KR960007083A - 엑시머 레이저빔 조사장치 - Google Patents

엑시머 레이저빔 조사장치 Download PDF

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Publication number
KR960007083A
KR960007083A KR1019950027280A KR19950027280A KR960007083A KR 960007083 A KR960007083 A KR 960007083A KR 1019950027280 A KR1019950027280 A KR 1019950027280A KR 19950027280 A KR19950027280 A KR 19950027280A KR 960007083 A KR960007083 A KR 960007083A
Authority
KR
South Korea
Prior art keywords
excimer laser
workpiece
laser beam
mask
irradiation apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
KR1019950027280A
Other languages
English (en)
Korean (ko)
Inventor
가스유기 무나가미
하지메 나가다니
아쓰시 스기다쓰
다다오 미나가와
도시노리 야기
게이고 이도
Original Assignee
기타오카 다카시
미쓰비시덴키가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 기타오카 다카시, 미쓰비시덴키가부시키가이샤 filed Critical 기타오카 다카시
Publication of KR960007083A publication Critical patent/KR960007083A/ko
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1019950027280A 1994-08-30 1995-08-29 엑시머 레이저빔 조사장치 Abandoned KR960007083A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6204972A JPH0866781A (ja) 1994-08-30 1994-08-30 エキシマレーザビーム照射装置
JP94-204972 1994-08-30

Publications (1)

Publication Number Publication Date
KR960007083A true KR960007083A (ko) 1996-03-22

Family

ID=16499350

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950027280A Abandoned KR960007083A (ko) 1994-08-30 1995-08-29 엑시머 레이저빔 조사장치

Country Status (7)

Country Link
US (1) US5661744A (enExample)
JP (1) JPH0866781A (enExample)
KR (1) KR960007083A (enExample)
CN (1) CN1122737A (enExample)
CA (1) CA2156200C (enExample)
DE (1) DE19531050C2 (enExample)
TW (1) TW277012B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100273717B1 (ko) * 1998-04-09 2000-12-15 황해웅 레이저빔을 이용한 엔코더의 제조방법
KR100355417B1 (ko) * 2000-04-25 2002-10-11 안지양 레이저와 레이저마스크에 의한 회로기판의 회로 형성방법
KR20210034857A (ko) * 2019-09-23 2021-03-31 (주)엔피에스 널링 가공 장치

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2724993B2 (ja) * 1995-08-31 1998-03-09 株式会社小松製作所 レーザ加工装置およびレーザ装置
JP3815578B2 (ja) * 1996-07-19 2006-08-30 忠弘 大見 エキシマレーザー発振装置
US8182473B2 (en) 1999-01-08 2012-05-22 Palomar Medical Technologies Cooling system for a photocosmetic device
US6517532B1 (en) 1997-05-15 2003-02-11 Palomar Medical Technologies, Inc. Light energy delivery head
US20080294152A1 (en) * 1996-12-02 2008-11-27 Palomar Medical Technologies, Inc. Cooling System For A Photocosmetic Device
DK0991372T3 (da) 1997-05-15 2004-12-06 Palomar Medical Tech Inc Apparat til dermatologisk behandling
DE19730028C2 (de) * 1997-07-14 2002-12-12 Deutsche Telekom Ag Verfahren zum Trennen und Bearbeiten von auf einem Halbleitersubstrat im Verband hergestellten Halbleiterchips aus A III - B V- Verbindungshalbleitern unter Verwendung eines Excimer-Lasers
US6120725A (en) * 1997-07-25 2000-09-19 Matsushita Electric Works, Ltd. Method of forming a complex profile of uneven depressions in the surface of a workpiece by energy beam ablation
US6300594B1 (en) * 1998-02-19 2001-10-09 Ricoh Microelectronics Company, Ltd. Method and apparatus for machining an electrically conductive film
EP1566149A1 (en) 1998-03-12 2005-08-24 Palomar Medical Technologies, Inc. System for electromagnetic radiation of the skin
CN1376100A (zh) * 1999-09-28 2002-10-23 住友重机械工业株式会社 激光钻孔的加工方法及其加工装置
US7636413B2 (en) * 2002-04-16 2009-12-22 General Electric Company Method and apparatus of multi-energy imaging
US6987240B2 (en) * 2002-04-18 2006-01-17 Applied Materials, Inc. Thermal flux processing by scanning
BR0312430A (pt) 2002-06-19 2005-04-26 Palomar Medical Tech Inc Método e aparelho para tratamento de condições cutâneas e subcutâneas
EP1555948A2 (en) 2002-10-23 2005-07-27 Palomar Medical Technologies, Inc. Phototreatment device for use with coolants and topical substances
JP4280509B2 (ja) * 2003-01-31 2009-06-17 キヤノン株式会社 投影露光用マスク、投影露光用マスクの製造方法、投影露光装置および投影露光方法
US7065820B2 (en) * 2003-06-30 2006-06-27 Nike, Inc. Article and method for laser-etching stratified materials
US7424783B2 (en) * 2003-06-30 2008-09-16 Nike, Inc. Article of apparel incorporating a stratified material
JP2005144487A (ja) * 2003-11-13 2005-06-09 Seiko Epson Corp レーザ加工装置及びレーザ加工方法
JP4075893B2 (ja) * 2004-05-21 2008-04-16 セイコーエプソン株式会社 水晶振動子の製造方法、その装置及び水晶振動子
JP4688525B2 (ja) * 2004-09-27 2011-05-25 株式会社 日立ディスプレイズ パターン修正装置および表示装置の製造方法
CN101115527A (zh) * 2004-12-09 2008-01-30 帕洛玛医疗技术公司 具有传热机构的口腔器具
US7856985B2 (en) 2005-04-22 2010-12-28 Cynosure, Inc. Method of treatment body tissue using a non-uniform laser beam
KR100712215B1 (ko) * 2005-08-25 2007-04-27 삼성에스디아이 주식회사 레이저 열전사용 마스크 및 그를 이용한 레이저 열전사방법
US8346347B2 (en) * 2005-09-15 2013-01-01 Palomar Medical Technologies, Inc. Skin optical characterization device
GB2438601B (en) * 2006-05-24 2008-04-09 Exitech Ltd Method and unit for micro-structuring a moving substrate
US7586957B2 (en) 2006-08-02 2009-09-08 Cynosure, Inc Picosecond laser apparatus and methods for its operation and use
JP2008073711A (ja) * 2006-09-20 2008-04-03 Disco Abrasive Syst Ltd ビアホールの加工方法
US8237085B2 (en) * 2006-11-17 2012-08-07 Semiconductor Energy Laboratory Co., Ltd. Beam homogenizer, laser irradiation apparatus, and laser irradiation method
US9919168B2 (en) 2009-07-23 2018-03-20 Palomar Medical Technologies, Inc. Method for improvement of cellulite appearance
CN102626829A (zh) * 2011-08-16 2012-08-08 北京京东方光电科技有限公司 基板的激光修复装置以及激光修复方法
US9780518B2 (en) 2012-04-18 2017-10-03 Cynosure, Inc. Picosecond laser apparatus and methods for treating target tissues with same
WO2014145707A2 (en) 2013-03-15 2014-09-18 Cynosure, Inc. Picosecond optical radiation systems and methods of use
KR102081286B1 (ko) * 2013-04-16 2020-04-16 삼성디스플레이 주식회사 레이저 열전사 장치, 레이저 열전사 방법 및 이를 이용한 유기발광 디스플레이 장치 제조방법
KR101531817B1 (ko) * 2014-07-17 2015-06-25 주식회사 엘아이에스 렌즈 어레이 오차 보상장치
CN106425126B (zh) * 2016-11-11 2017-12-29 盐城工学院 一种多层印刷电路板飞秒激光打孔装置及其打孔方法
KR102627248B1 (ko) 2018-02-26 2024-01-19 싸이노슈어, 엘엘씨 Q-스위치드 캐비티 덤핑 서브 나노초 레이저
CN111438140B (zh) * 2019-12-29 2021-09-07 武汉光谷航天三江激光产业技术研究院有限公司 一种适用于丝材、棒料的激光清洗方法与装置
CN113146042B (zh) * 2021-03-12 2022-10-18 中国工程物理研究院材料研究所 一种能有效减少焊接孔洞的激光焊接B4C/Al的方法
KR20240089635A (ko) * 2021-10-15 2024-06-20 신에츠 엔지니어링 가부시키가이샤 가공 장치, 가공 방법 및 기판의 제조 방법
CN121057635A (zh) * 2023-04-19 2025-12-02 信越工程株式会社 加工装置、加工方法以及基板制造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5942194A (ja) * 1982-09-01 1984-03-08 Mitsubishi Electric Corp レ−ザ穴開け装置
US5223693A (en) * 1990-04-28 1993-06-29 Mitsubishi Denki Kabushiki Kaisha Optical machining apparatus
US5260961A (en) * 1990-11-01 1993-11-09 Florod Corporation Sealed excimer laser with longitudinal discharge and transverse preionization for low-average-power uses
US5310986A (en) * 1992-04-28 1994-05-10 Mitsubishi Denki Kabushiki Kaisha Laser machining apparatus
JP3212405B2 (ja) * 1992-07-20 2001-09-25 富士通株式会社 エキシマレーザ加工方法及び装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100273717B1 (ko) * 1998-04-09 2000-12-15 황해웅 레이저빔을 이용한 엔코더의 제조방법
KR100355417B1 (ko) * 2000-04-25 2002-10-11 안지양 레이저와 레이저마스크에 의한 회로기판의 회로 형성방법
KR20210034857A (ko) * 2019-09-23 2021-03-31 (주)엔피에스 널링 가공 장치

Also Published As

Publication number Publication date
CN1122737A (zh) 1996-05-22
DE19531050C2 (de) 1999-07-22
US5661744A (en) 1997-08-26
DE19531050A1 (de) 1996-03-07
JPH0866781A (ja) 1996-03-12
CA2156200C (en) 1999-01-26
TW277012B (enExample) 1996-06-01

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Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19950829

PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 19950829

Comment text: Request for Examination of Application

PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 19980716

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 19981026

NORF Unpaid initial registration fee
PC1904 Unpaid initial registration fee