KR950000205B1 - 리이드 프레임 및 이를 사용한 반도체 장치 - Google Patents

리이드 프레임 및 이를 사용한 반도체 장치 Download PDF

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Publication number
KR950000205B1
KR950000205B1 KR1019860007396A KR860007396A KR950000205B1 KR 950000205 B1 KR950000205 B1 KR 950000205B1 KR 1019860007396 A KR1019860007396 A KR 1019860007396A KR 860007396 A KR860007396 A KR 860007396A KR 950000205 B1 KR950000205 B1 KR 950000205B1
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KR
South Korea
Prior art keywords
lead
tab
integrated circuit
semiconductor integrated
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019860007396A
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English (en)
Korean (ko)
Other versions
KR870004509A (ko
Inventor
야스히사 하기와라
마사지가 마스다
Original Assignee
가부시기가이샤 히다찌세이사꾸쇼
미다 가쓰시게
히다찌 마이크로컴퓨터엔지니어링 가부시기가이샤
가모시다 겐이찌
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Filing date
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Application filed by 가부시기가이샤 히다찌세이사꾸쇼, 미다 가쓰시게, 히다찌 마이크로컴퓨터엔지니어링 가부시기가이샤, 가모시다 겐이찌 filed Critical 가부시기가이샤 히다찌세이사꾸쇼
Publication of KR870004509A publication Critical patent/KR870004509A/ko
Application granted granted Critical
Publication of KR950000205B1 publication Critical patent/KR950000205B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/041—Connecting or disconnecting interconnections to or from leadframes, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
KR1019860007396A 1985-10-07 1986-09-04 리이드 프레임 및 이를 사용한 반도체 장치 Expired - Fee Related KR950000205B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60-221832 1985-10-07
JP60221832A JPS6281738A (ja) 1985-10-07 1985-10-07 リ−ドフレ−ムおよびそれを用いた半導体装置

Publications (2)

Publication Number Publication Date
KR870004509A KR870004509A (ko) 1987-05-11
KR950000205B1 true KR950000205B1 (ko) 1995-01-11

Family

ID=16772889

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860007396A Expired - Fee Related KR950000205B1 (ko) 1985-10-07 1986-09-04 리이드 프레임 및 이를 사용한 반도체 장치

Country Status (3)

Country Link
US (1) US4951120A (enExample)
JP (1) JPS6281738A (enExample)
KR (1) KR950000205B1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6281738A (ja) * 1985-10-07 1987-04-15 Hitachi Micro Comput Eng Ltd リ−ドフレ−ムおよびそれを用いた半導体装置
KR100195850B1 (ko) * 1990-03-13 1999-06-15 구라우치 노리타카 광모듈과 그 제조 공정
US5053852A (en) * 1990-07-05 1991-10-01 At&T Bell Laboratories Molded hybrid IC package and lead frame therefore
US5061988A (en) * 1990-07-30 1991-10-29 Mcdonnell Douglas Corporation Integrated circuit chip interconnect
JPH04213867A (ja) * 1990-11-27 1992-08-04 Ibiden Co Ltd 電子部品搭載用基板フレーム
JPH05218233A (ja) * 1992-02-06 1993-08-27 Mitsubishi Electric Corp 半導体装置およびその製造方法
JP2714335B2 (ja) * 1992-12-16 1998-02-16 株式会社東芝 半導体装置
US5322207A (en) * 1993-05-03 1994-06-21 Micron Semiconductor Inc. Method and apparatus for wire bonding semiconductor dice to a leadframe
US5350106A (en) 1993-05-07 1994-09-27 Micron Semiconductor, Inc. Semiconductor wire bonding method
JP2542795B2 (ja) * 1994-09-22 1996-10-09 九州日本電気株式会社 樹脂封止型半導体装置
US5781682A (en) * 1996-02-01 1998-07-14 International Business Machines Corporation Low-cost packaging for parallel optical computer link
US5611478A (en) * 1996-03-11 1997-03-18 National Semiconductor Corporation Lead frame clamp for ultrasonic bonding
JP3638750B2 (ja) * 1997-03-25 2005-04-13 株式会社ルネサステクノロジ 半導体装置
JP2000082717A (ja) * 1998-09-07 2000-03-21 Shinkawa Ltd ワイヤボンディング方法
US6847099B1 (en) * 2003-02-05 2005-01-25 Amkor Technology Inc. Offset etched corner leads for semiconductor package
JP2006210862A (ja) * 2004-12-27 2006-08-10 Toshiba Corp 半導体用リードフレーム、メモリカードおよび半導体装置
US7466516B2 (en) * 2005-01-28 2008-12-16 Hitachi Global Storage Technologies Netherlands B.V. Lead configuration for reduced capacitive interference in a magnetic read/write head

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7018378A (enExample) * 1970-12-17 1972-06-20
JPS5431470U (enExample) * 1977-08-05 1979-03-01
JPS5521128A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame used for semiconductor device and its assembling
JPS5648161A (en) * 1979-09-26 1981-05-01 Nec Kyushu Ltd Lead frame for semiconductor device
JPS5674948A (en) * 1979-11-22 1981-06-20 Hitachi Ltd Lead structure of semiconductor device
JPS56116654A (en) * 1980-02-20 1981-09-12 Nec Corp Manufacturing of lead frame for semiconductor device
JPS5758777U (enExample) * 1980-09-24 1982-04-07
JPS5861654A (ja) * 1981-10-09 1983-04-12 Toshiba Corp 半導体装置
JPS58142554A (ja) * 1982-02-19 1983-08-24 Hitachi Ltd リ−ドフレ−ム
JPS61269345A (ja) * 1985-05-24 1986-11-28 Hitachi Ltd 半導体装置
JP2559364B2 (ja) * 1985-07-12 1996-12-04 株式会社日立製作所 半導体装置用リ−ドフレ−ム
JPS6281738A (ja) * 1985-10-07 1987-04-15 Hitachi Micro Comput Eng Ltd リ−ドフレ−ムおよびそれを用いた半導体装置

Also Published As

Publication number Publication date
KR870004509A (ko) 1987-05-11
JPS6281738A (ja) 1987-04-15
JPH0455341B2 (enExample) 1992-09-03
US4951120A (en) 1990-08-21

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