TW277012B - - Google Patents

Info

Publication number
TW277012B
TW277012B TW084108280A TW84108280A TW277012B TW 277012 B TW277012 B TW 277012B TW 084108280 A TW084108280 A TW 084108280A TW 84108280 A TW84108280 A TW 84108280A TW 277012 B TW277012 B TW 277012B
Authority
TW
Taiwan
Application number
TW084108280A
Other languages
Chinese (zh)
Original Assignee
Mitsubishi Electric Machine
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Machine filed Critical Mitsubishi Electric Machine
Application granted granted Critical
Publication of TW277012B publication Critical patent/TW277012B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW084108280A 1994-08-30 1995-08-09 TW277012B (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6204972A JPH0866781A (ja) 1994-08-30 1994-08-30 エキシマレーザビーム照射装置

Publications (1)

Publication Number Publication Date
TW277012B true TW277012B (enExample) 1996-06-01

Family

ID=16499350

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084108280A TW277012B (enExample) 1994-08-30 1995-08-09

Country Status (7)

Country Link
US (1) US5661744A (enExample)
JP (1) JPH0866781A (enExample)
KR (1) KR960007083A (enExample)
CN (1) CN1122737A (enExample)
CA (1) CA2156200C (enExample)
DE (1) DE19531050C2 (enExample)
TW (1) TW277012B (enExample)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2724993B2 (ja) * 1995-08-31 1998-03-09 株式会社小松製作所 レーザ加工装置およびレーザ装置
JP3815578B2 (ja) * 1996-07-19 2006-08-30 忠弘 大見 エキシマレーザー発振装置
US8182473B2 (en) 1999-01-08 2012-05-22 Palomar Medical Technologies Cooling system for a photocosmetic device
US6517532B1 (en) 1997-05-15 2003-02-11 Palomar Medical Technologies, Inc. Light energy delivery head
US20080294152A1 (en) * 1996-12-02 2008-11-27 Palomar Medical Technologies, Inc. Cooling System For A Photocosmetic Device
US6508813B1 (en) 1996-12-02 2003-01-21 Palomar Medical Technologies, Inc. System for electromagnetic radiation dermatology and head for use therewith
AU7568698A (en) 1997-05-15 1998-12-08 General Hospital Corporation, The Method and apparatus for dermatology treatment
DE19730028C2 (de) * 1997-07-14 2002-12-12 Deutsche Telekom Ag Verfahren zum Trennen und Bearbeiten von auf einem Halbleitersubstrat im Verband hergestellten Halbleiterchips aus A III - B V- Verbindungshalbleitern unter Verwendung eines Excimer-Lasers
US6120725A (en) 1997-07-25 2000-09-19 Matsushita Electric Works, Ltd. Method of forming a complex profile of uneven depressions in the surface of a workpiece by energy beam ablation
US6300594B1 (en) 1998-02-19 2001-10-09 Ricoh Microelectronics Company, Ltd. Method and apparatus for machining an electrically conductive film
KR100273717B1 (ko) * 1998-04-09 2000-12-15 황해웅 레이저빔을 이용한 엔코더의 제조방법
US6888096B1 (en) 1999-09-28 2005-05-03 Sumitomo Heavy Industries, Ltd. Laser drilling method and laser drilling device
KR100355417B1 (ko) * 2000-04-25 2002-10-11 안지양 레이저와 레이저마스크에 의한 회로기판의 회로 형성방법
US7636413B2 (en) * 2002-04-16 2009-12-22 General Electric Company Method and apparatus of multi-energy imaging
US6987240B2 (en) * 2002-04-18 2006-01-17 Applied Materials, Inc. Thermal flux processing by scanning
KR20050026404A (ko) 2002-06-19 2005-03-15 팔로마 메디칼 테크놀로지스, 인코포레이티드 깊이로 조직을 광열 치료하기 위한 방법 및 장치
KR20050071618A (ko) 2002-10-23 2005-07-07 팔로마 메디칼 테크놀로지스, 인코포레이티드 냉각제 및 국소용 물질과 함께 사용하기 위한 광처리 장치
JP4280509B2 (ja) * 2003-01-31 2009-06-17 キヤノン株式会社 投影露光用マスク、投影露光用マスクの製造方法、投影露光装置および投影露光方法
US7424783B2 (en) * 2003-06-30 2008-09-16 Nike, Inc. Article of apparel incorporating a stratified material
US7065820B2 (en) * 2003-06-30 2006-06-27 Nike, Inc. Article and method for laser-etching stratified materials
JP2005144487A (ja) * 2003-11-13 2005-06-09 Seiko Epson Corp レーザ加工装置及びレーザ加工方法
JP4075893B2 (ja) * 2004-05-21 2008-04-16 セイコーエプソン株式会社 水晶振動子の製造方法、その装置及び水晶振動子
JP4688525B2 (ja) * 2004-09-27 2011-05-25 株式会社 日立ディスプレイズ パターン修正装置および表示装置の製造方法
JP2008522762A (ja) * 2004-12-09 2008-07-03 パロマー・メデイカル・テクノロジーズ・インコーポレーテツド 熱伝達機構を有する口用器具
US7856985B2 (en) 2005-04-22 2010-12-28 Cynosure, Inc. Method of treatment body tissue using a non-uniform laser beam
KR100712215B1 (ko) * 2005-08-25 2007-04-27 삼성에스디아이 주식회사 레이저 열전사용 마스크 및 그를 이용한 레이저 열전사방법
EP1924196A2 (en) * 2005-09-15 2008-05-28 Palomar Medical Technologies, Inc. Skin optical characterization device
GB2438601B (en) * 2006-05-24 2008-04-09 Exitech Ltd Method and unit for micro-structuring a moving substrate
US7586957B2 (en) 2006-08-02 2009-09-08 Cynosure, Inc Picosecond laser apparatus and methods for its operation and use
JP2008073711A (ja) * 2006-09-20 2008-04-03 Disco Abrasive Syst Ltd ビアホールの加工方法
US8237085B2 (en) * 2006-11-17 2012-08-07 Semiconductor Energy Laboratory Co., Ltd. Beam homogenizer, laser irradiation apparatus, and laser irradiation method
US9919168B2 (en) 2009-07-23 2018-03-20 Palomar Medical Technologies, Inc. Method for improvement of cellulite appearance
CN102626829A (zh) 2011-08-16 2012-08-08 北京京东方光电科技有限公司 基板的激光修复装置以及激光修复方法
KR102136901B1 (ko) 2012-04-18 2020-07-22 싸이노슈어, 엘엘씨 피코초 레이저 장치 및 그를 사용한 표적 조직의 치료 방법
WO2014145707A2 (en) 2013-03-15 2014-09-18 Cynosure, Inc. Picosecond optical radiation systems and methods of use
KR102081286B1 (ko) * 2013-04-16 2020-04-16 삼성디스플레이 주식회사 레이저 열전사 장치, 레이저 열전사 방법 및 이를 이용한 유기발광 디스플레이 장치 제조방법
KR101531817B1 (ko) * 2014-07-17 2015-06-25 주식회사 엘아이에스 렌즈 어레이 오차 보상장치
CN106425126B (zh) * 2016-11-11 2017-12-29 盐城工学院 一种多层印刷电路板飞秒激光打孔装置及其打孔方法
AU2019225242B2 (en) 2018-02-26 2023-08-10 Cynosure, Llc Q-switched cavity dumped sub-nanosecond laser
KR102280424B1 (ko) * 2019-09-23 2021-07-22 (주)엔피에스 널링 가공 장치
CN111438140B (zh) * 2019-12-29 2021-09-07 武汉光谷航天三江激光产业技术研究院有限公司 一种适用于丝材、棒料的激光清洗方法与装置
CN113146042B (zh) * 2021-03-12 2022-10-18 中国工程物理研究院材料研究所 一种能有效减少焊接孔洞的激光焊接B4C/Al的方法
JP7734754B2 (ja) * 2021-10-15 2025-09-05 信越エンジニアリング株式会社 加工装置、加工方法、基板の製造方法、及び半導体パッケージの製造方法
WO2024218894A1 (ja) * 2023-04-19 2024-10-24 信越エンジニアリング株式会社 加工装置、加工方法及び基板の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5942194A (ja) * 1982-09-01 1984-03-08 Mitsubishi Electric Corp レ−ザ穴開け装置
US5223693A (en) * 1990-04-28 1993-06-29 Mitsubishi Denki Kabushiki Kaisha Optical machining apparatus
US5260961A (en) * 1990-11-01 1993-11-09 Florod Corporation Sealed excimer laser with longitudinal discharge and transverse preionization for low-average-power uses
US5310986A (en) * 1992-04-28 1994-05-10 Mitsubishi Denki Kabushiki Kaisha Laser machining apparatus
JP3212405B2 (ja) * 1992-07-20 2001-09-25 富士通株式会社 エキシマレーザ加工方法及び装置

Also Published As

Publication number Publication date
DE19531050C2 (de) 1999-07-22
DE19531050A1 (de) 1996-03-07
CA2156200C (en) 1999-01-26
KR960007083A (ko) 1996-03-22
CN1122737A (zh) 1996-05-22
JPH0866781A (ja) 1996-03-12
US5661744A (en) 1997-08-26

Similar Documents

Publication Publication Date Title
BR9508234A (enExample)
EP0669395A3 (enExample)
EP0671407A3 (enExample)
EP0666470A3 (enExample)
EP0667627A3 (enExample)
BY1704C1 (enExample)
TW274623B (enExample)
ECSMU940030U (enExample)
ECSDI940181S (enExample)
BRPI9401073A2 (enExample)
ECSMU940033U (enExample)
BR7402039U (enExample)
ECSDI940198S (enExample)
ECSDI940192S (enExample)
ECSDI940187S (enExample)
ECSDI940184S (enExample)
ECSDI940182S (enExample)
CU22453A3 (enExample)
CN3028268S (enExample)
EP0666274A3 (enExample)
CN3029313S (enExample)
CN3028681S (enExample)
CN3028493S (enExample)
EP0668111A3 (enExample)
CN3028012S (enExample)