KR940022820A - 패키지 성형용 금형 및 그 금형을 이용한 플라스틱 고체촬상소자 패키지 제조방법 및 패키지 - Google Patents

패키지 성형용 금형 및 그 금형을 이용한 플라스틱 고체촬상소자 패키지 제조방법 및 패키지 Download PDF

Info

Publication number
KR940022820A
KR940022820A KR1019930003229A KR930003229A KR940022820A KR 940022820 A KR940022820 A KR 940022820A KR 1019930003229 A KR1019930003229 A KR 1019930003229A KR 930003229 A KR930003229 A KR 930003229A KR 940022820 A KR940022820 A KR 940022820A
Authority
KR
South Korea
Prior art keywords
package
mold
chip
lead frame
semiconductor chip
Prior art date
Application number
KR1019930003229A
Other languages
English (en)
Other versions
KR960009089B1 (ko
Inventor
전흥섭
Original Assignee
문정환
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 문정환, 금성일렉트론 주식회사 filed Critical 문정환
Priority to KR1019930003229A priority Critical patent/KR960009089B1/ko
Priority to JP03354894A priority patent/JP3394313B2/ja
Publication of KR940022820A publication Critical patent/KR940022820A/ko
Priority to US08/624,204 priority patent/US5644169A/en
Application granted granted Critical
Publication of KR960009089B1 publication Critical patent/KR960009089B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Light Receiving Elements (AREA)

Abstract

본 발명은 패키지 성형용 금형 및 그 금형을 이용한 플라스틱 고체촬상소자 패키지 제조방법 및 패키지에 관한 것으로, 리드프레임의 패들 위에 반도체칩을 부착고정하고, 상기 칩과 리드프레임의 인너리드를 금속 와이어로 접속연결하여 전기적인 신호전달체계를 구성한 반조립품 상태의 제품을 상부몰드다이의 캐비티 중간부에 돌출부가 형성된 구조의 금형을 이용하여 트랜스퍼 몰딩함으로써 칩의 수광영역부 상부가 오픈된 패키지 몸체를 형성한 후, 상기 패키지 몸체의 개구부 상단부에 빛투과용 글래스리드를 탑재하여 구성한 것인바, 저가이면서도 성형성이 우수한 플라스틱수지를 이용하여 패키징함으로써 제조원가가 절감되고, 생산성이 향상되며, 또한 패키지 제조공정이 보다 간소화되는 등의 효과가 있다.

Description

패키지 성형용 금형 및 그 금형을 이용한 플라스틱 고체촬상소자 패키지 제조방법 및 패키지
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3도 내지 제5도는 본 발명을 설명하기 위한 도면으로서, 제3도는 본 발명에 의한 플라스틱 고체촬상소자 패키지의 구조를 보인 종단면도이고, 제4도는 본 발명에 의한 플라스틱 고체촬상소자 패키지의 제조 공정도이며, 제5도는 본 발명 플라스틱 고체촬상소자 패키지의 몰딩공정에 사용되는 금형의 구조를 보인 요부 확대 단면도이다.

Claims (6)

  1. 하부몰드다이(21)의 상부에 결합되는 상부몰드다이(22)의 캐비티(22a) 중간부에 몰딩시 반도체칩(11)의 수광영역부(11a) 상부가 오픈되도록 소정형상의 돌출부(23)를 형성하여서 된 패키지 성형용 금형.
  2. 제1항에 있어서, 상기 돌출부(23)의 하면 가장자리에는 반도체칩(11)의 수광영여부(11a)내로 몰드수지가 침입하는 것을 방지하기 위한 수지침투방지턱부(23a)가 형성되고, 이 수지침투방지턱부(23a)와 반도체칩(11)의 접촉면 사이에는 금형의 가압력을 완화시키기 위한 완충부재가 개재됨을 특징으로 하는 패키지 성형용 금형.
  3. 제2항에 있어서, 상기 완충부재는 칩상면의 수지침투방지턱부(23a) 접촉면에 폴리머계열의 수지가 코팅 또는 라미네이션된 것을 특징으로 하는 패키지 성형용 금형.
  4. 소잉공정에 의해 개개로 분리된 칩을 리드프레임의 패들 위에 부착고정하는 다이어태치 공정과, 상기 반도체칩과 리드프레임의 인너리드를 금속와이어로 접속연결하여 전기적인 신호전달체계를 구성하는 와이어 본딩 공정과, 와이어본딩된 칩과 리드프레임의 인너리드를 포함하는 일정면적을 상부몰드다이의 캐비티 중간부에 돌출부가 형성된 구조의 금형을 이용하여 칩의 수광영역부 상부가 오픈되도록 몰드수지로 몰딩하여 개구부를 가지는 패키지 몸체를 형성하는 몰딩공정과, 상기 패키지 몸체의 개구부 상단부에 빛투과용 글래스리드를 탑재하고 밀봉하는 글래스리드실링공정과, 통상적인 플래팅공정 및 트림/포밍공정으로 진행함을 특징으로 하는 플라스틱 고체촬상소자 패키지 제조방법.
  5. 반도체칩(11)과, 상기 반도체칩(11)이 부착고정되는 패들(12a) 및 상기 칩(11)에 연결되는 다수개의 인/아웃리드(12b)(12c)를 가지는 리드프레임(12)과, 상기 칩(11)과 리드프레임(12)의 인너리드(12b)를 전기적으로 접속연결시키기 위한 금속와이어(13)와, 상기 칩(11)과 리드프레임(12)의 인너리드(12b)를 포함하는 일정면적을 에워싸도록 형성되고 중간부에는 칩(11)의 수광영역부(11a) 상부를 노출시키기 위한 개구부(14a)가 구비된 패키지몸체(14)와, 상기 패키지몸체(14)의 개구부(14a) 상단에 탑재된 빛투과용 글래스리드(15)로 구성함을 특징으로 하는 플라스틱 고체촬상소자 패키지.
  6. 제5항에 있어서, 상기 패키지몸체(14)의 개구부(14a) 상단에는 글래스리드 (15)의 탑재를 용이하게 함과 아울러 보다 효과적인 실링을 위한 탄력부(14b)가 형성된 것을 특징으로 하는 플라스틱 고체촬상소자 패키지.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930003229A 1993-03-04 1993-03-04 패키지 성형용 금형 및 그 금형을 이용한 플라스틱 고체촬상소자 패키지 제조방법 및 패키지 KR960009089B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1019930003229A KR960009089B1 (ko) 1993-03-04 1993-03-04 패키지 성형용 금형 및 그 금형을 이용한 플라스틱 고체촬상소자 패키지 제조방법 및 패키지
JP03354894A JP3394313B2 (ja) 1993-03-04 1994-03-03 半導体パッケージの成形用金型を利用した半導体パッケージの製造方法および半導体パッケージ
US08/624,204 US5644169A (en) 1993-03-04 1996-04-03 Mold and method for manufacturing a package for a semiconductor chip and the package manufactured thereby

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019930003229A KR960009089B1 (ko) 1993-03-04 1993-03-04 패키지 성형용 금형 및 그 금형을 이용한 플라스틱 고체촬상소자 패키지 제조방법 및 패키지

Publications (2)

Publication Number Publication Date
KR940022820A true KR940022820A (ko) 1994-10-21
KR960009089B1 KR960009089B1 (ko) 1996-07-10

Family

ID=19351635

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930003229A KR960009089B1 (ko) 1993-03-04 1993-03-04 패키지 성형용 금형 및 그 금형을 이용한 플라스틱 고체촬상소자 패키지 제조방법 및 패키지

Country Status (3)

Country Link
US (1) US5644169A (ko)
JP (1) JP3394313B2 (ko)
KR (1) KR960009089B1 (ko)

Families Citing this family (102)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3577848B2 (ja) * 1996-09-30 2004-10-20 ソニー株式会社 半導体装置の外形カット方法及びそれに用いる半導体製造装置
JP3173586B2 (ja) * 1998-03-26 2001-06-04 日本電気株式会社 全モールド型固体撮像装置およびその製造方法
US7157302B2 (en) * 1998-06-04 2007-01-02 Micron Technology, Inc. Imaging device and method of manufacture
US6143981A (en) 1998-06-24 2000-11-07 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US6274927B1 (en) * 1999-06-03 2001-08-14 Amkor Technology, Inc. Plastic package for an optical integrated circuit device and method of making
KR100379089B1 (ko) 1999-10-15 2003-04-08 앰코 테크놀로지 코리아 주식회사 리드프레임 및 이를 이용한 반도체패키지
US6841412B1 (en) * 1999-11-05 2005-01-11 Texas Instruments Incorporated Encapsulation for particle entrapment
US6476478B1 (en) 1999-11-12 2002-11-05 Amkor Technology, Inc. Cavity semiconductor package with exposed leads and die pad
KR100421774B1 (ko) 1999-12-16 2004-03-10 앰코 테크놀로지 코리아 주식회사 반도체패키지 및 그 제조 방법
AT410727B (de) * 2000-03-14 2003-07-25 Austria Mikrosysteme Int Verfahren zum unterbringen von sensoren in einem gehäuse
US7042068B2 (en) 2000-04-27 2006-05-09 Amkor Technology, Inc. Leadframe and semiconductor package made using the leadframe
AU2001283400A1 (en) * 2000-08-17 2002-02-25 Authentec, Inc. Integrated circuit package including opening exposing portion of an ic
AU2001284962A1 (en) * 2000-08-17 2002-02-25 Authentec, Inc. Methods and apparatus for making integrated circuit package including opening exposing portion of the ic
EP1211721A1 (en) * 2000-11-30 2002-06-05 STMicroelectronics S.r.l. Improved electronic device package and corresponding manufacturing method
US20020079572A1 (en) 2000-12-22 2002-06-27 Khan Reza-Ur Rahman Enhanced die-up ball grid array and method for making the same
US6828663B2 (en) * 2001-03-07 2004-12-07 Teledyne Technologies Incorporated Method of packaging a device with a lead frame, and an apparatus formed therefrom
US6545345B1 (en) 2001-03-20 2003-04-08 Amkor Technology, Inc. Mounting for a package containing a chip
KR100369393B1 (ko) 2001-03-27 2003-02-05 앰코 테크놀로지 코리아 주식회사 리드프레임 및 이를 이용한 반도체패키지와 그 제조 방법
TW486793B (en) * 2001-05-29 2002-05-11 Siliconware Precision Industries Co Ltd Packaging method for preventing a low viscosity encapsulant from flashing
JP2003017715A (ja) * 2001-06-28 2003-01-17 Sony Corp 光検出半導体装置
US6861720B1 (en) 2001-08-29 2005-03-01 Amkor Technology, Inc. Placement template and method for placing optical dies
US6900527B1 (en) 2001-09-19 2005-05-31 Amkor Technology, Inc. Lead-frame method and assembly for interconnecting circuits within a circuit module
US6784534B1 (en) 2002-02-06 2004-08-31 Amkor Technology, Inc. Thin integrated circuit package having an optically transparent window
JP3766034B2 (ja) * 2002-02-20 2006-04-12 富士通株式会社 指紋センサ装置及びその製造方法
US7304362B2 (en) * 2002-05-20 2007-12-04 Stmicroelectronics, Inc. Molded integrated circuit package with exposed active area
US6818973B1 (en) 2002-09-09 2004-11-16 Amkor Technology, Inc. Exposed lead QFP package fabricated through the use of a partial saw process
US6919620B1 (en) 2002-09-17 2005-07-19 Amkor Technology, Inc. Compact flash memory card with clamshell leadframe
US7723210B2 (en) 2002-11-08 2010-05-25 Amkor Technology, Inc. Direct-write wafer level chip scale package
US6905914B1 (en) 2002-11-08 2005-06-14 Amkor Technology, Inc. Wafer level package and fabrication method
US6798047B1 (en) 2002-12-26 2004-09-28 Amkor Technology, Inc. Pre-molded leadframe
US6750545B1 (en) 2003-02-28 2004-06-15 Amkor Technology, Inc. Semiconductor package capable of die stacking
US6927483B1 (en) 2003-03-07 2005-08-09 Amkor Technology, Inc. Semiconductor package exhibiting efficient lead placement
US6794740B1 (en) 2003-03-13 2004-09-21 Amkor Technology, Inc. Leadframe package for semiconductor devices
US7095103B1 (en) 2003-05-01 2006-08-22 Amkor Technology, Inc. Leadframe based memory card
US6879034B1 (en) 2003-05-01 2005-04-12 Amkor Technology, Inc. Semiconductor package including low temperature co-fired ceramic substrate
US7008825B1 (en) 2003-05-27 2006-03-07 Amkor Technology, Inc. Leadframe strip having enhanced testability
US6897550B1 (en) 2003-06-11 2005-05-24 Amkor Technology, Inc. Fully-molded leadframe stand-off feature
US6921967B2 (en) 2003-09-24 2005-07-26 Amkor Technology, Inc. Reinforced die pad support structure
JP2006229108A (ja) * 2005-02-21 2006-08-31 Matsushita Electric Ind Co Ltd 光電変換装置の製造方法および光電変換装置
WO2006101274A1 (en) * 2005-03-25 2006-09-28 Fujifilm Corporation Method of manufacturing solid state imaging device
US7507603B1 (en) 2005-12-02 2009-03-24 Amkor Technology, Inc. Etch singulated semiconductor package
US7572681B1 (en) 2005-12-08 2009-08-11 Amkor Technology, Inc. Embedded electronic component package
JP4794354B2 (ja) * 2006-05-23 2011-10-19 Ｏｋｉセミコンダクタ株式会社 半導体装置の製造方法
US7902660B1 (en) 2006-05-24 2011-03-08 Amkor Technology, Inc. Substrate for semiconductor device and manufacturing method thereof
US7968998B1 (en) 2006-06-21 2011-06-28 Amkor Technology, Inc. Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package
JP2008066696A (ja) 2006-08-10 2008-03-21 Denso Corp 半導体製造装置および半導体製造方法
US7687893B2 (en) 2006-12-27 2010-03-30 Amkor Technology, Inc. Semiconductor package having leadframe with exposed anchor pads
US7829990B1 (en) 2007-01-18 2010-11-09 Amkor Technology, Inc. Stackable semiconductor package including laminate interposer
US7982297B1 (en) 2007-03-06 2011-07-19 Amkor Technology, Inc. Stackable semiconductor package having partially exposed semiconductor die and method of fabricating the same
US7656236B2 (en) 2007-05-15 2010-02-02 Teledyne Wireless, Llc Noise canceling technique for frequency synthesizer
US7977774B2 (en) 2007-07-10 2011-07-12 Amkor Technology, Inc. Fusion quad flat semiconductor package
US7687899B1 (en) 2007-08-07 2010-03-30 Amkor Technology, Inc. Dual laminate package structure with embedded elements
US7777351B1 (en) 2007-10-01 2010-08-17 Amkor Technology, Inc. Thin stacked interposer package
US8089159B1 (en) 2007-10-03 2012-01-03 Amkor Technology, Inc. Semiconductor package with increased I/O density and method of making the same
ITMI20072099A1 (it) * 2007-10-30 2009-04-30 St Microelectronics Srl Metodo di fabbricazione di un dispositivo elettronico comprendente dispositivi mems incapsulati per stampaggio
US7847386B1 (en) 2007-11-05 2010-12-07 Amkor Technology, Inc. Reduced size stacked semiconductor package and method of making the same
US7956453B1 (en) 2008-01-16 2011-06-07 Amkor Technology, Inc. Semiconductor package with patterning layer and method of making same
US7723852B1 (en) 2008-01-21 2010-05-25 Amkor Technology, Inc. Stacked semiconductor package and method of making same
US7875967B2 (en) * 2008-03-10 2011-01-25 Stats Chippac Ltd. Integrated circuit with step molded inner stacking module package in package system
US8067821B1 (en) 2008-04-10 2011-11-29 Amkor Technology, Inc. Flat semiconductor package with half package molding
US7768135B1 (en) 2008-04-17 2010-08-03 Amkor Technology, Inc. Semiconductor package with fast power-up cycle and method of making same
US8179045B2 (en) 2008-04-22 2012-05-15 Teledyne Wireless, Llc Slow wave structure having offset projections comprised of a metal-dielectric composite stack
US7808084B1 (en) 2008-05-06 2010-10-05 Amkor Technology, Inc. Semiconductor package with half-etched locking features
US8125064B1 (en) 2008-07-28 2012-02-28 Amkor Technology, Inc. Increased I/O semiconductor package and method of making same
US8184453B1 (en) 2008-07-31 2012-05-22 Amkor Technology, Inc. Increased capacity semiconductor package
US7847392B1 (en) 2008-09-30 2010-12-07 Amkor Technology, Inc. Semiconductor device including leadframe with increased I/O
US7989933B1 (en) 2008-10-06 2011-08-02 Amkor Technology, Inc. Increased I/O leadframe and semiconductor device including same
US8008758B1 (en) 2008-10-27 2011-08-30 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe
US8089145B1 (en) 2008-11-17 2012-01-03 Amkor Technology, Inc. Semiconductor device including increased capacity leadframe
US8072050B1 (en) 2008-11-18 2011-12-06 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including passive device
US7875963B1 (en) 2008-11-21 2011-01-25 Amkor Technology, Inc. Semiconductor device including leadframe having power bars and increased I/O
US7982298B1 (en) 2008-12-03 2011-07-19 Amkor Technology, Inc. Package in package semiconductor device
US8487420B1 (en) 2008-12-08 2013-07-16 Amkor Technology, Inc. Package in package semiconductor device with film over wire
US20170117214A1 (en) 2009-01-05 2017-04-27 Amkor Technology, Inc. Semiconductor device with through-mold via
US8680656B1 (en) 2009-01-05 2014-03-25 Amkor Technology, Inc. Leadframe structure for concentrated photovoltaic receiver package
US8058715B1 (en) 2009-01-09 2011-11-15 Amkor Technology, Inc. Package in package device for RF transceiver module
US8026589B1 (en) 2009-02-23 2011-09-27 Amkor Technology, Inc. Reduced profile stackable semiconductor package
US7960818B1 (en) 2009-03-04 2011-06-14 Amkor Technology, Inc. Conformal shield on punch QFN semiconductor package
US8575742B1 (en) 2009-04-06 2013-11-05 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including power bars
US8796561B1 (en) 2009-10-05 2014-08-05 Amkor Technology, Inc. Fan out build up substrate stackable package and method
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US9691734B1 (en) 2009-12-07 2017-06-27 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US8324511B1 (en) 2010-04-06 2012-12-04 Amkor Technology, Inc. Through via nub reveal method and structure
US8294276B1 (en) 2010-05-27 2012-10-23 Amkor Technology, Inc. Semiconductor device and fabricating method thereof
US8440554B1 (en) 2010-08-02 2013-05-14 Amkor Technology, Inc. Through via connected backside embedded circuit features structure and method
US8487445B1 (en) 2010-10-05 2013-07-16 Amkor Technology, Inc. Semiconductor device having through electrodes protruding from dielectric layer
US8791501B1 (en) 2010-12-03 2014-07-29 Amkor Technology, Inc. Integrated passive device structure and method
US8390130B1 (en) 2011-01-06 2013-03-05 Amkor Technology, Inc. Through via recessed reveal structure and method
TWI557183B (zh) 2015-12-16 2016-11-11 財團法人工業技術研究院 矽氧烷組成物、以及包含其之光電裝置
US8648450B1 (en) 2011-01-27 2014-02-11 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands
US8552548B1 (en) 2011-11-29 2013-10-08 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
US9704725B1 (en) 2012-03-06 2017-07-11 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
US9129943B1 (en) 2012-03-29 2015-09-08 Amkor Technology, Inc. Embedded component package and fabrication method
US9048298B1 (en) 2012-03-29 2015-06-02 Amkor Technology, Inc. Backside warpage control structure and fabrication method
US8810023B2 (en) * 2012-07-06 2014-08-19 Texas Instruments Incorporated Cantilever packages for sensor MEMS (micro-electro-mechanical system)
US9202660B2 (en) 2013-03-13 2015-12-01 Teledyne Wireless, Llc Asymmetrical slow wave structures to eliminate backward wave oscillations in wideband traveling wave tubes
KR101486790B1 (ko) 2013-05-02 2015-01-28 앰코 테크놀로지 코리아 주식회사 강성보강부를 갖는 마이크로 리드프레임
EP2814064B1 (en) * 2013-06-10 2020-11-25 Nxp B.V. Integrated sensor chip package with directional light sensor, apparatus including such a package and method of manufacturing such an integrated sensor chip package
KR101563911B1 (ko) 2013-10-24 2015-10-28 앰코 테크놀로지 코리아 주식회사 반도체 패키지
US9673122B2 (en) 2014-05-02 2017-06-06 Amkor Technology, Inc. Micro lead frame structure having reinforcing portions and method
JP6840644B2 (ja) * 2017-09-05 2021-03-10 株式会社東芝 半導体装置
CN108582647A (zh) * 2018-04-04 2018-09-28 东莞市中尚电子科技有限公司 一种内包金属丝和线材的软胶耳机头带的制备工艺

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4760440A (en) * 1983-10-31 1988-07-26 General Electric Company Package for solid state image sensors
JPS60239043A (ja) * 1984-05-14 1985-11-27 Oki Electric Ind Co Ltd 半導体装置用パツケ−ジの製造方法
JPS60257546A (ja) * 1984-06-04 1985-12-19 Mitsubishi Electric Corp 半導体装置及びその製造方法
JPH0724287B2 (ja) * 1987-02-12 1995-03-15 三菱電機株式会社 光透過用窓を有する半導体装置とその製造方法
JPH0824155B2 (ja) * 1987-05-06 1996-03-06 富士通株式会社 半導体パッケ−ジ
US5122861A (en) * 1988-11-25 1992-06-16 Fuji Photo Film Co., Ltd. Solid state image pickup device having particular package structure

Also Published As

Publication number Publication date
JP3394313B2 (ja) 2003-04-07
US5644169A (en) 1997-07-01
JPH06318613A (ja) 1994-11-15
KR960009089B1 (ko) 1996-07-10

Similar Documents

Publication Publication Date Title
KR940022820A (ko) 패키지 성형용 금형 및 그 금형을 이용한 플라스틱 고체촬상소자 패키지 제조방법 및 패키지
KR0148733B1 (ko) 고체 촬상 소자용 패키지 및 그 제조방법
KR960009136A (ko) 반도체 패키지 및 그 제조방법
JPH0685222A (ja) 固体撮像装置
KR950009988A (ko) 수지봉지형 반도체장치
KR880011939A (ko) 반도체 레이저의 조립방법
KR910019187A (ko) 반도체 칩 패키징
KR940001333A (ko) 수지봉합형 고체촬상소자 패키지 및 그 제조방법
JPH0469958A (ja) 半導体装置
JP2008140807A (ja) 樹脂封止型半導体装置
JPH0745655A (ja) 半導体素子の封止構造
KR940016718A (ko) 성형 반도체장치 및 성형 반도체장치의 제조방법
JPH01102947A (ja) 樹脂封止型半導体デバイスおよびリードフレーム
US20030234446A1 (en) Flat leadframe for a semiconductor package
KR950006440Y1 (ko) 플라스틱 고체촬상소자 패키지용 글래스리드 구조
KR100692779B1 (ko) 회로기판 일체형 이미지 센서 패키지
KR100201392B1 (ko) 적층형 반도체 패키지 및 그 제조방법
KR0121172Y1 (ko) 플렉시블 리드프레임
KR970018464A (ko) 단차 가공된 다이 패드 부분을 갖는 리드 프레임
KR930007174Y1 (ko) 리드 프레임
JPH0745803A (ja) 固体撮像装置
JPS60170982A (ja) 光半導体装置の製造方法
KR920008359Y1 (ko) 리드프레임
KR200244924Y1 (ko) 반도체패키지
JP2762418B2 (ja) 半導体パッケージ及びその製造方法

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20110627

Year of fee payment: 16

LAPS Lapse due to unpaid annual fee