JPS6281738A - リ−ドフレ−ムおよびそれを用いた半導体装置 - Google Patents

リ−ドフレ−ムおよびそれを用いた半導体装置

Info

Publication number
JPS6281738A
JPS6281738A JP60221832A JP22183285A JPS6281738A JP S6281738 A JPS6281738 A JP S6281738A JP 60221832 A JP60221832 A JP 60221832A JP 22183285 A JP22183285 A JP 22183285A JP S6281738 A JPS6281738 A JP S6281738A
Authority
JP
Japan
Prior art keywords
lead
tab
wire
bonding
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60221832A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0455341B2 (enExample
Inventor
Yasuhisa Hagiwara
靖久 萩原
Masachika Masuda
正親 増田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Microcomputer System Ltd
Hitachi Ltd
Original Assignee
Hitachi Ltd
Hitachi Microcomputer Engineering Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Microcomputer Engineering Ltd filed Critical Hitachi Ltd
Priority to JP60221832A priority Critical patent/JPS6281738A/ja
Priority to KR1019860007396A priority patent/KR950000205B1/ko
Publication of JPS6281738A publication Critical patent/JPS6281738A/ja
Priority to US07/283,842 priority patent/US4951120A/en
Publication of JPH0455341B2 publication Critical patent/JPH0455341B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/041—
    • H10W72/00—
    • H10W70/421—
    • H10W72/01551—
    • H10W72/07141—
    • H10W72/07511—
    • H10W72/07521—
    • H10W72/07554—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5445—
    • H10W72/5449—
    • H10W72/5522—
    • H10W72/59—
    • H10W72/884—
    • H10W72/932—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP60221832A 1985-10-07 1985-10-07 リ−ドフレ−ムおよびそれを用いた半導体装置 Granted JPS6281738A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP60221832A JPS6281738A (ja) 1985-10-07 1985-10-07 リ−ドフレ−ムおよびそれを用いた半導体装置
KR1019860007396A KR950000205B1 (ko) 1985-10-07 1986-09-04 리이드 프레임 및 이를 사용한 반도체 장치
US07/283,842 US4951120A (en) 1985-10-07 1988-12-13 Lead frame and semiconductor device using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60221832A JPS6281738A (ja) 1985-10-07 1985-10-07 リ−ドフレ−ムおよびそれを用いた半導体装置

Publications (2)

Publication Number Publication Date
JPS6281738A true JPS6281738A (ja) 1987-04-15
JPH0455341B2 JPH0455341B2 (enExample) 1992-09-03

Family

ID=16772889

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60221832A Granted JPS6281738A (ja) 1985-10-07 1985-10-07 リ−ドフレ−ムおよびそれを用いた半導体装置

Country Status (3)

Country Link
US (1) US4951120A (enExample)
JP (1) JPS6281738A (enExample)
KR (1) KR950000205B1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4951120A (en) * 1985-10-07 1990-08-21 Hitachi, Ltd. Lead frame and semiconductor device using the same

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69033400T2 (de) * 1990-03-13 2000-05-11 Sumitomo Electric Industries, Ltd. Optisches Modul und Verfahren zu seiner Herstellung
US5053852A (en) * 1990-07-05 1991-10-01 At&T Bell Laboratories Molded hybrid IC package and lead frame therefore
US5061988A (en) * 1990-07-30 1991-10-29 Mcdonnell Douglas Corporation Integrated circuit chip interconnect
JPH04213867A (ja) * 1990-11-27 1992-08-04 Ibiden Co Ltd 電子部品搭載用基板フレーム
JPH05218233A (ja) * 1992-02-06 1993-08-27 Mitsubishi Electric Corp 半導体装置およびその製造方法
JP2714335B2 (ja) * 1992-12-16 1998-02-16 株式会社東芝 半導体装置
US5322207A (en) * 1993-05-03 1994-06-21 Micron Semiconductor Inc. Method and apparatus for wire bonding semiconductor dice to a leadframe
US5350106A (en) * 1993-05-07 1994-09-27 Micron Semiconductor, Inc. Semiconductor wire bonding method
JP2542795B2 (ja) * 1994-09-22 1996-10-09 九州日本電気株式会社 樹脂封止型半導体装置
US5781682A (en) * 1996-02-01 1998-07-14 International Business Machines Corporation Low-cost packaging for parallel optical computer link
US5611478A (en) * 1996-03-11 1997-03-18 National Semiconductor Corporation Lead frame clamp for ultrasonic bonding
JP3638750B2 (ja) * 1997-03-25 2005-04-13 株式会社ルネサステクノロジ 半導体装置
JP2000082717A (ja) * 1998-09-07 2000-03-21 Shinkawa Ltd ワイヤボンディング方法
US6847099B1 (en) * 2003-02-05 2005-01-25 Amkor Technology Inc. Offset etched corner leads for semiconductor package
JP2006210862A (ja) * 2004-12-27 2006-08-10 Toshiba Corp 半導体用リードフレーム、メモリカードおよび半導体装置
US7466516B2 (en) * 2005-01-28 2008-12-16 Hitachi Global Storage Technologies Netherlands B.V. Lead configuration for reduced capacitive interference in a magnetic read/write head

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5431470U (enExample) * 1977-08-05 1979-03-01
JPS5521128A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame used for semiconductor device and its assembling
JPS5648161A (en) * 1979-09-26 1981-05-01 Nec Kyushu Ltd Lead frame for semiconductor device
JPS5674948A (en) * 1979-11-22 1981-06-20 Hitachi Ltd Lead structure of semiconductor device
JPS56116654A (en) * 1980-02-20 1981-09-12 Nec Corp Manufacturing of lead frame for semiconductor device
JPS5758777U (enExample) * 1980-09-24 1982-04-07
JPS5861654A (ja) * 1981-10-09 1983-04-12 Toshiba Corp 半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7018378A (enExample) * 1970-12-17 1972-06-20
JPS58142554A (ja) * 1982-02-19 1983-08-24 Hitachi Ltd リ−ドフレ−ム
JPS61269345A (ja) * 1985-05-24 1986-11-28 Hitachi Ltd 半導体装置
JP2559364B2 (ja) * 1985-07-12 1996-12-04 株式会社日立製作所 半導体装置用リ−ドフレ−ム
JPS6281738A (ja) * 1985-10-07 1987-04-15 Hitachi Micro Comput Eng Ltd リ−ドフレ−ムおよびそれを用いた半導体装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5431470U (enExample) * 1977-08-05 1979-03-01
JPS5521128A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame used for semiconductor device and its assembling
JPS5648161A (en) * 1979-09-26 1981-05-01 Nec Kyushu Ltd Lead frame for semiconductor device
JPS5674948A (en) * 1979-11-22 1981-06-20 Hitachi Ltd Lead structure of semiconductor device
JPS56116654A (en) * 1980-02-20 1981-09-12 Nec Corp Manufacturing of lead frame for semiconductor device
JPS5758777U (enExample) * 1980-09-24 1982-04-07
JPS5861654A (ja) * 1981-10-09 1983-04-12 Toshiba Corp 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4951120A (en) * 1985-10-07 1990-08-21 Hitachi, Ltd. Lead frame and semiconductor device using the same

Also Published As

Publication number Publication date
US4951120A (en) 1990-08-21
KR870004509A (ko) 1987-05-11
JPH0455341B2 (enExample) 1992-09-03
KR950000205B1 (ko) 1995-01-11

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