KR930022255A - 투명도전막 배선기판의 제조방법 - Google Patents

투명도전막 배선기판의 제조방법 Download PDF

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Publication number
KR930022255A
KR930022255A KR1019930006973A KR930006973A KR930022255A KR 930022255 A KR930022255 A KR 930022255A KR 1019930006973 A KR1019930006973 A KR 1019930006973A KR 930006973 A KR930006973 A KR 930006973A KR 930022255 A KR930022255 A KR 930022255A
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South Korea
Prior art keywords
transparent conductive
conductive film
manufacturing
wiring board
substrate
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KR1019930006973A
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English (en)
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KR0128687B1 (ko
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유끼오 오가와
다쓰오 야마우라
마모루 나미가와
아끼라 이노우에
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호소야 레이지
후다바 덴시 고오교오 가부시끼가이샤
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Publication of KR930022255A publication Critical patent/KR930022255A/ko
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Publication of KR0128687B1 publication Critical patent/KR0128687B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/55—Working by transmitting the laser beam through or within the workpiece for creating voids inside the workpiece, e.g. for forming flow passages or flow patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1343—Electrodes
    • G02F1/13439—Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
    • H01J2211/20—Constructional details
    • H01J2211/22—Electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Laser Beam Processing (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

투명도전막 배선기판의 제조방법을 건식으로 하여 제조공정의 간략화를 도모하는 것으로, (a)기판(1)에 SiO2층(2)을 설치하고, (b)SiO2층(2)위에 흑색 ITO막(3)을 형성하고, (c)흑색 ITO막(3)을 출력호온(4)으로 부터 방출하는 레이저로 가공하고 레이저로 증발한 금속은 진공흡인헤드(5)가 흡인하고, (d)소망의 배선패턴으로 절단하며, (e)기판(1)을 소성하여 배선패턴의 흑색 ITO막(3)을 산화·결정화시켜 배선패턴의 투명 ITO막(6)을 얻는다.

Description

투명도전막 배선기판의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 1실시예의 제조공정도.
제2도는 투명 ITO막과 흑색 ITO막의 적외분광 투과율을 도시하는 그래프

Claims (5)

  1. 기판표면에 금속박막을 피착시켜서 투명도전막을 형성시키는 공정과 상기 투명 도전막을 레이저 가공기에 의해 패턴 가공하는 공정을 갖는 것을 특징으로 하는 투명도전막 배선기판의 제조방법.
  2. 절연성과 투광성을 가지는 기판표면에 Sn을 도우프한 In2O3인 흑색 ITO막을 형성하는 공정과 상기 흑색ITO막을 레이저에 의해 배선패턴으로 가공하는 공정과, 상기 기판을 대기중에서 소성시켜 상기 흑색 ITO막을 투명 ITO막으로 형성하는 공정을 특징으로 하는 투명도전막 배선기판의 제조방법.
  3. 제1항 또는 제2항에 있어서, 상기 기판이 표면에 SiO2를 피착시킨 유리 기판인 것을 특징으로 하는 투명도전막 배선기판의 제조방법.
  4. 제1항에 있어서, 배선패턴에 가공된 상기흑색 ITO막 이외의 기판상에 절연층을 피착한 후에, 상기 기판을 대기중에서 소성하는 공정을 갖는 것을 특징으로 하는 투명도전막 배선기판의 제조방법.
  5. 제1항에 있어서, 상기 배선패턴을 가공하는 공정에 있어서 레이저에 의해 증발시킨 상기 흑색 ITO막의 금속을 레이저 가공기의 제거수단으로 제거하는 것을 특징으로 하는 투명도전막 배선기판의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930006973A 1992-04-27 1993-04-26 투명도전막 배선기판의 제조방법 KR0128687B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4107945A JP2581373B2 (ja) 1992-04-27 1992-04-27 透明導電膜配線基板の製造方法
JP92-107945 1992-04-27

Publications (2)

Publication Number Publication Date
KR930022255A true KR930022255A (ko) 1993-11-23
KR0128687B1 KR0128687B1 (ko) 1998-04-15

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Country Status (4)

Country Link
US (1) US5536466A (ko)
JP (1) JP2581373B2 (ko)
KR (1) KR0128687B1 (ko)
FR (1) FR2690597B1 (ko)

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KR20020032883A (ko) * 2000-10-27 2002-05-04 한기관 마킹용 레이저를 이용한 투명 아이티오 전극 패턴 제작 방법

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Also Published As

Publication number Publication date
US5536466A (en) 1996-07-16
FR2690597B1 (fr) 1997-07-04
JPH05303916A (ja) 1993-11-16
JP2581373B2 (ja) 1997-02-12
KR0128687B1 (ko) 1998-04-15
FR2690597A1 (fr) 1993-10-29

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