KR950034712A - 경화 플라스틱으로 전자 소자를 싸기 위한 방법, 상기 방법으로 얻어진 플라스틱 싸개를 가지는 전자 소자들 및 상기 방법을 수행하기 위한 모울드 - Google Patents

경화 플라스틱으로 전자 소자를 싸기 위한 방법, 상기 방법으로 얻어진 플라스틱 싸개를 가지는 전자 소자들 및 상기 방법을 수행하기 위한 모울드 Download PDF

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KR950034712A
KR950034712A KR1019950001034A KR19950001034A KR950034712A KR 950034712 A KR950034712 A KR 950034712A KR 1019950001034 A KR1019950001034 A KR 1019950001034A KR 19950001034 A KR19950001034 A KR 19950001034A KR 950034712 A KR950034712 A KR 950034712A
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film
plastic
mold
cavity wall
tracks
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KR1019950001034A
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KR100327500B1 (ko
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요하네스 데오도루스 마리아 파스 이레네우스
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이레네우스 요하네스 데오도루스 미라아 파스
"쓰리피"라이센싱 비. 브이.
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/10—Moulds or cores; Details thereof or accessories therefor with incorporated venting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means
    • B29C45/345—Moulds having venting means using a porous mould wall or a part thereof, e.g. made of sintered metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/462—Injection of preformed charges of material
    • B29C45/463—Injection of preformed charges of material using packaged or wrapped charges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Details Of Resistors (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

본 발명은 경화 플라스틱으로 전자 소자 특히 집적 회로를 싸기 위한 방법에 관한 것으로, 상기 소자는 쪼갤 수 있는 모울드의 공동 내의 위치하고 물질을 상기 공동에 주입하기 전에 상기 공동의 벽으로 부터 분리할 수 있는 필름을 상기 소자와 상기 벽 사이에 위치시키고 상기 소자와 필름 사이의 공간으로 상기 플라스틱을 주입하며, 상기 필름에 보다 상기 소자를 싸는 주입된 아직 따뜻한 플라스틱에 더 잘 부착되어 냉각 후 상기 필름이 상기 모울드로부터 제거될 때 상기 플라스틱 싸개에 부착된 상태로 있는 물질을 상기 소자와 면한 쪽에서 지니는 필름이 사용된다.

Description

경화 플라스틱으로 전자 소자를 싸기 위한 방법, 상기 방법으로 얻어진 플라스틱 싸개를 가지는 전자 소자들 및 상기 방법을 수행하기 위한 모울드
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 방법을 설명하기 위한 본 발명에 따른 모울드를 도시하는 단면도.

Claims (19)

  1. 분할가능한 모울드의 공동 내에 소자가 위치하고 상기 공동의 벽으로 부터 분리가능한 필름이 상기 소자와 모울드 사이에 위치하며 상기 소자와 필름 사이의 공간으로 플라스틱이 주입되는, 경화 플라스틱으로 전자소자, 특히 집적회로를 싸기 위한 방법에 있어서, 상기 필름은, 상기 소자에 면하는 쪽에, 그 필름 자체 보다 잔열이 남아 있는 주입된(상기 소자를 감싸는)플라스틱에 더 잘 부착하는 물질을 가짐으로써, 냉각 후에 상기 필름이 모울드로부터 제거될 때 상기 플라스틱 싸개에 부착된 채로 남아있음을 특징으로 하는 방법.
  2. 제1항에 있어서, 상기 물질은 금속 코팅임을 특징으로 하는 방법.
  3. 제1항에 있어서, 상기 물질은 세라믹 물질임을 특징으로 하는 방법
  4. 제1항에 있어서, 상기 물질은 유리임을 특징으로 하는 방법
  5. 제4항에 있어서, 상기 유리는 광전도 트랙의 형태로 상기 필름에 인가됨을 특징으로 하는 방법.
  6. 제5항에 있어서, 이러한 광전도 트랙들은 빛에 민감한 또는 방사에 민감한 전자 소자들과 결합하거나 상호작용하게 됨을 특징으로 하는 방법.
  7. 제5항에 있어서, 이러한 광전도 트랙들은 빛을 전달하거나 또는 방사를 전달하는 전자소자들과 결합하거나 상호작용하게 됨을 특징으로 하는 방법.
  8. 제1항 내지 7항의 어느 하나 또는 그 이상에 따른 방법에 의해 인가된 코팅이 제공된 플라스틱 싸개를 가지는 소자.
  9. 제8항에 있어서, 상기 코팅은 금속 코팅임을 특징으로 하는 소자.
  10. 제9항에 있어서, 상기 금속 코팅은 개별 트랙의 형태로 인가됨을 특징으로 하는 소자.
  11. 제10항에 있어서, 상기 트랙들은 개별 전자 소자들에 연결됨을 특징으로 하는 방법.
  12. 제8항에 있어서, 상기 코팅은 세라믹 물질임을 특징으로 하는 소자.
  13. 제12항에 있어서, 상기 세라믹 물질은 유리임을 특징으로 하는 소자.
  14. 제13항에 있어서, 상기 유리는 전자 방사-민감 및/또는 방사-전달 소자들과 상호작용하는 트랙의형태임을 특징으로 하는 소자.
  15. 제9항에 있어서, 상기 금속 코팅은 결합할 수 있는 물질임을 특징으로 하는 소자.
  16. 제1항에 있어서, 상기 싸는 공정은 다음과 같이 적어도 두 연속되는 단계를 통해 수행됨을 특징으로 하는 방법; 상기 모울딩 공동 벽이 아직 완전히 그 끝 위치에 닿지 않았으며, 상기 필름이 상기 모울딩 공동벽에 밀봉되도록 안착될 수 있을 정도의 압력에서 상기 플라스틱을 상기 소자와 필름 사이에 주입하는 제1단계, 및 상기 모울드 공동 벽이 끝 위치로 이동하게 또는 연속되는 제2단계.
  17. 제16항에 있어서, 상기 주입 압력은 상기 제2단계를 수행하는 동안 유지됨을 특징으로 하는 방법.
  18. 제16항 내지 17항에 따른 상기 방법을 수행하기 위한 모울드에 있어서, 제1단계로 상기 플라스틱을 채워넣으면서 상기 공동벽을 실질적으로 완전히 그 끝 위치로 이동하고, 연속되는 제2단계에서 그 다음 끝 위치로 이동하는 방법으로 상기 모울딩 공동 벽을 밀폐하는 것을 제어하기 위한 수단을 특징으로 하는 모울드.
  19. 제18항에 있어서, 주입 채널에 있는 차단 요소를 특징으로 하는 모울드.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950001034A 1994-01-27 1995-01-21 경화플라스틱으로전자소자를싸기위한방법,상기방법으로얻어진플라스틱싸개를가지는전자소자들및상기방법을수행하기위한모울드 KR100327500B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NL9400119A NL9400119A (nl) 1994-01-27 1994-01-27 Werkwijze voor het met een hardende kunststof omhullen van een electronische component, electronische componenten met kunststofomhulling verkregen door middel van deze werkwijze en matrijs voor het uitvoeren der werkwijze.
NL9400119 1994-01-27
NL94-119 1994-01-27

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KR1020010009618A Division KR100336873B1 (ko) 1994-01-27 2001-02-26 경화 플라스틱으로 전자 소자를 싸기 위한 방법, 상기방법으로 얻어진 플라스틱 싸개를 가지는 전자 소자들 및상기 방법을 수행하기 위한 모울드

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KR950034712A true KR950034712A (ko) 1995-12-28
KR100327500B1 KR100327500B1 (ko) 2002-08-08

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KR1019950001034A KR100327500B1 (ko) 1994-01-27 1995-01-21 경화플라스틱으로전자소자를싸기위한방법,상기방법으로얻어진플라스틱싸개를가지는전자소자들및상기방법을수행하기위한모울드
KR1020010009618A KR100336873B1 (ko) 1994-01-27 2001-02-26 경화 플라스틱으로 전자 소자를 싸기 위한 방법, 상기방법으로 얻어진 플라스틱 싸개를 가지는 전자 소자들 및상기 방법을 수행하기 위한 모울드

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EP (1) EP0665584B1 (ko)
JP (2) JP3169315B2 (ko)
KR (2) KR100327500B1 (ko)
AT (1) ATE178737T1 (ko)
DE (1) DE69508815T2 (ko)
ES (1) ES2130513T3 (ko)
HK (1) HK1006124A1 (ko)
MY (2) MY118471A (ko)
NL (1) NL9400119A (ko)
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EP0665584B1 (en) 1999-04-07
ES2130513T3 (es) 1999-07-01
EP0665584A1 (en) 1995-08-02
MY118471A (en) 2004-11-30
NL9400119A (nl) 1995-09-01
JP2001260149A (ja) 2001-09-25
RU95101033A (ru) 1996-10-27
JPH07283260A (ja) 1995-10-27
DE69508815D1 (de) 1999-05-12
SG55005A1 (en) 1998-12-21
ATE178737T1 (de) 1999-04-15
RU2139597C1 (ru) 1999-10-10
JP3169315B2 (ja) 2001-05-21
TW257737B (ko) 1995-09-21
HK1006124A1 (en) 1999-02-12
DE69508815T2 (de) 1999-11-11
MY131118A (en) 2007-07-31
KR100327500B1 (ko) 2002-08-08
KR100336873B1 (ko) 2002-05-15

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