KR930022483A - 초음파 교반을 이용한 슬러리 폴리셔 - Google Patents

초음파 교반을 이용한 슬러리 폴리셔

Info

Publication number
KR930022483A
KR930022483A KR1019930005069A KR930005069A KR930022483A KR 930022483 A KR930022483 A KR 930022483A KR 1019930005069 A KR1019930005069 A KR 1019930005069A KR 930005069 A KR930005069 A KR 930005069A KR 930022483 A KR930022483 A KR 930022483A
Authority
KR
South Korea
Prior art keywords
pad
slurry
polishing
workpiece
path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019930005069A
Other languages
English (en)
Korean (ko)
Inventor
로리머 밀러 가브리엘
리차드 바그너 에릭
Original Assignee
제프리 디. 그린
아메리칸 텔리폰 앤드 텔레그라프 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 제프리 디. 그린, 아메리칸 텔리폰 앤드 텔레그라프 캄파니 filed Critical 제프리 디. 그린
Publication of KR930022483A publication Critical patent/KR930022483A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
KR1019930005069A 1992-04-02 1993-03-30 초음파 교반을 이용한 슬러리 폴리셔 Withdrawn KR930022483A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US862,044 1992-04-02
US07/862,044 US5245796A (en) 1992-04-02 1992-04-02 Slurry polisher using ultrasonic agitation

Publications (1)

Publication Number Publication Date
KR930022483A true KR930022483A (ko) 1993-11-24

Family

ID=25337489

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930005069A Withdrawn KR930022483A (ko) 1992-04-02 1993-03-30 초음파 교반을 이용한 슬러리 폴리셔

Country Status (8)

Country Link
US (1) US5245796A (enExample)
EP (1) EP0566258B1 (enExample)
JP (1) JP2981079B2 (enExample)
KR (1) KR930022483A (enExample)
DE (1) DE69303109T2 (enExample)
ES (1) ES2088228T3 (enExample)
HK (1) HK180296A (enExample)
TW (1) TW197531B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100302482B1 (ko) * 1998-06-23 2001-11-30 윤종용 반도체씨엠피공정의슬러리공급시스템
KR20030053375A (ko) * 2001-12-22 2003-06-28 동부전자 주식회사 초음파 발생장치를 구비한 패드 컨디셔닝 장치
KR20030096766A (ko) * 2002-06-17 2003-12-31 동부전자 주식회사 메가소닉 트랜스듀서를 이용한 슬러리 안정화 방법

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* Cited by examiner, † Cited by third party
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US5384986A (en) * 1992-09-24 1995-01-31 Ebara Corporation Polishing apparatus
US5340036A (en) * 1993-05-19 1994-08-23 Emerson Electric Co. Dry waste grinder
US5531861A (en) * 1993-09-29 1996-07-02 Motorola, Inc. Chemical-mechanical-polishing pad cleaning process for use during the fabrication of semiconductor devices
US5456627A (en) * 1993-12-20 1995-10-10 Westech Systems, Inc. Conditioner for a polishing pad and method therefor
US5551907A (en) * 1994-03-14 1996-09-03 Hughes Aircraft Company System for ultrasonic lap grinding and polishing
US5562530A (en) * 1994-08-02 1996-10-08 Sematech, Inc. Pulsed-force chemical mechanical polishing
US5783497A (en) * 1994-08-02 1998-07-21 Sematech, Inc. Forced-flow wafer polisher
US5607341A (en) 1994-08-08 1997-03-04 Leach; Michael A. Method and structure for polishing a wafer during manufacture of integrated circuits
US5522965A (en) * 1994-12-12 1996-06-04 Texas Instruments Incorporated Compact system and method for chemical-mechanical polishing utilizing energy coupled to the polishing pad/water interface
US5688364A (en) * 1994-12-22 1997-11-18 Sony Corporation Chemical-mechanical polishing method and apparatus using ultrasound applied to the carrier and platen
US5591068A (en) * 1995-03-13 1997-01-07 Regents Of The University Of California Precision non-contact polishing tool
JP2647050B2 (ja) * 1995-03-31 1997-08-27 日本電気株式会社 ウェハ研磨装置
US5672095A (en) * 1995-09-29 1997-09-30 Intel Corporation Elimination of pad conditioning in a chemical mechanical polishing process
US5709593A (en) * 1995-10-27 1998-01-20 Applied Materials, Inc. Apparatus and method for distribution of slurry in a chemical mechanical polishing system
KR100445139B1 (ko) * 1996-01-23 2004-11-17 가부시키 가이샤 에바라 세이사꾸쇼 폴리싱장치
US5915915A (en) * 1996-03-07 1999-06-29 Komag, Incorporated End effector and method for loading and unloading disks at a processing station
US5954570A (en) * 1996-05-31 1999-09-21 Kabushiki Kaisha Toshiba Conditioner for a polishing tool
US5868608A (en) 1996-08-13 1999-02-09 Lsi Logic Corporation Subsonic to supersonic and ultrasonic conditioning of a polishing pad in a chemical mechanical polishing apparatus
US6245679B1 (en) 1996-08-16 2001-06-12 Rodel Holdings, Inc Apparatus and methods for chemical-mechanical polishing of semiconductor wafers
US6210525B1 (en) 1996-08-16 2001-04-03 Rodel Holdings, Inc. Apparatus and methods for chemical-mechanical polishing of semiconductor wafers
US5932486A (en) * 1996-08-16 1999-08-03 Rodel, Inc. Apparatus and methods for recirculating chemical-mechanical polishing of semiconductor wafers
US6537137B2 (en) 1996-08-16 2003-03-25 Rodel Holdings, Inc Methods for chemical-mechanical polishing of semiconductor wafers
US6769967B1 (en) 1996-10-21 2004-08-03 Micron Technology, Inc. Apparatus and method for refurbishing polishing pads used in chemical-mechanical planarization of semiconductor wafers
US5782675A (en) * 1996-10-21 1998-07-21 Micron Technology, Inc. Apparatus and method for refurbishing fixed-abrasive polishing pads used in chemical-mechanical planarization of semiconductor wafers
KR19980064179A (ko) * 1996-12-19 1998-10-07 윌리엄비.켐플러 웨이퍼 연마 공정시 실리콘 제거율을 안정화하는 방법
JPH10217149A (ja) * 1997-02-05 1998-08-18 Ebara Corp ターンテーブル用クロスの剥離治具
JP3130000B2 (ja) 1997-09-04 2001-01-31 松下電子工業株式会社 半導体ウェハ研磨装置及び研磨方法
US5968841A (en) * 1997-05-06 1999-10-19 International Business Machines Corporation Device and method for preventing settlement of particles on a chemical-mechanical polishing pad
US5967881A (en) * 1997-05-29 1999-10-19 Tucker; Thomas N. Chemical mechanical planarization tool having a linear polishing roller
US6036583A (en) 1997-07-11 2000-03-14 Applied Materials, Inc. Conditioner head in a substrate polisher and method
US5904615A (en) * 1997-07-18 1999-05-18 Hankook Machine Tools Co., Ltd. Pad conditioner for chemical mechanical polishing apparatus
DE19737849A1 (de) * 1997-08-29 1999-03-11 Siemens Ag Vorrichtung und Verfahren zum Beheizen eines flüssigen oder zähflüssigen Poliermittels sowie Vorrichtung zum Polieren von Wafern
US5957754A (en) * 1997-08-29 1999-09-28 Applied Materials, Inc. Cavitational polishing pad conditioner
TW404876B (en) * 1997-09-26 2000-09-11 Siemens Ag Process for chemical-mechanical planarization and equipment for performing said process
US5916010A (en) * 1997-10-30 1999-06-29 International Business Machines Corporation CMP pad maintenance apparatus and method
KR100567982B1 (ko) * 1997-12-08 2006-04-05 가부시키가이샤 에바라 세이사꾸쇼 연마액 공급장치
US6083085A (en) 1997-12-22 2000-07-04 Micron Technology, Inc. Method and apparatus for planarizing microelectronic substrates and conditioning planarizing media
JPH11277434A (ja) * 1998-03-30 1999-10-12 Speedfam Co Ltd Ｃｍｐ装置のスラリリサイクルシステム及びその方法
US6200199B1 (en) 1998-03-31 2001-03-13 Applied Materials, Inc. Chemical mechanical polishing conditioner
US6024829A (en) * 1998-05-21 2000-02-15 Lucent Technologies Inc. Method of reducing agglomerate particles in a polishing slurry
US6106374A (en) * 1998-07-16 2000-08-22 International Business Machines Corporation Acoustically agitated delivery
US6179693B1 (en) * 1998-10-06 2001-01-30 International Business Machines Corporation In-situ/self-propelled polishing pad conditioner and cleaner
US6464571B2 (en) 1998-12-01 2002-10-15 Nutool, Inc. Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein
US6589105B2 (en) 1998-12-01 2003-07-08 Nutool, Inc. Pad tensioning method and system in a bi-directional linear polisher
US6468139B1 (en) 1998-12-01 2002-10-22 Nutool, Inc. Polishing apparatus and method with a refreshing polishing belt and loadable housing
US7425250B2 (en) * 1998-12-01 2008-09-16 Novellus Systems, Inc. Electrochemical mechanical processing apparatus
US6103628A (en) 1998-12-01 2000-08-15 Nutool, Inc. Reverse linear polisher with loadable housing
JP4030247B2 (ja) 1999-05-17 2008-01-09 株式会社荏原製作所 ドレッシング装置及びポリッシング装置
US6488569B1 (en) 1999-07-23 2002-12-03 Florida State University Method and apparatus for detecting micro-scratches in semiconductor wafers during polishing process
US6306008B1 (en) * 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
US6383934B1 (en) 1999-09-02 2002-05-07 Micron Technology, Inc. Method and apparatus for chemical-mechanical planarization of microelectronic substrates with selected planarizing liquids
US6306768B1 (en) 1999-11-17 2001-10-23 Micron Technology, Inc. Method for planarizing microelectronic substrates having apertures
US6313038B1 (en) 2000-04-26 2001-11-06 Micron Technology, Inc. Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates
US6387289B1 (en) 2000-05-04 2002-05-14 Micron Technology, Inc. Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6612901B1 (en) * 2000-06-07 2003-09-02 Micron Technology, Inc. Apparatus for in-situ optical endpointing of web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6875091B2 (en) * 2001-01-04 2005-04-05 Lam Research Corporation Method and apparatus for conditioning a polishing pad with sonic energy
US6554688B2 (en) * 2001-01-04 2003-04-29 Lam Research Corporation Method and apparatus for conditioning a polishing pad with sonic energy
US6722943B2 (en) 2001-08-24 2004-04-20 Micron Technology, Inc. Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces
US6666749B2 (en) * 2001-08-30 2003-12-23 Micron Technology, Inc. Apparatus and method for enhanced processing of microelectronic workpieces
US7131889B1 (en) 2002-03-04 2006-11-07 Micron Technology, Inc. Method for planarizing microelectronic workpieces
US6939203B2 (en) * 2002-04-18 2005-09-06 Asm Nutool, Inc. Fluid bearing slide assembly for workpiece polishing
US6869335B2 (en) 2002-07-08 2005-03-22 Micron Technology, Inc. Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces
US7341502B2 (en) 2002-07-18 2008-03-11 Micron Technology, Inc. Methods and systems for planarizing workpieces, e.g., microelectronic workpieces
US6860798B2 (en) 2002-08-08 2005-03-01 Micron Technology, Inc. Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces
US7094695B2 (en) 2002-08-21 2006-08-22 Micron Technology, Inc. Apparatus and method for conditioning a polishing pad used for mechanical and/or chemical-mechanical planarization
US7004817B2 (en) 2002-08-23 2006-02-28 Micron Technology, Inc. Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces
US7011566B2 (en) 2002-08-26 2006-03-14 Micron Technology, Inc. Methods and systems for conditioning planarizing pads used in planarizing substrates
US7008299B2 (en) 2002-08-29 2006-03-07 Micron Technology, Inc. Apparatus and method for mechanical and/or chemical-mechanical planarization of micro-device workpieces
US6841991B2 (en) * 2002-08-29 2005-01-11 Micron Technology, Inc. Planarity diagnostic system, E.G., for microelectronic component test systems
US7074114B2 (en) 2003-01-16 2006-07-11 Micron Technology, Inc. Carrier assemblies, polishing machines including carrier assemblies, and methods for polishing micro-device workpieces
US6884152B2 (en) 2003-02-11 2005-04-26 Micron Technology, Inc. Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces
US6872132B2 (en) 2003-03-03 2005-03-29 Micron Technology, Inc. Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces
US6864181B2 (en) * 2003-03-27 2005-03-08 Lam Research Corporation Method and apparatus to form a planarized Cu interconnect layer using electroless membrane deposition
US7367872B2 (en) * 2003-04-08 2008-05-06 Applied Materials, Inc. Conditioner disk for use in chemical mechanical polishing
US7131891B2 (en) 2003-04-28 2006-11-07 Micron Technology, Inc. Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces
US6935929B2 (en) 2003-04-28 2005-08-30 Micron Technology, Inc. Polishing machines including under-pads and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces
US7030603B2 (en) 2003-08-21 2006-04-18 Micron Technology, Inc. Apparatuses and methods for monitoring rotation of a conductive microfeature workpiece
US7648622B2 (en) 2004-02-27 2010-01-19 Novellus Systems, Inc. System and method for electrochemical mechanical polishing
US7086927B2 (en) 2004-03-09 2006-08-08 Micron Technology, Inc. Methods and systems for planarizing workpieces, e.g., microelectronic workpieces
US7066792B2 (en) 2004-08-06 2006-06-27 Micron Technology, Inc. Shaped polishing pads for beveling microfeature workpiece edges, and associate system and methods
US7033253B2 (en) 2004-08-12 2006-04-25 Micron Technology, Inc. Polishing pad conditioners having abrasives and brush elements, and associated systems and methods
DE102004061193B3 (de) * 2004-12-20 2006-07-20 Kastriot Merlaku Elektrische Handpoliermaschine für das Polieren von Fahrzeugen
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US7326105B2 (en) 2005-08-31 2008-02-05 Micron Technology, Inc. Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100302482B1 (ko) * 1998-06-23 2001-11-30 윤종용 반도체씨엠피공정의슬러리공급시스템
KR20030053375A (ko) * 2001-12-22 2003-06-28 동부전자 주식회사 초음파 발생장치를 구비한 패드 컨디셔닝 장치
KR20030096766A (ko) * 2002-06-17 2003-12-31 동부전자 주식회사 메가소닉 트랜스듀서를 이용한 슬러리 안정화 방법

Also Published As

Publication number Publication date
EP0566258A1 (en) 1993-10-20
TW197531B (enExample) 1993-01-01
US5245796A (en) 1993-09-21
DE69303109T2 (de) 1996-10-10
HK180296A (en) 1996-10-04
ES2088228T3 (es) 1996-08-01
JP2981079B2 (ja) 1999-11-22
DE69303109D1 (de) 1996-07-18
JPH068134A (ja) 1994-01-18
EP0566258B1 (en) 1996-06-12

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PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19930330

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid