JP2981079B2 - 平面状物品の研磨装置 - Google Patents

平面状物品の研磨装置

Info

Publication number
JP2981079B2
JP2981079B2 JP9844393A JP9844393A JP2981079B2 JP 2981079 B2 JP2981079 B2 JP 2981079B2 JP 9844393 A JP9844393 A JP 9844393A JP 9844393 A JP9844393 A JP 9844393A JP 2981079 B2 JP2981079 B2 JP 2981079B2
Authority
JP
Japan
Prior art keywords
polishing
slurry
wafer
polishing pad
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP9844393A
Other languages
English (en)
Japanese (ja)
Other versions
JPH068134A (ja
Inventor
エル ミラー ガブリエル
リチャード ワグナー エリック
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Publication of JPH068134A publication Critical patent/JPH068134A/ja
Application granted granted Critical
Publication of JP2981079B2 publication Critical patent/JP2981079B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP9844393A 1992-04-02 1993-04-02 平面状物品の研磨装置 Expired - Lifetime JP2981079B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US862044 1992-04-02
US07/862,044 US5245796A (en) 1992-04-02 1992-04-02 Slurry polisher using ultrasonic agitation

Publications (2)

Publication Number Publication Date
JPH068134A JPH068134A (ja) 1994-01-18
JP2981079B2 true JP2981079B2 (ja) 1999-11-22

Family

ID=25337489

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9844393A Expired - Lifetime JP2981079B2 (ja) 1992-04-02 1993-04-02 平面状物品の研磨装置

Country Status (8)

Country Link
US (1) US5245796A (enExample)
EP (1) EP0566258B1 (enExample)
JP (1) JP2981079B2 (enExample)
KR (1) KR930022483A (enExample)
DE (1) DE69303109T2 (enExample)
ES (1) ES2088228T3 (enExample)
HK (1) HK180296A (enExample)
TW (1) TW197531B (enExample)

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* Cited by examiner, † Cited by third party
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US5531861A (en) * 1993-09-29 1996-07-02 Motorola, Inc. Chemical-mechanical-polishing pad cleaning process for use during the fabrication of semiconductor devices
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US5688364A (en) * 1994-12-22 1997-11-18 Sony Corporation Chemical-mechanical polishing method and apparatus using ultrasound applied to the carrier and platen
US5591068A (en) * 1995-03-13 1997-01-07 Regents Of The University Of California Precision non-contact polishing tool
JP2647050B2 (ja) * 1995-03-31 1997-08-27 日本電気株式会社 ウェハ研磨装置
US5672095A (en) * 1995-09-29 1997-09-30 Intel Corporation Elimination of pad conditioning in a chemical mechanical polishing process
US5709593A (en) * 1995-10-27 1998-01-20 Applied Materials, Inc. Apparatus and method for distribution of slurry in a chemical mechanical polishing system
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US5915915A (en) * 1996-03-07 1999-06-29 Komag, Incorporated End effector and method for loading and unloading disks at a processing station
US5954570A (en) * 1996-05-31 1999-09-21 Kabushiki Kaisha Toshiba Conditioner for a polishing tool
US5868608A (en) 1996-08-13 1999-02-09 Lsi Logic Corporation Subsonic to supersonic and ultrasonic conditioning of a polishing pad in a chemical mechanical polishing apparatus
US6245679B1 (en) 1996-08-16 2001-06-12 Rodel Holdings, Inc Apparatus and methods for chemical-mechanical polishing of semiconductor wafers
US6210525B1 (en) 1996-08-16 2001-04-03 Rodel Holdings, Inc. Apparatus and methods for chemical-mechanical polishing of semiconductor wafers
US5932486A (en) * 1996-08-16 1999-08-03 Rodel, Inc. Apparatus and methods for recirculating chemical-mechanical polishing of semiconductor wafers
US6537137B2 (en) 1996-08-16 2003-03-25 Rodel Holdings, Inc Methods for chemical-mechanical polishing of semiconductor wafers
US6769967B1 (en) 1996-10-21 2004-08-03 Micron Technology, Inc. Apparatus and method for refurbishing polishing pads used in chemical-mechanical planarization of semiconductor wafers
US5782675A (en) * 1996-10-21 1998-07-21 Micron Technology, Inc. Apparatus and method for refurbishing fixed-abrasive polishing pads used in chemical-mechanical planarization of semiconductor wafers
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JP3130000B2 (ja) 1997-09-04 2001-01-31 松下電子工業株式会社 半導体ウェハ研磨装置及び研磨方法
US5968841A (en) * 1997-05-06 1999-10-19 International Business Machines Corporation Device and method for preventing settlement of particles on a chemical-mechanical polishing pad
US5967881A (en) * 1997-05-29 1999-10-19 Tucker; Thomas N. Chemical mechanical planarization tool having a linear polishing roller
US6036583A (en) 1997-07-11 2000-03-14 Applied Materials, Inc. Conditioner head in a substrate polisher and method
US5904615A (en) * 1997-07-18 1999-05-18 Hankook Machine Tools Co., Ltd. Pad conditioner for chemical mechanical polishing apparatus
DE19737849A1 (de) * 1997-08-29 1999-03-11 Siemens Ag Vorrichtung und Verfahren zum Beheizen eines flüssigen oder zähflüssigen Poliermittels sowie Vorrichtung zum Polieren von Wafern
US5957754A (en) * 1997-08-29 1999-09-28 Applied Materials, Inc. Cavitational polishing pad conditioner
TW404876B (en) * 1997-09-26 2000-09-11 Siemens Ag Process for chemical-mechanical planarization and equipment for performing said process
US5916010A (en) * 1997-10-30 1999-06-29 International Business Machines Corporation CMP pad maintenance apparatus and method
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JPH11277434A (ja) * 1998-03-30 1999-10-12 Speedfam Co Ltd Ｃｍｐ装置のスラリリサイクルシステム及びその方法
US6200199B1 (en) 1998-03-31 2001-03-13 Applied Materials, Inc. Chemical mechanical polishing conditioner
US6024829A (en) * 1998-05-21 2000-02-15 Lucent Technologies Inc. Method of reducing agglomerate particles in a polishing slurry
KR100302482B1 (ko) * 1998-06-23 2001-11-30 윤종용 반도체씨엠피공정의슬러리공급시스템
US6106374A (en) * 1998-07-16 2000-08-22 International Business Machines Corporation Acoustically agitated delivery
US6179693B1 (en) * 1998-10-06 2001-01-30 International Business Machines Corporation In-situ/self-propelled polishing pad conditioner and cleaner
US6464571B2 (en) 1998-12-01 2002-10-15 Nutool, Inc. Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein
US6589105B2 (en) 1998-12-01 2003-07-08 Nutool, Inc. Pad tensioning method and system in a bi-directional linear polisher
US6468139B1 (en) 1998-12-01 2002-10-22 Nutool, Inc. Polishing apparatus and method with a refreshing polishing belt and loadable housing
US7425250B2 (en) * 1998-12-01 2008-09-16 Novellus Systems, Inc. Electrochemical mechanical processing apparatus
US6103628A (en) 1998-12-01 2000-08-15 Nutool, Inc. Reverse linear polisher with loadable housing
JP4030247B2 (ja) 1999-05-17 2008-01-09 株式会社荏原製作所 ドレッシング装置及びポリッシング装置
US6488569B1 (en) 1999-07-23 2002-12-03 Florida State University Method and apparatus for detecting micro-scratches in semiconductor wafers during polishing process
US6306008B1 (en) * 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
US6383934B1 (en) 1999-09-02 2002-05-07 Micron Technology, Inc. Method and apparatus for chemical-mechanical planarization of microelectronic substrates with selected planarizing liquids
US6306768B1 (en) 1999-11-17 2001-10-23 Micron Technology, Inc. Method for planarizing microelectronic substrates having apertures
US6313038B1 (en) 2000-04-26 2001-11-06 Micron Technology, Inc. Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates
US6387289B1 (en) 2000-05-04 2002-05-14 Micron Technology, Inc. Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6612901B1 (en) * 2000-06-07 2003-09-02 Micron Technology, Inc. Apparatus for in-situ optical endpointing of web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6875091B2 (en) * 2001-01-04 2005-04-05 Lam Research Corporation Method and apparatus for conditioning a polishing pad with sonic energy
US6554688B2 (en) * 2001-01-04 2003-04-29 Lam Research Corporation Method and apparatus for conditioning a polishing pad with sonic energy
US6722943B2 (en) 2001-08-24 2004-04-20 Micron Technology, Inc. Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces
US6666749B2 (en) * 2001-08-30 2003-12-23 Micron Technology, Inc. Apparatus and method for enhanced processing of microelectronic workpieces
KR20030053375A (ko) * 2001-12-22 2003-06-28 동부전자 주식회사 초음파 발생장치를 구비한 패드 컨디셔닝 장치
US7131889B1 (en) 2002-03-04 2006-11-07 Micron Technology, Inc. Method for planarizing microelectronic workpieces
US6939203B2 (en) * 2002-04-18 2005-09-06 Asm Nutool, Inc. Fluid bearing slide assembly for workpiece polishing
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US6869335B2 (en) 2002-07-08 2005-03-22 Micron Technology, Inc. Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces
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US7004817B2 (en) 2002-08-23 2006-02-28 Micron Technology, Inc. Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces
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US6841991B2 (en) * 2002-08-29 2005-01-11 Micron Technology, Inc. Planarity diagnostic system, E.G., for microelectronic component test systems
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Also Published As

Publication number Publication date
EP0566258A1 (en) 1993-10-20
TW197531B (enExample) 1993-01-01
US5245796A (en) 1993-09-21
DE69303109T2 (de) 1996-10-10
HK180296A (en) 1996-10-04
ES2088228T3 (es) 1996-08-01
KR930022483A (ko) 1993-11-24
DE69303109D1 (de) 1996-07-18
JPH068134A (ja) 1994-01-18
EP0566258B1 (en) 1996-06-12

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