KR960002991B1 - 와이어본딩방법 - Google Patents

와이어본딩방법 Download PDF

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Publication number
KR960002991B1
KR960002991B1 KR1019870009630A KR870009630A KR960002991B1 KR 960002991 B1 KR960002991 B1 KR 960002991B1 KR 1019870009630 A KR1019870009630 A KR 1019870009630A KR 870009630 A KR870009630 A KR 870009630A KR 960002991 B1 KR960002991 B1 KR 960002991B1
Authority
KR
South Korea
Prior art keywords
bonding
coordinate
data
lead
values
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1019870009630A
Other languages
English (en)
Korean (ko)
Other versions
KR880004545A (ko
Inventor
가즈유키 야마나카
미츠사다 시바사카
Original Assignee
가부시키가이샤 도시바
아오이 죠이치
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 도시바, 아오이 죠이치 filed Critical 가부시키가이샤 도시바
Publication of KR880004545A publication Critical patent/KR880004545A/ko
Application granted granted Critical
Publication of KR960002991B1 publication Critical patent/KR960002991B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires

Landscapes

  • Wire Bonding (AREA)
KR1019870009630A 1986-09-02 1987-09-01 와이어본딩방법 Expired - Lifetime KR960002991B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP61206553A JPS6362241A (ja) 1986-09-02 1986-09-02 ワイヤボンデイング方法
JP61-206553 1986-09-02
JP206553 1986-09-02

Publications (2)

Publication Number Publication Date
KR880004545A KR880004545A (ko) 1988-06-07
KR960002991B1 true KR960002991B1 (ko) 1996-03-02

Family

ID=16525294

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870009630A Expired - Lifetime KR960002991B1 (ko) 1986-09-02 1987-09-01 와이어본딩방법

Country Status (5)

Country Link
US (1) US4864514A (enExample)
EP (1) EP0258869B1 (enExample)
JP (1) JPS6362241A (enExample)
KR (1) KR960002991B1 (enExample)
DE (1) DE3789838T2 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2701991B2 (ja) * 1990-12-21 1998-01-21 ローム株式会社 ワイヤボンダ
DE4324870A1 (de) * 1993-07-23 1995-02-09 Weidmueller Interface Einrichtung mit Selbstauskunft und Verfahren zu deren Herstellung
US5465217A (en) * 1993-08-16 1995-11-07 Motorola, Inc. Method for automatic tab artwork building
DE4423007A1 (de) * 1994-06-30 1996-01-11 Siemens Ag Verfahren zur Erzeugung eines Prüfprogrammes
EP0694858A2 (en) * 1994-07-29 1996-01-31 Hewlett-Packard Company Method and apparatus for computer-aided design of different-sized RF modular hybrid circuits
JP3320226B2 (ja) * 1994-11-30 2002-09-03 富士通株式会社 配線ｃａｄ装置
US5608638A (en) * 1995-02-06 1997-03-04 Advanced Micro Devices Device and method for automation of a build sheet to manufacture a packaged integrated circuit
JP3049540B2 (ja) * 1995-12-05 2000-06-05 株式会社新川 被覆ワイヤのワイヤボンディング方法
JP3218382B2 (ja) * 1995-12-05 2001-10-15 株式会社新川 被覆ワイヤのワイヤボンディング方法
US6077757A (en) * 1997-05-15 2000-06-20 Nec Corporation Method of forming chip semiconductor devices
US6256549B1 (en) 1998-05-13 2001-07-03 Cirrus Logic, Inc. Integrated manufacturing solutions
US6357036B1 (en) * 1998-10-02 2002-03-12 Cirrus Logic, Inc. Computerized method and apparatus for designing wire bond diagrams and locating bond pads for a semiconductor device
US6289492B1 (en) * 1998-12-18 2001-09-11 Cognex Corporation Methods and apparatuses for defining a region on an elongated object
DE19935422A1 (de) * 1999-07-28 2001-02-01 Daimler Chrysler Ag Verfahren zur Erzeugung einer Leitungsstruktur mit wenigstens einem Kabelbündel
KR100442697B1 (ko) * 2002-03-11 2004-08-02 삼성전자주식회사 자동 와이어 본딩 공정을 위한 통합 관리 시스템
JP2007209991A (ja) * 2006-02-07 2007-08-23 Toyota Auto Body Co Ltd 溶接打点の管理システム、プログラム、記録媒体
JP5873611B2 (ja) * 2007-03-13 2016-03-01 クリック アンド ソッファ インダストリーズ、インク． ワイヤーボンディング用に目標アイポイントを教示する方法およびそれに関連した半導体処理操作
CN103456650B (zh) * 2007-03-13 2016-08-24 库利克和索夫工业公司 用于丝焊及相关半导体处理操作的眼点训练方法
TW201125091A (en) * 2010-01-15 2011-07-16 de-bao Peng Method for detecting wiring location of wire rack.

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3598978A (en) * 1968-08-21 1971-08-10 Rca Corp Object-positioning system and method
US4253111A (en) * 1978-09-25 1981-02-24 Gca Corporation Apparatus for bonding leads to semiconductor chips
JPS5598842A (en) * 1978-09-28 1980-07-28 Toshiba Corp Position detection system
JPS55165643A (en) * 1979-06-12 1980-12-24 Fujitsu Ltd Device for bonding pellet
JPS56132505A (en) * 1980-03-24 1981-10-16 Hitachi Ltd Position detecting method
DE3175773D1 (en) * 1980-06-10 1987-02-05 Fujitsu Ltd Pattern position recognition apparatus
JPS5958586A (ja) * 1982-09-28 1984-04-04 Toshiba Mach Co Ltd マスクの検査方法および装置
JPS6021535A (ja) * 1983-06-30 1985-02-02 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 半導体装置を相互接続する方法
US4635208A (en) * 1985-01-18 1987-01-06 Hewlett-Packard Company Computer-aided design of systems
US4718019A (en) * 1985-06-28 1988-01-05 Control Data Corporation Election beam exposure system and an apparatus for carrying out a pattern unwinder

Also Published As

Publication number Publication date
US4864514A (en) 1989-09-05
DE3789838T2 (de) 1994-09-22
EP0258869A2 (en) 1988-03-09
EP0258869B1 (en) 1994-05-18
KR880004545A (ko) 1988-06-07
JPS6362241A (ja) 1988-03-18
EP0258869A3 (en) 1989-09-06
DE3789838D1 (de) 1994-06-23
JPH0477462B2 (enExample) 1992-12-08

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