ES2130513T3 - Metodo para encapsular un componente electronico con un plastico endurecible. - Google Patents

Metodo para encapsular un componente electronico con un plastico endurecible.

Info

Publication number
ES2130513T3
ES2130513T3 ES95200178T ES95200178T ES2130513T3 ES 2130513 T3 ES2130513 T3 ES 2130513T3 ES 95200178 T ES95200178 T ES 95200178T ES 95200178 T ES95200178 T ES 95200178T ES 2130513 T3 ES2130513 T3 ES 2130513T3
Authority
ES
Spain
Prior art keywords
component
plastic
film
electronic component
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES95200178T
Other languages
English (en)
Inventor
Ireneus Johannes Theodorus Pas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3P Licensing BV
Original Assignee
3P Licensing BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3P Licensing BV filed Critical 3P Licensing BV
Application granted granted Critical
Publication of ES2130513T3 publication Critical patent/ES2130513T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/10—Moulds or cores; Details thereof or accessories therefor with incorporated venting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means
    • B29C45/345—Moulds having venting means using a porous mould wall or a part thereof, e.g. made of sintered metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/462—Injection of preformed charges of material
    • B29C45/463—Injection of preformed charges of material using packaged or wrapped charges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Details Of Resistors (AREA)
  • Packaging Frangible Articles (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)

Abstract

EN LA INVENCION SE PRESENTA UN METODO PARA ENCAPSULAR UN COMPONENTE ELECTRONICO (1), EN PARTICULAR UN CIRCUITO INTEGRADO, CON UN PLASTICO DE ENDURECIMIENTO (20), SEGUN EL CUAL EL COMPONENTE (1) SE COLOCA EN LA CAVIDAD (7) DE UN MOLDE SEPARABLE (5) Y ANTES DE LA INYECCION DE UN MATERIAL EN DICHA CAVIDAD SE COLOCA UNA PELICULA (10) QUE SE PUEDA RETIRAR DE LAS PAREDES DE LA CAVIDAD ENTRE EL COMPONENTE (1) Y DICHAS PAREDES, Y EL PLASTICO (20) SE INYECTA EN EL ESPACIO (7) QUE QUEDA ENTRE EL COMPONENTE (1) Y LA PELICULA (10), EN DONDE SE UTILIZA UNA PELICULA (10) QUE TIENE EN EL LADO QUE MIRA HACIA EL COMPONENTE (1) UN MATERIAL QUE SE ADHIERE MEJOR AL PLASTICO INYECTADO TODAVIA CALIENTE (20) QUE RODEA AL COMPONENTE (1) QUE A LA PELICULA (10), Y POR TANTO PERMANECE ADHERIDA A LA CUBIERTA DE PLASTICO (20) CUANDO ESTA SE RETIRA DEL MOLDE (5) TRAS LA REFRIGERACION.
ES95200178T 1994-01-27 1995-01-25 Metodo para encapsular un componente electronico con un plastico endurecible. Expired - Lifetime ES2130513T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL9400119A NL9400119A (nl) 1994-01-27 1994-01-27 Werkwijze voor het met een hardende kunststof omhullen van een electronische component, electronische componenten met kunststofomhulling verkregen door middel van deze werkwijze en matrijs voor het uitvoeren der werkwijze.

Publications (1)

Publication Number Publication Date
ES2130513T3 true ES2130513T3 (es) 1999-07-01

Family

ID=19863746

Family Applications (1)

Application Number Title Priority Date Filing Date
ES95200178T Expired - Lifetime ES2130513T3 (es) 1994-01-27 1995-01-25 Metodo para encapsular un componente electronico con un plastico endurecible.

Country Status (12)

Country Link
EP (1) EP0665584B1 (es)
JP (2) JP3169315B2 (es)
KR (2) KR100327500B1 (es)
AT (1) ATE178737T1 (es)
DE (1) DE69508815T2 (es)
ES (1) ES2130513T3 (es)
HK (1) HK1006124A1 (es)
MY (2) MY131118A (es)
NL (1) NL9400119A (es)
RU (1) RU2139597C1 (es)
SG (1) SG55005A1 (es)
TW (1) TW257737B (es)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW302527B (es) * 1994-11-17 1997-04-11 Hitachi Ltd
EP0730937B1 (en) * 1994-11-21 1998-02-18 Apic Yamada Corporation A resin molding machine with release film
MY114536A (en) * 1994-11-24 2002-11-30 Apic Yamada Corp A resin molding machine and a method of resin molding
JP3246848B2 (ja) * 1995-02-22 2002-01-15 アピックヤマダ株式会社 汎用ゲート位置樹脂モールド装置および樹脂モールド方法
US5949132A (en) * 1995-05-02 1999-09-07 Texas Instruments Incorporated Dambarless leadframe for molded component encapsulation
NL1000777C2 (nl) * 1995-07-11 1997-01-14 3P Licensing Bv Werkwijze voor het inkapselen van een elektronische component, elektronische component geschikt te worden toegepast bij het uitvoeren van deze werkwijze en ingekapselde component verkregen onder toepassing der werkwijze.
EP0759349B1 (en) * 1995-08-23 2002-06-05 Apic Yamada Corporation Automatic molding machine using release film
SG50009A1 (en) * 1996-03-14 1998-06-15 Towa Corp Method of sealing electronic component with molded resin
US6881611B1 (en) 1996-07-12 2005-04-19 Fujitsu Limited Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device
US6048483A (en) 1996-07-23 2000-04-11 Apic Yamada Corporation Resin sealing method for chip-size packages
JP3282988B2 (ja) * 1997-05-01 2002-05-20 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置
JP3017470B2 (ja) 1997-07-11 2000-03-06 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置
JP3017485B2 (ja) 1998-01-23 2000-03-06 アピックヤマダ株式会社 半導体装置の樹脂封止方法及び樹脂封止装置
US6344162B1 (en) 1998-07-10 2002-02-05 Apic Yamada Corporation Method of manufacturing semiconductor devices and resin molding machine
NL1011392C2 (nl) * 1999-02-25 2000-08-28 3P Licensing Bv Inrichting voor het omhullen van elektronische componenten en daarvoor bestemde matrijs.
JP3581814B2 (ja) * 2000-01-19 2004-10-27 Ｔｏｗａ株式会社 樹脂封止方法及び樹脂封止装置
DE10108253C1 (de) * 2001-02-21 2002-07-11 Bayern Chemie Gmbh Flugchemie Verfahren zur Herstellung von aus fliessfähigem Material bestehenden Gegenständen
US6567630B1 (en) 2002-02-01 2003-05-20 Toshiba Tec Kabushiki Kaisha Image forming device
BE1014855A5 (nl) * 2002-05-30 2004-05-04 Sol Spa Het vormgeven in een omhulling.
JP4540415B2 (ja) * 2004-07-16 2010-09-08 パナソニック株式会社 音響整合部材の製造方法
US20090035501A1 (en) * 2005-12-29 2009-02-05 Neil Edwin Wallace Composite product
TWI515842B (zh) * 2008-11-17 2016-01-01 先進封裝技術私人有限公司 半導體晶片封裝系統
HUE039327T2 (hu) 2008-12-18 2018-12-28 Novartis Ag Szerszám és eljárás szemészeti lencsék gyártására
JP5119221B2 (ja) * 2009-08-31 2013-01-16 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
KR101101669B1 (ko) * 2009-12-01 2011-12-30 삼성전기주식회사 전자부품 제조장치 및 전자부품 제조방법
NL2007614C2 (nl) * 2011-10-18 2013-04-22 Fico Bv Werkwijze en inrichting voor het met behulp van een reductie-materiaal dat een faseovergang ondergaat omhullen van elektronische componenten.
US9700222B2 (en) 2011-12-02 2017-07-11 Lumiradx Uk Ltd Health-monitor patch
US9734304B2 (en) 2011-12-02 2017-08-15 Lumiradx Uk Ltd Versatile sensors with data fusion functionality
DE102012109144A1 (de) * 2012-09-27 2014-04-17 Osram Opto Semiconductors Gmbh Bauteilanordnung und Verfahren zum Herstellen von optischen Bauteilen
CN103465419A (zh) * 2013-09-16 2013-12-25 铜陵荣鑫机械有限公司 大功率led球形封装成型机
NL2011512C2 (en) * 2013-09-26 2015-03-30 Besi Netherlands B V Method for moulding and surface processing electronic components and electronic component produced with this method.
EP3511147B1 (en) * 2014-09-29 2020-11-11 Nichia Corporation Method for manufacturing package, method for manufacturing light emitting device, package and light emitting device
US11292166B2 (en) 2017-04-07 2022-04-05 Tactotek Oy Method for manufacturing an electronic assembly and an electronic assembly
EP4234217A3 (en) * 2017-11-20 2023-10-25 Coexpair S.A. Resin supply system for resin-transfer-molding (rtm), and related method
US11318642B2 (en) 2019-12-20 2022-05-03 Eaton Intelligent Power Limited Permeable wall encapsulation mold
CN117719137B (zh) * 2024-02-06 2024-05-03 河南君源塑业有限公司 聚氯乙烯板材加工用挤压成型装置及其成型工艺

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3754070A (en) * 1970-08-03 1973-08-21 Motorola Inc Flash free molding
JPS63250846A (ja) * 1987-04-08 1988-10-18 Hitachi Ltd 面付実装用ｌｓｉプラスチツクパツケ−ジとその製造方法
JPS6444056A (en) * 1987-08-11 1989-02-16 Nec Corp Hybrid integrated circuit
JPS6444026A (en) * 1987-08-11 1989-02-16 Michio Osada Resin-seal formation of component to be sealed and heat resistant sheet member used therefor
KR900702481A (ko) * 1988-06-21 1990-12-07 원본미기재 휴대용 전자 토큰 제조방법
SE466051B (sv) * 1990-01-11 1991-12-09 Swerad Heat Radiating Concrete Gjutform foer gjutning av ett haerdbart material
JPH03234605A (ja) * 1990-02-13 1991-10-18 Toshiba Corp レジン成形装置

Also Published As

Publication number Publication date
NL9400119A (nl) 1995-09-01
JPH07283260A (ja) 1995-10-27
ATE178737T1 (de) 1999-04-15
RU95101033A (ru) 1996-10-27
HK1006124A1 (en) 1999-02-12
TW257737B (es) 1995-09-21
KR100336873B1 (ko) 2002-05-15
KR100327500B1 (ko) 2002-08-08
JP2001260149A (ja) 2001-09-25
EP0665584A1 (en) 1995-08-02
KR950034712A (ko) 1995-12-28
RU2139597C1 (ru) 1999-10-10
DE69508815T2 (de) 1999-11-11
MY131118A (en) 2007-07-31
SG55005A1 (en) 1998-12-21
JP3169315B2 (ja) 2001-05-21
MY118471A (en) 2004-11-30
EP0665584B1 (en) 1999-04-07
DE69508815D1 (de) 1999-05-12

Similar Documents

Publication Publication Date Title
ES2130513T3 (es) Metodo para encapsular un componente electronico con un plastico endurecible.
KR970702781A (ko) 수지의 비수지 유체 보조 사출 성형 방법(Method for the Non-Resin Fluid-Assisted Injection Molding of a Resin)
DE69805957D1 (de) Spritzgiessen von mikrozelligem material
ATE191627T1 (de) Künstlicher zahn
MY114403A (en) A resin molding machine with release film
DE69412654D1 (de) Form zum Spritzgiessen von thermoplastischem Kunststoff
EP0800906A4 (en) DOOR TYPE INJECTION MOLDING METHOD WITH VALVE AND APPARATUS THEREFOR
SG47992A1 (en) Method of sealing electronic parts with molded resin and mold employed thereof
GB0024070D0 (en) Mpulding apparatus and method
CA2195458A1 (en) Method and apparatus for manufacturing an injection-molded article with outer film secured thereto
ES266419Y (es) Dispositivo de moldeo y acoplamiento de piezas de material plastico
DE60304105D1 (de) Transponder in Kunststofftragebehälter
ATE160722T1 (de) Verfahren zur herstellung eines länglichen gegenstandes und spritzgiessvorrichtung zu dessen herstellung
FR2829058B1 (fr) Procede et dispositif d'injection d'une matiere thermoplastique dans une empreinte d'un moule
KR970702780A (ko) 성형방법 및 이형제용 희석제(molding method and diluent for mold release agent)
ATE69908T1 (de) Elektrisches bauelement in chip-bauweise und verfahren zu seiner herstellung.
JPS59150716A (ja) 熱硬化性樹脂の成形方法
KR980001238U (ko) 3단 사출금형의 스프루 코어장치
KR940024445U (ko) 사출성형금형의 언더컷 처리장치
KR960020688U (ko) 사출성형금형의 리턴핀 고정장치
KR950017256U (ko) 사출금형의 캐비티 붙음 방지용 이젝트 장치
KR940008851A (ko) 사출성형용 실리콘 러버제 형틀
KR950005912U (ko) 사출 성형금형의 언더컷 취출장치
KR950000772U (ko) 사출성형금형의 냉각회로 구조
KR950000748U (ko) 사출 성형금형의 언더컷 처리장치

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 665584

Country of ref document: ES