TW277012B - - Google Patents
Info
- Publication number
- TW277012B TW277012B TW084108280A TW84108280A TW277012B TW 277012 B TW277012 B TW 277012B TW 084108280 A TW084108280 A TW 084108280A TW 84108280 A TW84108280 A TW 84108280A TW 277012 B TW277012 B TW 277012B
- Authority
- TW
- Taiwan
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6204972A JPH0866781A (ja) | 1994-08-30 | 1994-08-30 | エキシマレーザビーム照射装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW277012B true TW277012B (zh) | 1996-06-01 |
Family
ID=16499350
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW084108280A TW277012B (zh) | 1994-08-30 | 1995-08-09 |
Country Status (7)
Country | Link |
---|---|
US (1) | US5661744A (zh) |
JP (1) | JPH0866781A (zh) |
KR (1) | KR960007083A (zh) |
CN (1) | CN1122737A (zh) |
CA (1) | CA2156200C (zh) |
DE (1) | DE19531050C2 (zh) |
TW (1) | TW277012B (zh) |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2724993B2 (ja) * | 1995-08-31 | 1998-03-09 | 株式会社小松製作所 | レーザ加工装置およびレーザ装置 |
JP3815578B2 (ja) * | 1996-07-19 | 2006-08-30 | 忠弘 大見 | エキシマレーザー発振装置 |
US6517532B1 (en) | 1997-05-15 | 2003-02-11 | Palomar Medical Technologies, Inc. | Light energy delivery head |
US6508813B1 (en) | 1996-12-02 | 2003-01-21 | Palomar Medical Technologies, Inc. | System for electromagnetic radiation dermatology and head for use therewith |
US8182473B2 (en) | 1999-01-08 | 2012-05-22 | Palomar Medical Technologies | Cooling system for a photocosmetic device |
US20080294152A1 (en) * | 1996-12-02 | 2008-11-27 | Palomar Medical Technologies, Inc. | Cooling System For A Photocosmetic Device |
DE69825447T2 (de) | 1997-05-15 | 2005-09-15 | Palomar Medical Technologies, Inc., Burlington | Gerät zur dermatologischen behandlung |
DE19730028C2 (de) * | 1997-07-14 | 2002-12-12 | Deutsche Telekom Ag | Verfahren zum Trennen und Bearbeiten von auf einem Halbleitersubstrat im Verband hergestellten Halbleiterchips aus A III - B V- Verbindungshalbleitern unter Verwendung eines Excimer-Lasers |
US6120725A (en) | 1997-07-25 | 2000-09-19 | Matsushita Electric Works, Ltd. | Method of forming a complex profile of uneven depressions in the surface of a workpiece by energy beam ablation |
US6300594B1 (en) | 1998-02-19 | 2001-10-09 | Ricoh Microelectronics Company, Ltd. | Method and apparatus for machining an electrically conductive film |
KR100273717B1 (ko) * | 1998-04-09 | 2000-12-15 | 황해웅 | 레이저빔을 이용한 엔코더의 제조방법 |
WO2001023131A1 (fr) | 1999-09-28 | 2001-04-05 | Sumitomo Heavy Industries, Ltd. | Procede et dispositif de perçage par laser |
KR100355417B1 (ko) * | 2000-04-25 | 2002-10-11 | 안지양 | 레이저와 레이저마스크에 의한 회로기판의 회로 형성방법 |
US7636413B2 (en) * | 2002-04-16 | 2009-12-22 | General Electric Company | Method and apparatus of multi-energy imaging |
US6987240B2 (en) * | 2002-04-18 | 2006-01-17 | Applied Materials, Inc. | Thermal flux processing by scanning |
EP1539013A4 (en) | 2002-06-19 | 2005-09-21 | Palomar Medical Tech Inc | METHOD AND DEVICE FOR TREATING SKIN AND SUB-TISSUE DISEASES |
CA2501098C (en) * | 2002-10-23 | 2014-04-08 | Palomar Medical Technologies, Inc. | Phototreatment device for use with coolants and topical substances |
JP4280509B2 (ja) * | 2003-01-31 | 2009-06-17 | キヤノン株式会社 | 投影露光用マスク、投影露光用マスクの製造方法、投影露光装置および投影露光方法 |
US7065820B2 (en) * | 2003-06-30 | 2006-06-27 | Nike, Inc. | Article and method for laser-etching stratified materials |
US7424783B2 (en) * | 2003-06-30 | 2008-09-16 | Nike, Inc. | Article of apparel incorporating a stratified material |
JP2005144487A (ja) * | 2003-11-13 | 2005-06-09 | Seiko Epson Corp | レーザ加工装置及びレーザ加工方法 |
JP4075893B2 (ja) * | 2004-05-21 | 2008-04-16 | セイコーエプソン株式会社 | 水晶振動子の製造方法、その装置及び水晶振動子 |
JP4688525B2 (ja) * | 2004-09-27 | 2011-05-25 | 株式会社 日立ディスプレイズ | パターン修正装置および表示装置の製造方法 |
EP1819399A1 (en) * | 2004-12-09 | 2007-08-22 | Palomar Medical Technologies, Inc. | Oral appliance with heat transfer mechanism |
US7856985B2 (en) | 2005-04-22 | 2010-12-28 | Cynosure, Inc. | Method of treatment body tissue using a non-uniform laser beam |
KR100712215B1 (ko) * | 2005-08-25 | 2007-04-27 | 삼성에스디아이 주식회사 | 레이저 열전사용 마스크 및 그를 이용한 레이저 열전사방법 |
US8346347B2 (en) * | 2005-09-15 | 2013-01-01 | Palomar Medical Technologies, Inc. | Skin optical characterization device |
GB2438601B (en) * | 2006-05-24 | 2008-04-09 | Exitech Ltd | Method and unit for micro-structuring a moving substrate |
US7586957B2 (en) | 2006-08-02 | 2009-09-08 | Cynosure, Inc | Picosecond laser apparatus and methods for its operation and use |
JP2008073711A (ja) * | 2006-09-20 | 2008-04-03 | Disco Abrasive Syst Ltd | ビアホールの加工方法 |
US8237085B2 (en) * | 2006-11-17 | 2012-08-07 | Semiconductor Energy Laboratory Co., Ltd. | Beam homogenizer, laser irradiation apparatus, and laser irradiation method |
US9919168B2 (en) | 2009-07-23 | 2018-03-20 | Palomar Medical Technologies, Inc. | Method for improvement of cellulite appearance |
CN102626829A (zh) | 2011-08-16 | 2012-08-08 | 北京京东方光电科技有限公司 | 基板的激光修复装置以及激光修复方法 |
KR102136901B1 (ko) | 2012-04-18 | 2020-07-22 | 싸이노슈어, 엘엘씨 | 피코초 레이저 장치 및 그를 사용한 표적 조직의 치료 방법 |
EP3751684A1 (en) | 2013-03-15 | 2020-12-16 | Cynosure, Inc. | Picosecond optical radiation systems and methods of use |
KR102081286B1 (ko) * | 2013-04-16 | 2020-04-16 | 삼성디스플레이 주식회사 | 레이저 열전사 장치, 레이저 열전사 방법 및 이를 이용한 유기발광 디스플레이 장치 제조방법 |
KR101531817B1 (ko) * | 2014-07-17 | 2015-06-25 | 주식회사 엘아이에스 | 렌즈 어레이 오차 보상장치 |
CN106425126B (zh) * | 2016-11-11 | 2017-12-29 | 盐城工学院 | 一种多层印刷电路板飞秒激光打孔装置及其打孔方法 |
US11418000B2 (en) | 2018-02-26 | 2022-08-16 | Cynosure, Llc | Q-switched cavity dumped sub-nanosecond laser |
KR102280424B1 (ko) * | 2019-09-23 | 2021-07-22 | (주)엔피에스 | 널링 가공 장치 |
CN111438140B (zh) * | 2019-12-29 | 2021-09-07 | 武汉光谷航天三江激光产业技术研究院有限公司 | 一种适用于丝材、棒料的激光清洗方法与装置 |
CN113146042B (zh) * | 2021-03-12 | 2022-10-18 | 中国工程物理研究院材料研究所 | 一种能有效减少焊接孔洞的激光焊接B4C/Al的方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5942194A (ja) * | 1982-09-01 | 1984-03-08 | Mitsubishi Electric Corp | レ−ザ穴開け装置 |
US5223693A (en) * | 1990-04-28 | 1993-06-29 | Mitsubishi Denki Kabushiki Kaisha | Optical machining apparatus |
US5260961A (en) * | 1990-11-01 | 1993-11-09 | Florod Corporation | Sealed excimer laser with longitudinal discharge and transverse preionization for low-average-power uses |
US5310986A (en) * | 1992-04-28 | 1994-05-10 | Mitsubishi Denki Kabushiki Kaisha | Laser machining apparatus |
JP3212405B2 (ja) * | 1992-07-20 | 2001-09-25 | 富士通株式会社 | エキシマレーザ加工方法及び装置 |
-
1994
- 1994-08-30 JP JP6204972A patent/JPH0866781A/ja active Pending
-
1995
- 1995-08-08 US US08/512,710 patent/US5661744A/en not_active Expired - Fee Related
- 1995-08-09 TW TW084108280A patent/TW277012B/zh active
- 1995-08-16 CA CA002156200A patent/CA2156200C/en not_active Expired - Fee Related
- 1995-08-23 DE DE19531050A patent/DE19531050C2/de not_active Expired - Fee Related
- 1995-08-29 KR KR1019950027280A patent/KR960007083A/ko active IP Right Grant
- 1995-08-30 CN CN95115859A patent/CN1122737A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
CA2156200C (en) | 1999-01-26 |
KR960007083A (ko) | 1996-03-22 |
JPH0866781A (ja) | 1996-03-12 |
US5661744A (en) | 1997-08-26 |
CN1122737A (zh) | 1996-05-22 |
DE19531050C2 (de) | 1999-07-22 |
DE19531050A1 (de) | 1996-03-07 |