JPH0525236Y2 - - Google Patents
Info
- Publication number
- JPH0525236Y2 JPH0525236Y2 JP1987079907U JP7990787U JPH0525236Y2 JP H0525236 Y2 JPH0525236 Y2 JP H0525236Y2 JP 1987079907 U JP1987079907 U JP 1987079907U JP 7990787 U JP7990787 U JP 7990787U JP H0525236 Y2 JPH0525236 Y2 JP H0525236Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrode body
- lead wire
- thin
- thin lead
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- H10W72/50—
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- H10W72/01515—
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- H10W72/0711—
-
- H10W72/07141—
-
- H10W72/075—
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- H10W72/07521—
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- H10W72/07551—
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- H10W72/536—
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- H10W72/5363—
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- H10W72/5445—
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- H10W72/5449—
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- H10W72/5475—
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- H10W72/581—
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- H10W72/884—
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- H10W90/736—
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- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987079907U JPH0525236Y2 (enExample) | 1987-05-28 | 1987-05-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987079907U JPH0525236Y2 (enExample) | 1987-05-28 | 1987-05-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63188942U JPS63188942U (enExample) | 1988-12-05 |
| JPH0525236Y2 true JPH0525236Y2 (enExample) | 1993-06-25 |
Family
ID=30930223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987079907U Expired - Lifetime JPH0525236Y2 (enExample) | 1987-05-28 | 1987-05-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0525236Y2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2862108B2 (ja) * | 1992-01-23 | 1999-02-24 | 日立電線株式会社 | 半導体集積回路 |
| JP2817821B2 (ja) * | 1992-01-28 | 1998-10-30 | 日立電線株式会社 | 半導体装置 |
-
1987
- 1987-05-28 JP JP1987079907U patent/JPH0525236Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63188942U (enExample) | 1988-12-05 |
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