis that is the origin of the wiring board.
- the Hall ICs 14A to 14C correspond to the Hall ICs 14a to 14c shown in FIG. In FIG. 6, the Hall ICs are arranged at intervals of 24 degrees. In the Hall ICs 14A to 14C shown in FIG. 6, the angle formed between the IC pin pull-out direction and the radial direction is 24 degrees, but is not limited to this and may be 45 degrees or less.
- the origin of the wiring board is located at the center of the wiring board.
- the Hall ICs 14A to 14C detect the rotor magnetic pole rotation position of the electric motor, the positional accuracy in the radial direction is not required, and the positional accuracy in the circumferential direction is required.
- the pin pull-out direction of the Hall IC or Hall element and the radial direction of the rotor are arranged at 45 degrees or less, preferably set to 0 degrees so that the pin pull-out direction and the rotor radial direction are parallel to each other.
- the clearance in the circumferential direction with the connected footprint is made smaller than 0.2 mm and larger than 0, the circumferential mounting position accuracy can be improved.
- the clearance in the circumferential direction is simply reduced, the solder fillet formation region is reduced, and the solder strength is reduced. In view of this, it is conceivable to enlarge the formation area of the solder fillet by increasing the radial clearance in order to maintain the solder strength.
- FIG. 6 shows a case where mounting is performed in a component mounting facility in which the change interval of the mounting direction of the Hall IC is 90 degrees.
- the angle of the Hall ICs 14A to 14C with respect to the IC pin pull-out direction and the radial direction May be arranged so as to be 45 degrees or less.
- FIG. 6 illustrates a case where the angle between the IC pin pull-out direction and the radial direction is 24 degrees.
- a solder resist which is an insulating film that protects the circuit pattern, is formed on the surfaces of the wiring boards 10 and 15, and a resist opening is provided at the footprint where the Hall IC or Hall element is connected. Yes.
- the resist opening is formed larger than the footprint. For this reason, the shape of the footprint at the resist opening becomes asymmetrical depending on the direction in which the wiring is drawn out on the wiring board, and a force is applied in the direction in which the wiring is drawn at the time of reflow, resulting in a deviation in the mounting position of the Hall IC.
- the solder resist is generally formed of a negative resist.
- FIG. 7 is a diagram showing a positional relationship between wiring and a footprint, which is a comparative example in the first embodiment.
- the footprint 22a is exposed through the resist opening 23a
- the footprint 22b is exposed through the resist opening 23b
- the footprint 22c is exposed through the resist opening 23c.
- the direction of the force applied to the IC pins 21a to 21c is parallel to the wiring drawing direction in the resist opening.
- the direction of the force applied to the IC pins 21a to 21c at the time of reflow is parallel to the direction in which the IC pins are pulled out.
- the first embodiment discloses a technique for suppressing such mounting position deviation.
- FIG. 8 is a diagram illustrating a first example of the positional relationship between the wiring and the footprint in the wiring board according to the first embodiment. Also in FIG. 8, the footprint 22a is exposed through the resist opening 23a, the footprint 22b is exposed through the resist opening 23b, and the footprint 22c is exposed through the resist opening 23c. The direction of the force applied to the IC pins 21a to 21c is parallel to the wiring drawing direction in the resist opening. In the wiring 25a connected to the footprint 22a shown in FIG.
- FIG. 9 is a diagram illustrating a second example of the positional relationship between the wiring and the footprint in the wiring board according to the first embodiment.
- the footprint 22a is exposed through the resist opening 23a
- the footprint 22b is exposed through the resist opening 23b
- the footprint 22c is exposed through the resist opening 23c.
- the direction of the force applied to the IC pins 21a to 21c is parallel to the wiring drawing direction in the resist opening.
- the IC pins 21a to 21d are reflowed as shown by white arrows in FIG.
- the direction of the force applied to 21c is parallel to the IC pin pull-out direction, but the IC pin may be pulled in this direction because the pull-out direction of all the wirings is the same direction.
- the angle between the drawing direction of the IC pins 21a to 21c and the radial direction is 45 degrees or less, and preferably the drawing direction and the radial direction of the IC pins 21a to 21c are parallel, the deviation in the circumferential direction can be minimized. .
- the mounting position shift in the circumferential direction of the Hall IC due to the force applied in the wiring drawing direction during reflow is suppressed.
- FIG. 10 is a diagram illustrating a third example of the positional relationship between the wiring and the footprint in the wiring board according to the first embodiment.
- the footprint 22a is exposed through the resist opening 23a
- the footprint 22b is exposed through the resist opening 23b
- the footprint 22c is exposed through the resist opening 23c.
- the direction of the force applied to the IC pins 21a to 21c is parallel to the wiring drawing direction in the resist opening.
- the IC pins 21a to 21d are reflowed as shown by white arrows in FIG.
- the direction of the force applied to 21c is parallel to the IC pin drawing direction, and the mounting position deviation of the Hall IC due to the force applied to the wiring drawing direction during reflow is suppressed. Further, in FIG. 10, since all the wiring drawing directions are on the IC body side, and the wiring drawing direction is the same as the pin drawing direction, the portion of the wiring exposed by the resist opening is also used as the fillet formation region. be able to. Therefore, the fillet forming region can be enlarged and the solder strength can be increased.
- FIG. 11 is a diagram illustrating a fourth example of the positional relationship between the wiring and the footprint in the wiring board according to the first embodiment.
- the footprint 22a is exposed through the resist opening 23a
- the footprint 22b is exposed through the resist opening 23b
- the footprint 22c is exposed through the resist opening 23c.
- the direction of the force applied to the IC pins 21a to 21c is parallel to the wiring drawing direction in the resist opening.
- the wiring 25A connected to the footprint 22a shown in FIG. 11 the wiring 25B connected to the footprint 22b, and the wiring 25C connected to the footprint 22c, as shown in FIGS.
- the direction of the force applied to the IC pins 21a to 21c at the time of reflow indicated by the arrow is parallel to the IC pin drawing direction, and the mounting position deviation of the Hall IC due to the force applied to the wiring drawing direction at the time of reflow is suppressed.
- the wiring is further drawn out to the opposite side of the footprint without terminating the wiring in the footprint. That is, the wiring is provided on both sides of the footprint.
- the shape of the resist opening is rectangular for convenience, but is not limited to this.
- the resist opening is provided to expose the entire surface of the footprint, and has a shape corresponding to the shape of the footprint.
- An example of the shape corresponding to the footprint is a similar shape of the footprint.
- the opening that can expose the entire surface of the footprint can be formed small.
- solder fillet 24 is formed in a solder fillet forming region on the clearance of the footprint 22. Therefore, as shown in FIG. 12, if a wide solder fillet forming region on the footprint 22 can be secured, the solder strength can be increased. However, in order to improve the mounting position accuracy in the circumferential direction, it is necessary to reduce the clearance of the footprint 22. When the clearance of the footprint 22 is reduced, the solder fillet forming region is narrowed as shown in FIG. 13, and the solder strength is reduced. In order to suppress a decrease in solder strength, the solder fillet forming region in the radial direction may be enlarged.
- the solder fillet 24 preferably has an angle of 15 ° or more and 45 ° or less with the footprint 22 that is the surface to be formed.
- FIG. 14 is a cross-sectional view of the opening portion of the resist 26 showing a connection state in a direction parallel to the drawing direction of the IC pin, which is the radial direction when the IC pin 21 and the footprint 22 are connected.
- the footprint 22 is connected to the wiring 25.
- the radial clearance is preferably equal to or greater than the sum of the IC pin floating height, which is the height from the surface of the footprint 22 to the bottom surface of the IC pin 21, and the IC pin thickness.
- FIG. 15 is another cross-sectional view of the opening of the resist 26 showing a connection state in a direction parallel to the drawing direction of the IC pin, which is the radial direction when the IC pin 21 and the footprint 22 are connected.
- the footprint 22 is connected to the wiring 25.
- the clearance in the direction parallel to the lead-out direction of the IC pin, which is the radial direction on the side opposite to the IC body 20 as the IC body, is the height from the surface of the footprint 22 to the bottom surface of the IC pin 21 as in FIG. It is good to set it more than the sum of a certain IC pin floating height and IC pin thickness.
- the clearance in the direction parallel to the drawing direction of the IC pin which is the radial direction on the IC body 20 side that is the IC body, is the IC pin floating height that is the height from the surface of the footprint 22 to the bottom surface of the IC pin 21, and the IC pin It should be more than the total height of the pin body.
- the IC pin body side height is a height from the surface of the footprint 22 to the back surface of the IC pin 21 in a portion that is drawn from the IC body 20 and is not bent.
- the solder fillet formation region is formed only on the footprint 22, but the solder fillet formation region may be formed by both the footprint and the wiring. That is, as shown in FIG. 10, when the wiring drawing direction is on the IC main body side, the wiring exposed at the resist opening can also be used as the fillet forming region. Therefore, the fillet forming region can be enlarged and the solder strength can be increased.
- the wiring board on which the Hall IC is mounted has been described as an example, but the present invention is not limited to this and may be other electronic components. That is, one embodiment of the present invention described in this embodiment is a wiring board on which an electronic component having a plurality of pins is mounted, and includes a base substrate and a plurality of wirings provided over the base substrate. A resist that covers the plurality of wirings, and a plurality of footprints that are connected to the plurality of wirings, the entire surface is exposed in the openings of the resist, and the plurality of pins are soldered by reflowing, In the opening of the resist, the pin is a wiring board in which the drawing direction of the pin is parallel to the drawing direction of the wiring.
- the present embodiment it is possible to suppress the mounting position shift in the circumferential direction at the time of heating in the reflow furnace with high accuracy without reducing the solder strength. Since the mounting position shift can be suppressed with high accuracy, a reduction in yield can be suppressed.
- the Hall IC is illustrated as an example of the IC chip.
- the present invention is not limited to this, and the IC chip has a mounting displacement in the circumferential direction during reflow furnace heating. Any IC that should be suppressed with high positional accuracy may be used.
- the IC chip having the IC pin connected to the wiring board has been described.
- the present invention is not limited to this, and has a terminal that is a pin connected to the wiring board. Any electronic component may be used.
- FIG. 16 is a cross-sectional view showing the configuration of the electric motor according to the present embodiment.
- the motor shown in FIG. 16 includes a wiring board 10, a rotating shaft 30, an output side bearing 31, a counter output side bearing 32, a rotor sensor magnet 33, a rotor 34, a rotor magnet 35, and a winding terminal.
- the brushless DC motor includes 36, an insulator 37, a stator core 38, a winding 39, a bracket 40, a mold resin 41, and a mold stator 42.
- the wiring board 10 includes a connector 12, an inverter IC 13, and a Hall IC 14.
- the Hall IC 14 detects the position of the rotor 34.
- the wiring board 10 is arranged perpendicular to the axial direction of the rotary shaft 30 between the output side bearing 31 and the stator, and is fixed to the insulator 37.
- the insulator 37 electrically insulates the stator core 38 and the winding 39 from each other.
- the stator core 38 is formed of laminated electromagnetic steel plates.
- the winding 39 is wound around each slot of the stator core 38 via the insulator 37, and is connected to the inverter IC 13 of the wiring board 10 via the winding terminal 36.
- a connector 12 having a lead wire connected to the control circuit is disposed on the wiring board 10.
- the mold stator 42 has a configuration in which the stator and the wiring board 10 are integrally molded with a mold resin 41, and a concave portion formed to accommodate the rotor 34 is provided therein.
- the thermal expansion coefficient differs between the mold resin 41 and the solder, and a large thermal stress is applied to the solder, so that solder strength is particularly required.
- the rotor 34 includes a rotor magnet 35 disposed inside the mold stator 42 and disposed on the outer peripheral side of the rotation shaft 30 so as to face the stator core 38.
- the rotor sensor magnet 33 for detecting the position of the Hall IC 14 is disposed in a rotor 34 with the rotation shaft 30 as a circle center.
- the rotor magnet 35 is a permanent magnet, and examples thereof include a ferrite magnet and a rare earth magnet.
- One end of the rotary shaft 30 has an output-side bearing 31 that rotatably supports the rotary shaft 30, and the other end has a non-output-side bearing 32 that rotatably supports the rotary shaft 30.
- the bracket 40 is conductive and is fitted into the inner peripheral portion of the mold stator 42 to close the opening of the concave portion of the mold stator 42, and the outer ring of the counter-output side bearing 32 is fitted inside the bracket 40. Yes.
- FIG. 17 is a cross-sectional view showing a configuration of the electric motor according to the present embodiment, and is a view showing a form different from FIG.
- the electric motor shown in FIG. 16 includes a wiring board 15, a rotating shaft 30, an output side bearing 31, a counter output side bearing 32, a rotor sensor magnet 33, a rotor 34, a rotor magnet 35, and an insulator 37.
- the brushless DC motor includes a stator core 38, a winding 39, a bracket 40, a mold resin 41, and a mold stator 42. That is, a wiring board 15 is provided instead of the wiring board 10 in FIG. Note that the winding terminals are not shown.
- the wiring board 15 includes a connector 16 and a Hall IC 17.
- the Hall IC 17 detects the position of the rotor 34.
- the stator and the wiring board 10 are integrally molded to improve heat dissipation and safety, and the solder strength for connecting the wiring board 10 and the Hall IC 14 should be high. .
- the solder strength high, it is possible to prevent a failure of the motor due to the Hall IC being detached and to prevent a decrease in reliability.
- the mounting position deviation in the circumferential direction of the Hall IC is suppressed with high accuracy, so that variation in the mounting position in the circumferential direction of the Hall IC is suppressed. As a result, the advance angle variation that greatly affects the efficiency of the motor is suppressed, and the power consumption is reduced.
- FIG. 18 is an external view showing the configuration of an air conditioner that is an example of the electrical apparatus according to the present invention.
- An air conditioner 50 shown in FIG. 18 includes an indoor unit 51, an outdoor unit 52, and a fan 53.
- the outdoor unit 52 is connected to the indoor unit 51.
- the indoor unit 51 includes an indoor unit blower
- the outdoor unit 52 includes an outdoor unit blower
- the indoor unit blower and the outdoor unit blower are driving sources in the second embodiment. Provided with the electric motor described above.
- the electric motor of the second embodiment By applying the electric motor of the second embodiment to the indoor unit blower and the outdoor unit blower of the present embodiment, it is possible to prevent failure of the electric motor and prevent a decrease in reliability. Failure of the blower for the outdoor unit can be prevented, and deterioration of reliability can be prevented.
- the electric motor described in the second embodiment is not limited to the blower for indoor units and the blower for outdoor units, and may be mounted on a ventilation fan, a household appliance, or a machine tool.
- the electric motor of Form 2 it is possible to prevent the failure of the motor and prevent the deterioration of the reliability, to prevent the failure of the ventilation fan, the home appliance, the machine tool, and to prevent the deterioration of the reliability. it can.
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- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
図1,2は、本発明にかかる配線板の実施の形態1の構成を示す図である。図1には、部品が実装された側の面、すなわち配線板10の表面が示され、図2には、部品が実装されていない側の面、すなわち配線板10の裏面が示されている。
実施の形態1にて説明した配線板の一適用例は、電動機に内蔵される配線板である。図16は、本実施の形態にかかる電動機の構成を示す断面図である。図16に示す電動機は、配線板10と、回転軸30と、出力側軸受31と、反出力側軸受32と、回転子センサマグネット33と、回転子34、回転子マグネット35と、巻線端子36と、インシュレータ37と、固定子鉄心38と、巻線39と、ブラケット40と、モールド樹脂41と、モールド固定子42とを備えるブラシレスDCモータである。
実施の形態2にて説明した電動機は、様々な電気機器に適用することができ、このような電気機器には、空気調和機を例示することができる。図18は、本発明にかかる電気機器の一例である空気調和機の構成を示す外観図である。図18に示す空気調和機50は、室内機51と、室外機52と、ファン53とを備える。室外機52は室内機51に接続されている。なお、図示していないが、室内機51は室内機用送風機を備え、室外機52は室外機用送風機を備え、室内機用送風機及び室外機用送風機は、駆動源である実施の形態2にて説明した電動機を備える。
Claims (11)
- 複数のピンを有する電子部品が実装される配線板であって、
ベース基板と、
前記ベース基板上に設けられた複数の配線と、
前記複数の配線を覆うレジストと、
前記複数の配線に接続され、前記レジストの開口部において全面が露出され、前記複数のピンがリフローにより半田付けされた複数のフットプリントと、を備え、
前記レジストの前記開口部において、前記ピンの引き出し方向は前記配線の引き出し方向と平行である配線板。 - 前記配線の引き出し方向は、前記ピンの引き出し方向と同一方向である請求項1に記載の配線板。
- 前記配線は、前記フットプリントの両側に引き出されている請求項1に記載の配線板。
- 前記ピンの引き出し方向は、前記配線板の原点から前記電子部品への径方向に対して45度以下である請求項1から請求項3のいずれか一項に記載の配線板。
- 前記ピンの引き出し方向は、前記配線板の原点から前記電子部品への径方向に平行である請求項1から請求項3のいずれか一項に記載の配線板。
- 前記半田付けのフィレットが、前記開口部により露出された配線上にも形成された請求項1から請求項5のいずれか一項に記載の配線板。
- 前記電子部品の本体側において前記開口部により露出された前記フットプリント及び前記配線の前記径方向の長さは、前記フットプリントの表面から前記ピンの底面までの高さであるピン浮き高さと、前記フットプリントの表面から、前記電子部品の本体から引き出されて屈曲していない部分における前記ピンの裏面までの高さであるピンボディ側高さとの合計以上である請求項1から請求項6のいずれか一項に記載の配線板。
- 請求項1から請求項7のいずれか一項に記載の配線板を備え、
前記配線板の原点が回転軸である電動機。 - 固定子と前記配線板が、樹脂によって一体成型されている請求項8に記載の電動機。
- 請求項8又は請求項9に記載の電動機を備える電気機器。
- 請求項10に記載の電気機器である空気調和機。
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PCT/JP2014/078197 WO2016063396A1 (ja) | 2014-10-23 | 2014-10-23 | 配線板、電動機、電気機器及び空気調和機 |
US15/507,301 US10601285B2 (en) | 2014-10-23 | 2014-10-23 | Wiring board, electric motor, electric apparatus, and air conditioner |
JP2016555019A JPWO2016063396A1 (ja) | 2014-10-23 | 2014-10-23 | 配線板、電動機、電気機器及び空気調和機 |
CN201480082834.XA CN107079586B (zh) | 2014-10-23 | 2014-10-23 | 配线板、电动机、电气设备以及空气调节机 |
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JP6414224B2 (ja) * | 2014-08-29 | 2018-10-31 | 工機ホールディングス株式会社 | 電動作業機 |
KR102215005B1 (ko) * | 2016-08-11 | 2021-02-10 | 한온시스템 주식회사 | Bldc 모터 |
FR3087597B1 (fr) * | 2018-10-23 | 2021-02-26 | Safran Electronics & Defense | Machine electrique avec concentration de flux magnetique |
JP7225700B2 (ja) * | 2018-11-07 | 2023-02-21 | 日本電産株式会社 | モータ及び送風機 |
KR20210062788A (ko) * | 2019-11-21 | 2021-06-01 | 엘지이노텍 주식회사 | 펌프 |
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US10601285B2 (en) | 2020-03-24 |
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